Control method for laser drilling contraposition accuracy of high-density lamination circuit board

Abstract

The invention relates to a positioning precision control method in laser boring on high density accumulation layer circuit board. The method comprises: a, making a circuit board, and disposing an electronic circuit layer at least on one side; b, forming a medium layer on the surface of the electronic circuit; c, positioning the bores on the circuit board with medium layer using X ray boring equipment by a target positioning drill; d, forming laser blind bore positioning bore on the circuit board by mechanical boring after positioning the bores by the target positioning drill; e, drilling blind bores on the circuit board using the laser blind bore positioning bore as reference. The method in the invention can align the centers of the mechanical through bore and the laser blind bore of the high density accumulation layer circuit board, can effectively improve the positioning precision of the high density accumulation layer circuit board, and achieves the advantages of simple processing technology, short time and no deformation of the circuit board in processing, and needs no positioning figure in drilling blind bore by etching laser.

Description

【Technical field】 [0001] The invention relates to a processing method of an electronic circuit board, in particular to a method for controlling alignment accuracy of laser drilling of a high-density laminated circuit board. 【Background technique】 [0002] At present, electronic products are becoming more and more light, small, and thin, which also makes consumer electronic products more and more integrated. As a high-density laminated circuit board widely used in electronic products, its signal transmission lines and via holes are becoming more and more dense, the spacing and density of wires and the aperture of via holes are getting smaller and smaller, and the alignment accuracy requirements are getting higher and higher. The higher it is, the more difficult it is to process the alignment accuracy of high-density laminates. In the production process of high-density laminated circuit boards, the requirements for alignment accuracy are very strict, but due to the complicate...

AI Technical Summary

Problems solved by technology

Due to the inconsistency of the alignment center, this method of using the sub-outer layer alignment will lead to inconsistency in the alignment of the mechanical through hole and the laser blind hole, which will affect the alignment accuracy of the high-density laminated circuit board.

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