Encapsulating structure and encapsulating method of optical fiber combiner

A packaging structure and beam combiner technology, which is applied in optics, instruments, optical components, etc., can solve the problems of poor heat dissipation effect and poor long-term stability, and achieve high heat dissipation reliability, good stability, and good sealing effect

Inactive Publication Date: 2011-05-04
深圳朗光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problems such as poor heat dissipation effect and poor long-term stability of the existing beam combiner packaging, the present invention provides a simple and effective packaging structure and packaging method of the optical fiber combiner, which can ensure the reliability of the beam combiner product to the greatest extent Work

Method used

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  • Encapsulating structure and encapsulating method of optical fiber combiner
  • Encapsulating structure and encapsulating method of optical fiber combiner
  • Encapsulating structure and encapsulating method of optical fiber combiner

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Embodiment Construction

[0015] figure 1 The packaging structure of the beam combiner of the present invention is shown, including: a beam combiner; a substrate 14, on which the beam combiner is packaged, and a piece of glue 18 is used at both ends to fix the optical fibers; a round tube 16, the beam combiner is installed The substrate 14 is put into the round tube, the two ends of the round tube are sealed with two layers of glue 20, and the substrate and the round tube are bonded with the bottom glue 22; a metal box 26, the round tube 16 is sealed in the metal box with three layers of glue 24 Inside the box, the input optical fiber 10 and the output optical fiber 12 of the beam combiner protrude from the two ends of the metal box 26, and the two ends of the metal box are inserted with rubber caps 28 for protecting the optical fibers.

[0016] figure 2 It is the packaging flow chart of the method of the present invention, which specifically includes the following steps: first package the manufactur...

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Abstract

The invention discloses an encapsulating structure and an encapsulating method of a combiner. The encapsulating method comprises the following steps of: 1, encapsulating a manufactured combiner product on a substrate and fixing optical fibers at the two ends of the substrate by using primary glue; 2, putting the substrate on which the combiner is arranged into a circular pipe and sealing the two ends of the circular pipe by using secondary glue; and 3, encapsulating the circular pipe into a metal box by using third glue, making an input optical fiber and an output optical fiber of the combiner extend out of the two ends of the metal box and putting gum caps into the two ends of the metal box so as to protect the optical fibers. The encapsulating method has a simple process. The encapsulated combiner has the characteristics of high long-term working stability, high radiating reliability and the like.

Description

technical field [0001] The invention relates to the packaging of an optical fiber bundle combiner, in particular to a packaging structure and a packaging method of a high-power optical fiber bundle combiner. Background technique [0002] With the rapid development and maturity of fiber laser technology, the characteristics and advantages of fiber laser have been gradually recognized by people. Fiber laser has been widely used in national defense, industrial processing, medical and other fields, and the market demand and application are increasing year by year. , which is bound to create a large demand for fiber combiners. [0003] Fiber combiner is one of the core components of high-power fiber lasers. It is currently the most effective pump coupling device. It can efficiently couple the energy of multiple lasers into one optical fiber for transmission. The power used is generally tens of watts, Hundreds of watts or even kilowatts, such a high-power operation, puts forward ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/10
Inventor 朱学文董杰
Owner 深圳朗光科技有限公司
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