An interface material comprising a resin mixture and at least one
solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be
silicone-based comprising one or more compounds such as vinyl
silicone, vinyl Q resin,
hydride functional
siloxane and
platinum-vinylsiloxane. The
solder material may comprise any suitable
solder material, such as
indium, silver,
copper, aluminum and alloys thereof, silver coated
copper, and silver coated aluminum, but it is preferred that the solder material comprise
indium or
indium-based compounds and / or alloys. The interface material, or
polymer solder, has the capability of enhancing heat dissipation in high power
semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at
room temperature or elevated temperature. It can be also formulated as a highly compliant, cured, tacky elastomeric film or sheet for other interface applications where it can be preapplied, for example on heat sinks, or in any other interface situations.