Resin composition and presoaking material, copper coating plate for printed circuit and printed circuit board using the same

A resin composition, a technology for printed circuit boards, applied in the directions of printed circuit components, circuit substrate materials, lamination, etc., can solve problems such as aquatic environment hazards and achieve environmentally friendly effects

Inactive Publication Date: 2007-09-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some people have questioned that during the combustion process of phosphorus-containing flame retardants, harmful gases (such as methyl phosphorus) and harmful substances (such as triphenylphosphine, etc.) may be produced, and their waste may cause potential harm to the aquatic environment.

Method used

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  • Resin composition and presoaking material, copper coating plate for printed circuit and printed circuit board using the same
  • Resin composition and presoaking material, copper coating plate for printed circuit and printed circuit board using the same
  • Resin composition and presoaking material, copper coating plate for printed circuit and printed circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Take 46 parts of cyanate ester, 31 parts of epoxy resin, 23 parts of N-containing flame retardant, 40 parts of silicon micropowder and an appropriate amount of butanone, stir and make a resin solution with a solid content of 60%.

[0067] Use 2116NE-glass fiber cloth to impregnate the above resin solution and bake at 155°C for 5 minutes to make a prepreg. The prepreg has a resin content of 53% and a resin fluidity of 20%.

[0068] Take 8 sheets of prepreg, stack them up neatly, cover both sides with 18μm electrolytic copper foil, place them in a vacuum press, and heat them at 195±3°C, 30kg / cm 2 Under the condition of hot pressing for 90 minutes, a double-sided copper clad laminate is made. The test results of copper clad laminates are shown in Table 1.

Embodiment 2

[0070] Take 54 parts of cyanate ester, 23 parts of epoxy resin, 23 parts of N-containing flame retardant, 40 parts of spherical silica powder and an appropriate amount of methyl ethyl ketone, stir and make a resin solution with a solid content of 60%.

[0071] Use 2116NE-glass fiber cloth to impregnate the above resin solution and bake at 155°C for 5 minutes to make a prepreg. The prepreg has a resin content of 53% and a resin fluidity of 20%.

[0072] Take 8 sheets of prepreg, stack them up neatly, cover both sides with 18μm electrolytic copper foil, sandwich them between mirror stainless steel plates, place them in a vacuum press, and heat them at 195±3°C, 30kg / cm 2 Under the condition of hot pressing for 90 minutes, a double-sided copper clad laminate is made. The test results of copper clad laminates are shown in Table 1.

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PUM

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Abstract

This invention relates to a resin combination and the prepreg, copper clad laminate for PCB and PCB which use the resin combination. It takes the cyanide phosphorus ester, epoxy resin, flame retardants containing helium as raw materials, adds inorganic fillers to produce the prepreg in the effect of solvent, takes NE fiberglass cloth as the substrate to immerse into prepreg producing the prepreg material, then heats and pressurized the laminated electrolytic copper foil to produce the copper clad laminate for PCB and PCB. The invention makes the products achieve reliability of high fever, excellent referral power, relatively low thermal expansion coefficient and flame retardant without halogens, phosphate, and lead.

Description

Technical field: [0001] The invention relates to a resin composition, a prepreg, a copper-clad laminate for a printed circuit, and a printed circuit board using the resin composition. Background technique: [0002] On July 1, 2006, the official implementation of two EU directives (Restricting the Use of Certain Hazardous Substances in Electrical and Electronic Products and Directives on Waste Electrical and Electronic Products) marked that the global electronics industry has entered the era of lead-free soldering. As the soldering temperature increases, the requirements for thermal reliability of the copper clad laminate increase accordingly. Therefore, it is urgent to develop a resin composition that matches this. [0003] Most of the traditional flame-retardant resin compositions use brominated epoxy resin systems, and the product has a flame-retardant function through the action of bromine (Br). In recent years, there has been a view that halogen (Br, Cl) flame retardan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/29H05K1/03B32B15/14B32B38/08
Inventor 辜信实
Owner GUANGDONG SHENGYI SCI TECH
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