A general-purpose low-profile active array antenna system

Abstract

The present invention discloses a general-purpose low-profile active array antenna system, which includes an antenna module, a multi-functional structural frame, a power divider module, a beam control module, a radio frequency connector, and a low-frequency connector. The multi-functional structural frame includes at least two cavities, and the partition between the two cavities includes a plurality of radio frequency connection holes and a plurality of low-frequency connection holes. The antenna module is connected to one of the cavities, the power divider module and the beam control module are connected to the other cavity. The radio frequency connector is located in the radio frequency connection hole, and the radio frequency connector connects the antenna module and the power divider module. The low-frequency connector is located in the low-frequency connection hole, and the low-frequency connector connects the antenna module and the beam control module. The beneficial effects of the present invention are as follows: the system composition is simplified, which is beneficial to the generalization, serialization, and standardization design of modules, and is more conducive to the realization of low-cost design of active array antennas.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave systems, and particularly to a general low-profile active array antenna system. Background Art

[0002] As a new system technology developed from array antennas, active array antennas have been widely used in fields such as radar, electronic countermeasure, measurement and control communication, and meteorology. With the development and drive of semiconductor technology and advanced packaging processes, the emergence of new modules such as antennas on chip (AoC), antennas in package (AiP), and system in package antennas (SiP) has effectively promoted the development of active array antenna technology towards the direction of light miniaturization, low cost, and high integration.

[0003] In the future, the form of active array antenna elements will tend to be blurred, and antennas will integrate more and more active and passive circuits. The safety, reliability, and service life of related high-integrated circuits are increasingly significantly affected by the mechanical and thermal environments during service. With the development of miniaturization and high integration of antenna array microsystems, especially for platforms such as missile-borne and space-borne platforms, related problems are more prominent.

[0004] CN110380231B discloses a planar active phased array antenna, which adopts a structure form of microstrip radiation array surface + heat pipe + T / R component array + backplane; CN111525284A discloses a multi-frequency composite high-power tile-type active phased array antenna, which adopts a structure form of wave control power supply layer + cover layer + low-frequency power supply transfer layer + radio frequency layer + radio frequency transfer layer + module cavity + array antenna layer; CN105655725A discloses a two-dimensional expandable chip-type active array antenna, which adopts a structure form of antenna array surface + tile-type TR component + multifunctional board; CN109216938A discloses a low-profile miniaturized phased array antenna, which adopts a structure form of antenna TR module + power supply sum-difference module.

[0005] The related patents have achieved low-profile of the active array surface to a certain extent, but there are problems such as complex design of some modules, large manufacturing difficulty, and poor adaptability to strong vibration environments, which result in limited engineering application of the related antenna system architectures. How to more scientifically and reasonably define the functions of each module according to the current level and development trend of electronic technology and formulate a more effective antenna system architecture remains to be further studied.

[0006] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of implication that this information constitutes prior art known to those of ordinary skill in the art. Summary of the Invention

[0007] The technical problem to be solved by the present invention is: how to solve the problem of poor versatility of active array antennas in the prior art.

[0008] The present invention solves the above technical problem by the following technical means:

[0009] A general-purpose low-profile active array antenna system includes an antenna module, a multi-functional structural frame, a power splitter module, a beam control module, a radio frequency connector, and a low-frequency connector. The multi-functional structural frame includes at least two cavities. The partition between the two cavities includes a plurality of radio frequency connection holes and a plurality of low-frequency connection holes. The antenna module is connected to one of the cavities, the power splitter module and the beam control module are connected to the other cavity. The radio frequency connector is located in the radio frequency connection hole, and the radio frequency connector connects the antenna module and the power splitter module. The low-frequency connector is located in the low-frequency connection hole, and the low-frequency connector connects the antenna module and the beam control module.

[0010] The present invention divides the active array antenna into modules and defines its functions, simplifies the system composition, is conducive to the generalization, serialization, and standardization design of modules, and is more conducive to the low-cost design of active array antennas; vertical connection can be achieved through radio frequency connectors and low-frequency connectors, realizing cable-free connection of internal modules, effectively reducing the insertion loss of radio frequency connectors and the antenna profile height.

[0011] Preferably, the antenna module includes a radiation patch antenna layer, a feed spacing conversion layer, a calibration channel coupling layer, a radio frequency distribution network layer, a power distribution network layer, a beam control distribution network layer, and an interface layer that are vertically connected in sequence. The bottom of the interface layer is connected to a power interface, a beam control interface, a radio frequency interface, and a TR component.

