The invention discloses a P type transverse double-dispersion MOS pipe capable of reducing conduction resistance, and belongs to the technical field of semiconductor devices. The P type transverse double-dispersion MOS pipe capable of reducing conduction resistance comprises a P type substrate, an N embedded layer, a P type epitaxial layer, a first active area, a second active area, a third active area, a fourth active area, a fifth active area, field areas arranged between the active areas, a deep N trap, a shallow P trap, an N+ injection diffusion area, a shallow N trap, P+ injection diffusion area, and a P type injection layer which is between the shallow P trap and a back gate N trap area. With the adoption of the P type transverse double-dispersion MOS pipe, the conduction resistance is reduced while pressure resistance is ensured, and moreover, the area of a device is reduced.