Li2O-Al2O3-SiO2-B2O3, CaO-Al2O3-SiO2-B2O3 crystallizable glass low-temperature co-fired composite material and preparation method thereof

A composite material and low-temperature co-firing technology, which is applied in the field of electronic packaging materials, can solve the problems of difficulty in achieving complete crystallization, unfavorable sintering densification, and high dielectric loss, and achieve high densification, low thermal expansion coefficient, and low dielectric loss. Effect

Inactive Publication Date: 2013-01-30
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, complete crystallization during sintering is difficult to achieve for crystallizable glasses
Li remaining in the glass 2 O may cause excessive dielectric loss
In addition, crystallization during sintering of low softening point glass has adverse effects on sintering densification
Based on the above reasons, Li 2 O-Al 2 o 3 -SiO 2 -B 2 o 3 Glass has not yet been used in LTCC materials

Method used

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  • Li2O-Al2O3-SiO2-B2O3, CaO-Al2O3-SiO2-B2O3 crystallizable glass low-temperature co-fired composite material and preparation method thereof
  • Li2O-Al2O3-SiO2-B2O3, CaO-Al2O3-SiO2-B2O3 crystallizable glass low-temperature co-fired composite material and preparation method thereof
  • Li2O-Al2O3-SiO2-B2O3, CaO-Al2O3-SiO2-B2O3 crystallizable glass low-temperature co-fired composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] In specific embodiments of the present invention,

[0023] Li in the composite 2 O-Al 2 o 3 -SiO 2 -B 2 o 3 Crystallizable glass and CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The crystallizable glass is based on the total weight composition of the composite material, and its composition is as follows:

[0024]

[0025] The preparation method of the low-temperature co-fired material in this embodiment comprises the following steps:

[0026] (1) Preparation of raw materials for crystallizable glass: press Li 2 O-Al 2 o 3 -SiO 2 -B 2 o 3 Glass and CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The mass percent content of each oxide required for glass is taken by weighing the raw materials and mixed uniformly respectively;

[0027] (2)CaO-Al 2 o 3 -SiO 2 -B 2 o 3 Glass preparation: raise the high-temperature continuous melting furnace to 1550°C, and then mix evenly CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The glass raw material is fed into the quartz crucible of the high-temperatur...

Embodiment 2

[0033] Li in the composite 2 O-Al 2 o 3 -SiO 2 -B 2 o 3 Crystallizable glass and CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The crystallizable glass is based on the total weight composition of the composite material, and its composition is as follows:

[0034]

[0035] The preparation method of the low-temperature co-fired material in this embodiment comprises the following steps:

[0036] (1) Preparation of raw materials for crystallizable glass: press Li 2 O-Al 2 o 3 -SiO 2 -B 2 o 3 Glass and CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The mass percent content of each oxide required for glass is taken by weighing the raw materials and mixed uniformly respectively;

[0037] (2)CaO-Al 2 o 3 -SiO 2 -B 2 o 3 Glass preparation: raise the high-temperature continuous melting furnace to 1550°C, and then mix evenly CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The glass raw material is fed into the quartz crucible of the high-temperature continuous melting furnace at a rate of 10-20 g / min; the g...

Embodiment 3

[0043] Li in the composite 2 O-Al2 o 3 -SiO 2 -B 2 o 3 Crystallizable glass and CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The crystallizable glass is based on the total weight composition of the composite material, and its composition is as follows:

[0044]

[0045] The preparation method of the low-temperature co-fired material in this embodiment comprises the following steps:

[0046] (1) Preparation of raw materials for crystallizable glass: press Li 2 O-Al 2 o 3 -SiO 2 -B 2 o 3 Glass and CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The mass percent content of each oxide required for glass is taken by weighing the raw materials and mixed uniformly respectively;

[0047] (2)CaO-Al 2 o 3 -SiO 2 -B 2 o 3 Glass preparation: raise the high-temperature continuous melting furnace to 1550°C, and then mix evenly CaO-Al 2 o 3 -SiO 2 -B 2 o 3 The glass raw material is fed into the quartz crucible of the high-temperature continuous melting furnace at a rate of 10-20 g / min; the gla...

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Abstract

The invention relates to a Li2O-Al2O3-SiO2-B2O3, CaO-Al2O3-SiO2-B2O3 crystallizable glass low-temperature co-fired composite material and a preparation method thereof. The composite material disclosed herein is characterized in that: the composite material comprises 40-60wt% of CaO-Al2O3-SiO2-B2O3 crystallizable glass and 60-40wt% of Li2O-Al2O3-SiO2-B2O3 crystallizable glass; composite material has a low sintering temperature and can be sintered at 800-900 DEG C that is greatly lower than the ceiling temperature (950 DEG C) of existing LTCC material sintering; the thermal expansion coefficient of the composite material (less than 6.7*10<-6>/DEG C) is low, and the medium loss (less than 0.02) is low; and the composite material has high densification degree and low porosity. According to the invention, the process is simple, the cost is low, and the obtained composite material has low thermal expansion coefficient.

Description

technical field [0001] The invention relates to a low-temperature co-fired composite material with low thermal expansion coefficient and low dielectric loss and a preparation method thereof, belonging to the field of electronic packaging materials. Background technique [0002] With the rapid development of microelectronics technology, electronic circuits are increasingly miniaturized and integrated. However, the development of electronic packaging technology has not been matched with it, which has become a bottleneck restricting the continued development of microelectronic technology. At present, low temperature cofired ceramics (Low Temperature Cofired Ceramics, LTCC) technology is widely used in the modular design of multilayer chip lines. It has good application prospects in terms of customization, design diversity and excellent high-frequency performance. [0003] LTCC technology mainly has the following technical advantages: (1) It can be sintered at a lower temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/622C04B35/64C03C10/00C03C12/00
Inventor 杨德安赫绿庭
Owner TIANJIN UNIV
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