[0012] Preferably, the TR component is a tile-type TR component or a chip-type TR component.

[0013] Preferably, the multi-functional structural frame further includes a frame body, a cover plate, and an environmental control component. The outer part of the frame body is cylindrical. The partition in the middle of the frame body has a cooling cavity. The cover plate is connected to the cooling cavity, and the environmental control component is connected to the cooling cavity.

[0014] Preferably, the environmental control component is one or a combination of liquid cooling pipes, heat pipes, or phase change materials.

[0015] Liquid cooling pipes, heat pipes, or phase change materials can respectively meet the heat dissipation requirements of different products under different working conditions (ground, aviation, missile-borne, space-borne).

[0016] Preferably, the radio frequency connector is a blind mating radio frequency connector, and the radio frequency connector is one of an SMP radio frequency connector, an SSMP radio frequency connector, or a pogo pin type radio frequency connector.

[0017] Preferably, the low-frequency connector is a blind-mating low-frequency connector, and the low-frequency connector is one of a J30J low-frequency connector and a J63A low-frequency connector.

[0018] Preferably, it further includes a plurality of shock absorbers. A plurality of shock-absorbing connection holes are provided on the multi-functional structural frame, and the shock absorbers are connected to the shock-absorbing connection holes.

[0019] Preferably, the shock absorber is a metal rubber shock absorber.

[0020] The shock absorber is used for damping the system.

[0021] Preferably, it further includes a thermal conductive gasket, and the thermal conductive gasket is connected between the antenna module and the multi-functional structural frame.

[0022] While meeting the heat conduction of the TR component, the thermal conductive gasket can be used as a damper to reduce the vibration response of the TR component.

[0023] The advantages of the present invention are as follows:

[0024] (1) The present invention divides the active array antenna into modules and defines its functions, simplifies the system composition, is conducive to the generalization, serialization and standardization design of modules, and is more conducive to the low-cost design of the active array antenna; it can achieve vertical connection through the RF connector and the low-frequency connector, realize the cable-free connection of internal modules, and effectively reduce the insertion loss of the RF connector and the antenna profile height;

[0025] (2) The liquid cooling pipeline, heat pipe or phase change material can respectively meet the heat dissipation requirements of different products under different working conditions (ground, aviation, missile-borne, space-borne);

[0026] (3) The shock absorber is used for damping the system;

[0027] (4) While meeting the heat conduction of the TR component, the thermal conductive gasket can be used as a damper to reduce the vibration response of the TR component;

[0028] (5) The active array antenna constructed by the present invention fully integrates the force and heat environment adaptability technologies, and can effectively solve the adaptability problems of internal high-integration and high-power modules in harsh environments. Description of the Drawings

[0029] Figure 1 is a schematic structural diagram of a general-purpose low-profile active array antenna system in an embodiment of the present invention;

[0030] Figure 2 is an exploded schematic diagram of a general-purpose low-profile active array antenna system in an embodiment of the present invention;

[0031] Figure 3It is a cross-sectional view of a general-purpose low-profile active array antenna system in an embodiment of the present invention;

[0032] Figure 4 It is a schematic diagram of an antenna module in an embodiment of the present invention;

[0033] Figure 5 It is a schematic diagram of an antenna module in an embodiment of the present invention;

[0034] Figure 6 It is a schematic structural diagram of a multi-functional structural framework in an embodiment of the present invention;

[0035] Figure 7 It is an exploded structural schematic diagram of a multi-functional structural framework in an embodiment of the present invention;

[0036] Figure 8 It is a schematic structural diagram of a power divider module in an embodiment of the present invention;

[0037] Figure 9 It is a schematic structural diagram of a wave control module in an embodiment of the present invention;

[0038] Reference numerals in the figure:

[0039] 1. Antenna module; 11. Multi-functional board; 111. Radiation patch antenna layer; 112. Feeding pitch conversion layer; 113. Calibration channel coupling layer; 114. RF distribution network layer; 115. Power distribution network layer; 116. Wave control distribution network layer; 117. Interface layer; 12. TR component; 13. RF interface;

[0040] 2. Multi-functional structural framework; 21. Framework body; 22. Cover plate; 23. Environmental control component; 24. Partition board; 241. RF connection hole; 242. Low-frequency connection hole;

