Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer

a technology of structured metal and substrate body, which is applied in the direction of conductive pattern formation, transportation and packaging, chemical instruments and processes, etc., can solve the problems of insufficient thickness between metal foil and substrate body, insufficient structure metal foil, and high electrical resistance of pastes, etc., to achieve simple and time-saving effects
US20050034995A1Inactive Publication Date: 2005-02-17INFINEON TECH AG
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
INFINEON TECH AG
Publication Date
2005-02-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.
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Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation of International Patent Application Serial No. PCT / DE02 / 03305, filed Sep. 5, 2002, which published in German on Apr. 3, 2003 as WO 03 / 028416, and is incorporated herein by reference in its entirety.FIELD OF THE INVENTION

[0002] The invention relates to a process for producing a structured metal layer on a substrate body, and to a substrate body produced using this process. BACKGROUND OF THE INVENTION

[0003] Structured metal layers are required, for example, in printed-circuit boards, in chip cards operated without contact, in RFID tags or in other substrates in which various electrical components are to be electrically connected to one another. There are various processes which can be used to produce structured metal layers at greater or lesser cost and in a shorter or longer time. In particular, it is a regular objective for the structured metal layers to have low electrical resistances and, in the cas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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