Control method for laser drilling contraposition accuracy of high-density lamination circuit board

A technology of alignment accuracy and laser drilling, which is applied in multilayer circuit manufacturing, laser welding equipment, printed circuit manufacturing, etc. The problems of blind hole alignment are not uniform, so as to reduce the error, shorten the processing time and simplify the production process.

Active Publication Date: 2009-07-29
SHENZHEN WUZHU TECH
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AI Technical Summary

Problems solved by technology

Due to the inconsistency of the alignment center, this method of using the sub-outer layer alignment will lead to inconsistency in the alignmen

Method used

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  • Control method for laser drilling contraposition accuracy of high-density lamination circuit board
  • Control method for laser drilling contraposition accuracy of high-density lamination circuit board
  • Control method for laser drilling contraposition accuracy of high-density lamination circuit board

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Embodiment Construction

[0022] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.

[0023] Referring to Figures 1 to 5, the alignment accuracy control method of laser drilling of a high-density laminated circuit board of the present invention is to keep the alignment center of the mechanical through hole of the high-density laminated circuit board consistent with the alignment center of the laser blind hole, so that The control method for controlling the alignment accuracy of drilling comprises the following steps:

[0024] a. First, make a circuit board according to the conventional method, which is provided with a layer of electronic circuit on at least one side. The circuit board can be a single-sided or double-sided board, and the single-sided or double-sided board can be a single-layer, double-layer or multi-layer board, as shown in Figure 1, in this embodiment, the circuit board 10 is a doubl...

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Abstract

The invention relates to a positioning precision control method in laser boring on high density accumulation layer circuit board. The method comprises: a, making a circuit board, and disposing an electronic circuit layer at least on one side; b, forming a medium layer on the surface of the electronic circuit; c, positioning the bores on the circuit board with medium layer using X ray boring equipment by a target positioning drill; d, forming laser blind bore positioning bore on the circuit board by mechanical boring after positioning the bores by the target positioning drill; e, drilling blind bores on the circuit board using the laser blind bore positioning bore as reference. The method in the invention can align the centers of the mechanical through bore and the laser blind bore of the high density accumulation layer circuit board, can effectively improve the positioning precision of the high density accumulation layer circuit board, and achieves the advantages of simple processing technology, short time and no deformation of the circuit board in processing, and needs no positioning figure in drilling blind bore by etching laser.

Description

【Technical field】 [0001] The invention relates to a processing method of an electronic circuit board, in particular to a method for controlling alignment accuracy of laser drilling of a high-density laminated circuit board. 【Background technique】 [0002] At present, electronic products are becoming more and more light, small, and thin, which also makes consumer electronic products more and more integrated. As a high-density laminated circuit board widely used in electronic products, its signal transmission lines and via holes are becoming more and more dense, the spacing and density of wires and the aperture of via holes are getting smaller and smaller, and the alignment accuracy requirements are getting higher and higher. The higher it is, the more difficult it is to process the alignment accuracy of high-density laminates. In the production process of high-density laminated circuit boards, the requirements for alignment accuracy are very strict, but due to the complicate...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/46B23K26/38B23K26/02B23K26/386
Inventor 张国庆唐道福
Owner SHENZHEN WUZHU TECH
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