This invention relates to the field of conductive filler technology for electronic pastes, and discloses a microfluidic-modified high-level hydrophobic nano-silver
powder, its preparation method, and its application. The silver
powder is composed of Ag-CNT composite silver
powder and nano-sheet silver powder, with the former serving as a conductive framework and the latter as a filler and binder. The preparation method utilizes a microfluidic reactor to achieve laminar shear mixing, fully preserving the
aspect ratio structure of carbon nanotubes.
Surface modification is performed using aminosilanes as
coupling agents and amines as catalysts to form a
coating layer grafted with Ag-O-Si covalent bonds. The mixture is purified by
water washing to neutrality and then dried and cured at low temperature, effectively removing residual impurities and improving
dispersion stability and hydrophobicity. When used in TOPCon battery conductive
silver paste, the prepared silver powder can be sintered at a low temperature of 720-760℃, achieving <20μm
fine line printing with a grid line resistivity ≤3.5×10⁻⁶. ‑6 With an
aspect ratio of ≥0.5 and Ω·cm, it possesses advantages such as
high conductivity, high leveling, high stability, and energy saving, making it suitable for the green and intelligent manufacturing needs of high-efficiency solar cells.