32results about How to "Peel strength" patented technology

Provided is a method for manufacturing a printed wiring board, which can enhance the peel strength between an insulating layer and a conductive pattern by a two-step process, that is, a semi-hardening and full-hardening of the insulating layer. In the method for manufacturing the printed wiring board having one or more layers of a conductive pattern and an insulating pattern, an insulating pattern is formed on an insulating substrate, and at least one of the insulating substrate and the insulating pattern is semi-hardened. A conductive pattern is formed on the insulating substrate and/or the insulating pattern, thereby providing a stack structure. Then, a thermal treatment is performed on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern, and the conductive pattern is fired.

A peelable sealing structure includes a sealing layer and one or more optional additional layers. The peelable sealing structure includes a sealing surface that is formable into a peelable seal upon contact with a sealing substrate at all temperatures in a peelable seal temperature range. Moreover, the peelable sealing structure comprises a thermoplastic polymer and an additive dispersed within at least a portion of the thermoplastic polymer with the peelable sealing structure defining the sealing surface.

The present invention has a main object to provide a transparent conductive heat sealing material of which antistatic property does not deteriorates even at a low humidity, and has a transparency to an extent of permitting visual recognition of the contents and a carrier tape lid using the same. To achieve this object, the transparent conductive heat sealing material of the invention is characterized by a heat-sealable synthetic resin, and conductive fine particle having a 50% particle size of up to 1.0 mum.

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 μm to 1.0 μm, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a producing method thereof, wherein a roughened layer of the copper foil can be improved to enhance the adhesiveness between the copper foil and a resin.

An aqueous composition is essentially free of organic solvents, plasticizers and additional tackifiers and contains water and 20-99% by weight of a polymer and 1-80% by weight of a filler, the percentages by weight being based on the sum of the components of the aqueous composition, with the exception of water.

An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.

Provided is a PSA sheet capable of providing reliable adhesion even upon exposure to cosmetics, chemicals and the like containing polar compounds. The PSA sheet provided by this invention has a PSA layer comprising a polyester-based polymer. The PSA sheet has a 180° peel strength of 1 N/5 mm or greater after ethanol immersion.

A nonaqueous electrolyte secondary battery includes a positive electrode, a negative electrode having, on a surface thereof, a negative electrode mixture layer containing a negative electrode active material, a thickening agent and a binder, and a separator. The positive electrode and the negative electrode are coiled together with the separator therebetween. The negative electrode active material has an average particle size of at least 5 μm and not more than 20 μm and has a fines content, defined as the cumulative frequency of the negative electrode active material having a particle size of 3 μm or less, of at least 10% and not more than 50%. The thickening agent has a 1.0% aqueous solution viscosity of at least 4,980 mPa·s. The negative electrode mixture layer is in an unpressed state.

A nut is caulked and fixed to a plate material and a protrusion at an end of a collar is press-fitted into a recessed groove generated on the opposite surface of the plate material at the time of the caulking fixation, thereby fixing the nut and the collar to both surfaces of the plate material, respectively. The plate material is, for example, a metal panel, and the nut is, for example, a pierce nut. Since the collar is caulked and fixed, thermal strain is not generated.