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860results about How to "Lower unit cost" patented technology

High density methods for producing diode-pumped micro lasers

A miniaturized laser package is provided comprising a standard semiconductor laser package modified to accept a solid state microchip assembly pumped by the diode laser. Standard packages described in the invention include TO and HHL packages all of which are characterized by small dimensions, well sealed housing, robust mounting features, known characterized materials and economical production and assembly techniques characteristic of the semiconductor processing industry. In particular, the microchip lasers are produced using high density techniques that lend themselves to mass production, resulting in very low unit costs. At the same time, the compact laser devices provide a solution to the problem of providing laser radiation at high beam quality and good reliability features with a variety of wavelengths and operational characteristics and low noise features not available from diode lasers yet relying primarily on standardized designs, materials and techniques common to diode laser manufacturing. The devices constructed according to methods taught by the invention can therefore be readily integrated into numerous applications where power, reliability and performance are at a premium but low cost is essential, eventually replacing diode lasers in many existing systems but also enabling many new commercial, biomedical, scientific and military systems.
Owner:SNAKE CREEK LASERS

Wafer bonded pressure sensor

A pressure sensor (30) for sensing a fluid pressure in harsh environments such as the air pressure in a tire, by using a first wafer substrate (32) with a front side and an opposing back side, a chamber (58) partially defined by a flexible membrane (50) formed on the front side and at least one hole (33) etched from the back side to the chamber (58);
    • a second wafer (31) on the back side of the first wafer (32) to seal the at least one hole (33); wherein,
    • the chamber (58) containing a fluid at a reference pressure, such that the flexible membrane (50) deflects due to pressure differentials between the reference pressure and the fluid pressure; and,
    • associated circuitry (34) for converting the deflection of the flexible membrane (50) into an output signal indicative of the fluid pressure; wherein,
    • the second wafer (31) is wafer bonded to the first wafer substrate (32). Wafer bonding offers an effective non-adhesive solution. It provides a hermetic seal with only minor changes to the fabrication procedure. Skilled workers in this field will readily understand that the most prevalent forms of wafer bonding are: direct wafer, or silicon fusion, bonding; anodic, or electrostatic Mallory process bonding; and, intermediate layer bonding.
Owner:PRECISION MECHATRONICS
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