[0041] 3. Power divider module; 4. Wave control module; 5. RF connector; 6. Low-frequency connector; 7. Vibration damper; 8. Thermal conductive gasket; Specific embodiments

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0043] Embodiment 1:

[0044] As Figure 1 , Figure 2 , Figure 3As shown in the figure, a general-purpose low-profile active array antenna system includes an antenna module 1, a multi-functional structural frame 2, a power divider module 3, a wave control module 4, a radio frequency connector 5, and a low-frequency connector 6;

[0045] As Figure 4 , Figure 5 shown in the figure, in this embodiment, the antenna module 1 includes a multi-functional board 11 and a TR component 12. The TR component 12 is welded to the multi-functional board 11. The multi-functional board 11 includes a radiation patch antenna layer 111, a feed spacing conversion layer 112, a calibration channel coupling layer 113, a radio frequency distribution network layer 114, a power distribution network layer 115, a wave control distribution network layer 116, and an interface layer 117 that are vertically connected in sequence. The connection method can adopt the connection method in the prior art. The bottom of the interface layer 117 is connected to a power supply interface, a wave control interface, a radio frequency interface 13, and the TR component 12.

[0046] Among them, the TR component 12 is a tile-type TR component or a chip-type TR component. In this embodiment, a chip-type TR component is selected.

[0047] As Figure 6 shown in the figure, the multi-functional structural frame 2 includes a frame body 21, a cover plate 22, and an environmental control component 23. The outside of the frame body 21 is cylindrical. A partition 24 in the middle of the frame body 21 divides the inside of the frame body 21 into two cavities. As Figure 3 shown in the figure, the antenna module 1 is connected to the upper cavity of the multi-functional structural frame 2, and the power divider module 3 and the wave control module 4 are connected to the lower cavity of the multi-functional structural frame 2. The partition 24 includes a plurality of radio frequency connection holes 241 and a plurality of low-frequency connection holes 242. As Figure 3 shown in the figure, the radio frequency connector 5 is located in the radio frequency connection hole 241, and the radio frequency connector 5 connects the antenna module 1 and the power divider module 3. The low-frequency connector 6 is located in the low-frequency connection hole 242, and the low-frequency connector 6 connects the antenna module 1 and the wave control module 4.

[0048] As Figure 7 shown in the figure, the partition 24 is a plate with a certain thickness. The middle of the partition 24 is hollowed out along the axial direction to form a cooling cavity. The cooling cavity has an inverted V-shaped structure. The cover plate 22 is an inverted V-shaped plate, and the cover plate 22 is connected to the cooling cavity. The environmental control component 23 is located in the cooling cavity.

[0049] The environmental control component 23 is one or a combination of a liquid cooling pipe, a heat pipe, or a phase change material. The liquid cooling pipe, the heat pipe, or the phase change material can respectively meet the heat dissipation requirements of different products under different working conditions (ground, aviation, missile-borne, space-borne). After the environmental control component 23 is used, channels need to be opened in the partition 24 for pipeline layout, etc. The channels are communicated with the cooling cavity.

[0050] The power splitting module 3 is closely attached to the multifunctional structure frame 2. The power splitting module 3 has an interface connected to the RF connector 5, and the power splitting module 3 can perform the functions of the final-stage power splitting network and the transceiver drive amplification.

[0051] The beam control module 4 performs the beam control function of the array surface and can also integrate the power supply function of the array surface on this basis.

[0052] In this embodiment, the RF connector 5 is a blind mating type RF connector, and the RF connector 5 is one of an SMP RF connector, an SSMP RF connector, and a pin button type RF connector. The RF connector 5 is used to realize the RF signal transmission between the antenna module 1 and the power splitting module 3.

[0053] The low-frequency connector 6 is a blind mating type low-frequency connector, and the low-frequency connector is one of a J30J low-frequency connector and a J63A low-frequency connector. The low-frequency connector 6 is used to transmit low-frequency signals and power supply between the beam control module 4 and the antenna module 1.

[0054] The working process of this embodiment:

[0055] During reception, the antenna module 1 receives the echo signal from space, performs the first amplification and the first synthesis of the TR component 12, enters the RF distribution network layer 114 for the second synthesis, and is output after the third synthesis by the power splitting module 3;

[0056] During transmission, the RF excitation signal is first distributed by the power splitting module 3, then is secondarily distributed in the RF distribution network layer 114 inside the antenna module 1, and after being tertiarily distributed by the power splitting network inside the chip-type T / R component, phase weighting and amplitude amplification are performed in the T / R channel, and electromagnetic waves are radiated into space through the microstrip radiation unit.

