Preparation method and product of low-roughness polyimide film and application of product

A polyimide film, low roughness technology, applied in the field of plastic film, achieves high glass transition temperature, good thickness uniformity, and improves photoelectric performance.

Active Publication Date: 2015-06-03
CHINA LUCKY FILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a low-roughness polyimide film preparation method for the deficiencies in the existing polyimide film preparation methods

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] (1) Preparation of polyamic acid slurry

[0039] Use the 250ml reactor that is equipped with stirrer, nitrogen injection device, dropping funnel, temperature controller and cooler, the N of 183g, N-dimethylacetamide (DMAc) is joined in this reactor, and reactor Adjust the temperature to 25°C, add 10.81g (0.01mol) of p-phenylenediamine (PPD) while stirring, and slowly add 29.229g (0.09935mol) to the solution after it is completely dissolved. 3,3' ,4,4'

[0040] -Biphenyltetracarboxylic dianhydride, continue to stir, stir at 25°C for 10 hours, heat up to 70°C after the viscosity of the solution gradually increases, and continue the reaction for 22 hours to finally obtain polyamic acid slurry.

[0041] (2) Cast substrate processing

[0042] The cast substrate is firstly cleaned by an ultrasonic cleaner, then cleaned with ethanol, and then heated with hot air to control the temperature of the cast substrate at 35°C.

[0043] (3) Preparation of polyimide film

[0044] Ta...

Embodiment 2

[0047] Casting substrate treatment Use hot air heating to control the temperature of the casting substrate at 45°C; other steps of preparation are the same as in Example 1, perform performance characterization of the film, use the film as a substrate to prepare CIGS thin film solar cells, test the conversion efficiency of the battery, and test results See Table 1.

Embodiment 3

[0049] The drying gradient temperature program is set as follows: room temperature~80°C, keep warm for 60min; 80~100°C, keep warm for 90min; The imidization heating program is as follows: room temperature~150°C, heating rate is 4°C / min, holding for 50 minutes; 150°C~250°C, heating rate is 6°C / min, holding for 15 minutes; 250°C~450°C, holding for 20 minutes; The rate was 8°C / min, and the preparation method of other steps was the same as in Example 1; the performance of the thin film was characterized, and the thin film was used as a substrate to prepare a CIGS thin film solar cell, and the conversion efficiency of the cell was tested. The test results are shown in Table 1.

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PUM

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Abstract

The invention discloses a preparation method and a product of a low-roughness polyimide film and application of the product. The preparation method comprises four steps, including synthesis and treatment of polyamide acid, curtain coating, pre-drying of the film and imidization, and the preparation method comprises the following concrete steps: taking biphenyl diamine and dianhydride as polyamide acid synthesizing monomers; controlling the temperature of a curtain coating substrate to be above 30 DEG C before film formation; drying and imidizing the film by adopting a programmable temperature increment mode, wherein the highest drying temperature is 130 DEG C; the highest imidization temperature is not lower than 450 DEG C. The prepared polyimide film is flat in surface, smaller than or equal to 10nm in surface roughness, larger than 300MPa in tensile strength, larger than 330 DEG C in glass-transition temperature, smaller than 1% in thermal shrinkage rate and smaller than 20ppm / DEG C in thermal expansion coefficient (CTE). The preparation method disclosed by the invention is safe in overall technological process, free of use of expensive equipment, simple in operation procedures and easy in control on surface appearance of the film.

Description

technical field [0001] The invention relates to the technical field of plastic films, in particular to a polyimide film and its application in thin film solar cells. Background technique [0002] Polyimide film (referred to as PI) was first developed as a high-temperature insulating material in the early 1960s in the United States. Polyimide film is an aromatic heterocyclic polymer compound containing imide chain links in its molecular structure. It has Very good heat resistance and radiation resistance, high temperature resistance up to 450 ° C, long-term use temperature range of -200 ~ 300 ° C, is the world's best performance of the film insulation material, and the best comprehensive performance of organic high As one of the molecular materials, it is widely used in various fields such as aerospace, microelectronics, atomic energy, electrical insulation, liquid crystal display, and membrane separation technology. [0003] At present, the polyimide film obtained by polyam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10H01L31/0392
CPCY02E10/50
Inventor 赵伟涛刘贤豪侯丽新王亚丽
Owner CHINA LUCKY FILM CORP
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