Variable-gradient fractal lattice sandwiched reinforcement phase change heat sink

Abstract

The invention discloses a variable-gradient fractal lattice sandwiched reinforcement phase change heat sink and aims to provide an efficient phase change heat sink which is high in heat exchange efficiency, has certain universality and can be developed in a serialization mode. The variable-gradient fractal lattice sandwiched reinforcement phase change heat sink is realized according to the following technical scheme: reinforcement heat transfer structures are distributed in a phase change heat sink shell in an array; each variable-gradient fractal lattice sandwiched unit takes a variable-gradient V structure as a first-stage reinforcement heat transfer structure (4) according to the heat transfer and heat exchange characteristics of the phase change heat sink; on this basis, at variable-gradient V-shaped ends of the first-stage reinforcement heat transfer structures, the variable-gradient V structures in the same shape are gradually increased to form multiple stages of reinforcement heat transfer structures, and the specific surface areas of the multiple stages of reinforcement heat transfer structures are multiplied in sequence; the first-stage reinforcement heat transfer structures can transfer heat to an area far away from a heat radiation bottom plate rapidly in a reinforcement mode, and the second-stage reinforcement heat transfer structures (5) and the third-stage reinforcement heat transfer structures can transfer heat to phase change material far away from the heat radiation bottom plate rapidly to complete heat exchange.

Description

technical field [0001] The invention relates to the technical field of thermal control of electronic equipment, and is mainly used for instantaneous, short-term or periodic heat dissipation control of electronic equipment in the fields of aviation, aerospace, communication, etc., and aims to improve the comprehensive heat exchange efficiency of phase change heat sinks. Background technique [0002] As the power of electronic components increases, thermal control design plays a very important role in ensuring the normal operation of electronic components. Electronic equipment is faced with many restrictions in the work, such as very harsh working environment, confined space, unable to supply air and liquid cooling, volume and weight restrictions, insufficient heat sink capacity, external pneumatic heating and other harsh conditions, especially when working in elastic The electronic equipment in the middle and end of the loading platform itself faces a higher initial temperatu...

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Problems solved by technology

[0007] All the enhanced heat transfer structures (fins, fins, wire mesh, foam or mesh) in the above technical solutions are evenly distributed in the heat sink package, and have the same specific surface area per unit volume (the surface area of ​​the enhanced heat transfer structure per unit volume ), so as to have the same heat transfer and heat dissipation heat exchange capacity, close to image 3 The utilization rate of the enhanced heat transfer material shown in the thermal diffusion bottom plate 7 is high, and the utilization rate of the enhanced heat transfer material far away from the thermal diffusion bottom plate 7) is low, and the heat cannot be uniformly and efficiently conducted to all phases in the phase change heat sink during the working process. Among the phase change materials, the phase change of phase change materials at different positions has obvious time difference, so the improvement of its comprehensive heat transfer efficiency is greatly limited.

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