Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer

a technology of structured metal and substrate body, which is applied in the direction of conductive pattern formation, transportation and packaging, chemical instruments and processes, etc., can solve the problems of insufficient thickness between metal foil and substrate body, insufficient structure metal foil, and high electrical resistance of pastes, etc., to achieve simple and time-saving effects

Inactive Publication Date: 2005-02-17
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0012] The invention is based on an object of providing a different process for producing a metal layer on a substrate body, i

Problems solved by technology

Apart from high production costs, this procedure has the drawback that the bonding between metal foil and substrate body is insufficient, and the structured metal foil can become detached.
These pastes have the drawback of often having high electrical resistances and of being expensive if the conductive paste contains conductive silver particles.
However, this procedure is unsuitable for production in large numbers, since a multiplicity of p

Method used

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  • Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer
  • Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer

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Embodiment Construction

[0038]FIG. 1A illustrates, in excerpt and sectional form, a substrate body 10, to the surface 12 of which, in a first process step, an at least partially structured bonding layer 14, for example comprising an adhesive, resist or the like, has been applied. The substrate body 10 may consist, for example, of plastic, metal, ceramic, glass or any other desired material. Then, a metal foil 16 is applied to the entire surface of the substrate body 10 which has been provided with the structured bonding layer 14. The metal foil 16 is fixed to the surface 12 of the substrate body 10 with the aid of the structured bonding layer 14.

[0039] After the metal foil 16 has been fixed, those regions of the metal foil 16 which are not joined to the bonding layer—i.e. which lie laterally next to the structured layer of adhesive 14—are mechanically removed from the substrate body 10, which can be effected, for example, by brushing them off. The configuration of the substrate body following this step is...

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Abstract

Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] This application is a continuation of International Patent Application Serial No. PCT / DE02 / 03305, filed Sep. 5, 2002, which published in German on Apr. 3, 2003 as WO 03 / 028416, and is incorporated herein by reference in its entirety.FIELD OF THE INVENTION [0002] The invention relates to a process for producing a structured metal layer on a substrate body, and to a substrate body produced using this process. BACKGROUND OF THE INVENTION [0003] Structured metal layers are required, for example, in printed-circuit boards, in chip cards operated without contact, in RFID tags or in other substrates in which various electrical components are to be electrically connected to one another. There are various processes which can be used to produce structured metal layers at greater or lesser cost and in a shorter or longer time. In particular, it is a regular objective for the structured metal layers to have low electrical resistances and, in the cas...

Claims

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Application Information

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IPC IPC(8): H05K3/04H05K3/10
CPCH05K3/046Y10T428/24917H05K3/102
Inventor GUNDLACH, HARALDMULLER-HIPPER, ANDREASSIMMERLEIN-ERLBACHER, EWALD
Owner INFINEON TECH AG
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