Lead-free compatible high frequency copper clad laminate and its preparing method

A copper clad laminate, high-frequency technology, applied in printed circuit manufacturing, printed circuit components, electrical components, etc., can solve problems such as unfriendly human body and environment, and the generation of harmful gases.

Inactive Publication Date: 2007-09-19
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, there has been a view that halogen (mainly referring to Br and Cl) flame retardants wi

Method used

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  • Lead-free compatible high frequency copper clad laminate and its preparing method
  • Lead-free compatible high frequency copper clad laminate and its preparing method
  • Lead-free compatible high frequency copper clad laminate and its preparing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Take 35 parts of multifunctional epoxy resin, 23 parts of phosphorus-containing phenolic resin, 21 parts of PTFE, 20 parts of silicon micropowder and 1 part of imidazole accelerator, add an appropriate amount of methyl ethyl ketone as a solvent, and prepare it with a solid content of 65% under sufficient stirring. resin solution.

[0067]Use 2116NE glass fiber cloth to impregnate the above resin solution, and bake at 170°C for 5 minutes to make a bonding sheet. The resin content of the adhesive sheet was 53%, and the resin fluidity was 20%.

[0068] Take 8 bonding sheets, stack them neatly, cover both sides with 35μm electrolytic copper foil, and then sandwich them between two mirror stainless steel plates, place them in a vacuum press, at 195±3°C, 30Kg / cm 2 Under the condition of hot pressing for 90 minutes, a double-sided copper clad laminate is made. The test results of copper clad laminates are shown in Table 1.

Embodiment 2

[0070] Take 37 parts of multifunctional epoxy resin, 25 parts of phosphorus-containing phenolic resin, 20 parts of PTFE, 17 parts of silicon micropowder and 1 part of imidazole accelerator, add an appropriate amount of methyl ethyl ketone as a solvent, and prepare a solid content of 65% under sufficient stirring resin solution.

[0071] Use 2116NE glass fiber cloth to impregnate the above resin solution, and bake at 170°C for 5 minutes to make a bonding sheet. The resin content of the adhesive sheet was 53%, and the resin fluidity was 21%.

[0072] Take 8 bonding sheets, stack them neatly, cover both sides with 35μm electrolytic copper foil, and then sandwich them between two mirror stainless steel plates, place them in a vacuum press, at 195±3°C, 30Kg / cm 2 Under the condition of hot pressing for 90 minutes, a double-sided copper clad laminate is made. The test results of copper clad laminates are shown in Table 1.

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PUM

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Abstract

The present invention relates to an unleaded compatible high-frequency clad copperplate and its preparation method, a key technology which is used to produce a resin composition and NE fiberglass cloth for producing the clad copperplateL, and an adhesive film and clad copperplate made from this technology. The resin composition has the following groups and contents: a multi-functional epoxy resin: 30 ~ 45 percents, a phosphorus-containing phenolic resin: 20 ~ 30 percents, a polytetrafluoroethylene: 20 ~ 30 percents, a solidify curing accelerator: 0.5 ~ 1.5 percents, an inorganic filler: 20 ~ 30 percents, and a solvent: an adequate percent. The clad copperplate made of this, does not contain non bromine, according to the RoHS directive requirements, and has a high thermal reliability, excellent dielectric properties, low thermal expansion coefficient and excellent flame retardant properties.

Description

Technical field: [0001] The invention relates to the field of copper clad laminates applied to printed circuits. More specifically, it is the resin composition and NE glass fiber cloth for making copper-clad laminates, as well as the adhesive sheets and copper-clad laminates made therefrom. Background technique: [0002] On July 1, 2006, two EU directives (Restricting the Use of Certain Hazardous Substances in Electrical and Electronic Products and End-of-Life Electrical and Electronic Products) were officially implemented, marking that the global electronics industry has entered the era of lead-free soldering. Due to the increase in soldering temperature, the requirements for thermal reliability of copper clad laminates have been greatly improved in an all-round way. [0003] The thermal reliability of copper clad laminates includes glass transition temperature (Tg), thermal decomposition temperature (Td), thermal delamination time (T-288), solder resistance and coefficien...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
Inventor 辜信实
Owner GUANGDONG SHENGYI SCI TECH
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