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137 results about "Ceiling temperature" patented technology

Ceiling temperature (Tc) is a measure of the tendency of a polymer to revert to its constituent monomers. When a polymer is at its ceiling temperature, the rate of polymerization and depolymerization of the polymer are equal. Generally, the ceiling temperature of a given polymer is correlated to the steric hindrance of the polymer’s monomers. Polymers with high ceiling temperatures are often commercially useful.

Constant temperature cabinet for accumulator and temperature-controlling method thereof

The invention relates to a thermotank and a temperature control method thereof, in particular to a thermotank of a storage battery and a temperature control method thereof. The thermotank comprises a thermotank body, heating and refrigerating components and a controller; the heating and refrigerating components comprise an air course outside the thermotank, an air course inside the thermotank, a radiator of the air course outside the thermotank, a radiator of the air course inside the thermotank, an air inlet door, an air outlet door, a ventilator of the air course outside the thermotank, a ventilator of the air course inside the thermotank, a cold clapboard and a hot clapboard as well as a semiconductor refrigerating device and a semiconductor heating device. When the temperature inside the thermotank is higher than the ceiling temperature for constant-temperature starting, then the temperature outside the thermotank is judged; if the temperature outside the thermotank is higher than the refrigerating starting temperature, then the refrigerating function is started; if the temperature outside the thermotank is lower than the refrigerating starting temperature, the ventilation is carried out; when the temperature inside the thermotank is lower than the floor temperature for constant-temperature starting, then the working condition is opposite. The invention is used for movable communication bases, uninterruptible power supply, and the like and has the advantages of automatic temperature control and regulation, energy saving, safety and convenient operation.
Owner:南京科迅科技有限公司 +1

Preparation method and product of low-roughness polyimide film and application of product

The invention discloses a preparation method and a product of a low-roughness polyimide film and application of the product. The preparation method comprises four steps, including synthesis and treatment of polyamide acid, curtain coating, pre-drying of the film and imidization, and the preparation method comprises the following concrete steps: taking biphenyl diamine and dianhydride as polyamide acid synthesizing monomers; controlling the temperature of a curtain coating substrate to be above 30 DEG C before film formation; drying and imidizing the film by adopting a programmable temperature increment mode, wherein the highest drying temperature is 130 DEG C; the highest imidization temperature is not lower than 450 DEG C. The prepared polyimide film is flat in surface, smaller than or equal to 10nm in surface roughness, larger than 300MPa in tensile strength, larger than 330 DEG C in glass-transition temperature, smaller than 1% in thermal shrinkage rate and smaller than 20ppm / DEG C in thermal expansion coefficient (CTE). The preparation method disclosed by the invention is safe in overall technological process, free of use of expensive equipment, simple in operation procedures and easy in control on surface appearance of the film.
Owner:CHINA LUCKY FILM CORP

CFD simulation and system simulation model combination based airplane cabin environment control method

InactiveCN105260518AOvercoming the limitations of settingsAccurately obtain the temperature valueGeometric CADDesign optimisation/simulationHuman bodyControl system
The invention discloses a CFD simulation and system simulation model combination based airplane cabin environment control method. Mainly, an airplane environment control system simulation model and an airplane cabin heat environment CFD model are subjected to combined simulation to accurately obtain temperature field parameters of all points in an airplane cabin space under the control of an airplane environment control system, wherein the temperature field parameters include a temperature value around personnel taking an airplane under dynamic control regulation, so that the limitation problem in position setting of a temperature sensor in the prior art is solved. By fitting temperature change of a ceiling temperature feedback point with temperature change around the personnel taking the airplane, the temperature around the personnel taking the airplane can be quickly obtained, and the timeliness of control and the accuracy of control effect are improved; and meanwhile, the optimization control is equivalent to the control on the temperature around a human body, so that the heat comfort level of the personnel taking the airplane is improved and the problems of high error of control on a heat environment in an airplane cabin and incapability of ensuring heat comfort of the personnel in the prior art are solved.
Owner:TIANJIN UNIV

Network chip temperature optimization method applied to two-dimensional grid structure piece

The invention relates to a network chip temperature optimization method applied to a two-dimensional grid structure piece. The network chip temperature optimization method includes the following steps that 1, the relation between the communication task load among all inner cores and the temperature is worked out by inputting chip parameters and conducting formula computing to serve as the relation equation for calculating the temperature of the chip; 2, path distribution of communication tasks among all the inner cores is conducted by the adoption of a greedy algorithm, the chip temperature caused by the path distribution scheme serves as the ceiling temperature in the optimizing process; 3, all possible shortest paths are distributed to the communication tasks to be combined to different path distribution schemes, and the computing amount is reduced by weeding out the path distribution schemes which cannot meet the constrain conditions while path distribution is conducted; 4, the path distribution scheme of the minimum temperature value is used as the optimized result by computing the chip temperature of the path distribution scheme stored when the last communication task is distributed. According to the network chip temperature optimization method, the lower chip temperature is obtained without changing the chip performance, more communication tasks are made to use the communication paths higher in heat dissipation efficiency, and thus the temperature of the chip is reduced.
Owner:SHANGHAI INFOTM MICROELECTRONICS
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