UV laser drilling method for preparing blind holes controllable in taper

A laser drilling and taper technology, used in laser welding equipment, manufacturing tools, welding equipment, etc., can solve the problems of blind hole taper and difficult quality control.

Inactive Publication Date: 2016-03-30
AKM ELECTRONICS TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the existing UV laser drilling technology, the existing preparation method has the problems of blind hole taper and difficult quality control

Method used

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  • UV laser drilling method for preparing blind holes controllable in taper
  • UV laser drilling method for preparing blind holes controllable in taper

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Embodiment Construction

[0008] The present invention will be further described below in conjunction with accompanying drawing.

[0009] as the picture shows:

[0010] A method for preparing a blind hole with a controllable taper by UV laser drilling of the present invention comprises the following steps:

[0011] 1. The laser beam scans along a certain trajectory within the set aperture range. Each micro via hole is formed in two steps. By adjusting the energy, defocus amount and spot size of each step parameter, a blind with controllable taper is prepared. hole.

[0012] 2. The energy distribution of the laser beam is Gaussian distribution, the energy at the center of the beam focus is the largest, and the energy at the edge is relatively small.

[0013] 3. The diameter of the formed hole is related to the set aperture and the set value of the light spot. When the set value of the light spot is the actual spot size at the focus of the beam, the set aperture size is consistent with the target apert...

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Abstract

The invention provides a UV laser drilling method for preparing blind holes controllable in taper in a printed circuit board. A laser beam scans needed micro-guide through holes in the surface of a workpiece within the set aperture range along a certain track. Each micro-guide through hole is molded through two steps, the blind holes controllable in taper are prepared by adjusting the energy, defocusing amount and light spots of each step of parameters, and the problem that the taper and quality of the blind holes can not be easily controlled through an existing preparation method is effectively solved.

Description

technical field [0001] The invention relates to a method for preparing blind holes with controllable taper by UV laser drilling, which relates to a substrate drilling method, in particular to a blind hole drilling method with controllable dimensions. Background technique [0002] With the continuous development of industrial technology, the precision requirements for workpieces are also getting higher and higher. For the existing UV laser drilling technology, the existing preparation method has the problems of blind hole taper and difficult quality control. In order to solve this problem, the existing laser drilling technology needs to be improved. Contents of the invention [0003] In order to solve the above problems, the present invention provides a method for preparing blind holes with controllable taper by UV laser drilling. [0004] The invention discloses a method for preparing blind holes with controllable taper by UV laser drilling, which comprises the following...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/386B23K26/384
Inventor 伍淼
Owner AKM ELECTRONICS TECH SUZHOU
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