[0057] The array surface beam control generates the control data of the T / R component in a timely manner according to the beam control instruction and sends it to the final-stage beam control distribution circuit of the antenna module 1 for driving amplification and distribution of the control data transmitted from the array surface beam control to the chip-type T / R components. In addition, the power supply required for the operation of the T / R components is sent to the power supply main port of the antenna module 1 and distributed to each chip-type T / R component through the power distribution network in the multifunctional board 2.

[0058] This embodiment divides the active array antenna into modules and defines the functions, simplifies the system composition, is conducive to the modular generalization, serialization, and standardization design, and is more conducive to the low-cost design of the active array antenna; vertical connection can be realized through the RF connector and the low-frequency connector, the cable-free connection of the internal modules is realized, and the insertion loss of the RF connector and the antenna profile height are effectively reduced.

[0059] Embodiment 2:

[0060] AsFigure 1 As shown in the figure, a general-purpose low-profile active array antenna system further includes a plurality of shock absorbers 7. An outer circumferential surface of a frame body 21 of the multi-functional structural frame 2 extends radially outward to form an annular plate, and a plurality of through shock-absorbing connection holes are formed in the annular plate. The shock absorbers 7 are connected to the shock-absorbing connection holes.

[0061] In this embodiment, there are four shock absorbers 7, which are arranged in a circumferential array along the multi-functional structural frame 2. The shock absorbers 7 are metal rubber shock absorbers. The shock absorbers 7 are used for shock absorption of the system. Of course, when the mechanical environment permits, the shock absorbers are optional.

[0062] To adapt to the installation of the shock absorbers 7, the frame body 21 has an inwardly concave arc at the position corresponding to the installation of the shock absorbers 7. The edges of the antenna module 1 and the wave control module 4 also have arc-shaped relief grooves.

[0063] As Figure 3 As shown in the figure, a general-purpose low-profile active array antenna system further includes a heat-conducting gasket 8. The heat-conducting gasket 8 is connected between the antenna module 1 and the multi-functional structural frame 2. Specifically, the heat-conducting gasket 8 is located between the TR component 12 and the frame body 21. While the heat-conducting gasket 8 satisfies the heat conduction of the TR component 12, it can be used as a damper to reduce the vibration response of the TR component.

[0064] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A general-purpose low-profile active array antenna system, characterized in that, It includes an antenna module, a multi-functional structural frame, a power divider module, a wave control module, a radio frequency connector, and a low-frequency connector. The multi-functional structural frame includes at least two cavities. The partition between the two cavities includes a plurality of radio frequency connection holes and a plurality of low-frequency connection holes. The antenna module is connected to one of the cavities, the power divider module and the wave control module are connected to the other cavity. The radio frequency connector is located in the radio frequency connection hole, and the radio frequency connector connects the antenna module and the power divider module. The low-frequency connector is located in the low-frequency connection hole, and the low-frequency connector connects the antenna module and the wave control module. The multi-functional structural frame further includes a frame body, a cover plate, and an environmental control component. The outer part of the frame body is cylindrical. The partition in the middle of the frame body has a cooling cavity. The cover plate is connected to the cooling cavity, and the environmental control component is connected to the cooling cavity. The environmental control component is one or a combination of a liquid cooling pipe, a heat pipe, or a phase change material. The antenna module includes a multi-functional board and a TR component. The multi-functional board includes a radiation patch antenna layer, a feed spacing conversion layer, a calibration channel coupling layer, a radio frequency distribution network layer, a power distribution network layer, a wave control distribution network layer, and an interface layer that are sequentially vertically connected. The bottom of the interface layer is connected to a power interface, a wave control interface, a radio frequency interface, and a TR component. It further includes a plurality of shock absorbers. The multi-functional structural frame is provided with a plurality of shock absorption connection holes, and the shock absorbers are connected in the shock absorption connection holes.

2. A general low-profile active array antenna system according to claim 1, characterized in that, The TR component is a tile-type TR component or a chip-type TR component.

3. A general low-profile active array antenna system according to claim 1, characterized in that, The radio frequency connector is a blind mating type radio frequency connector, and the radio frequency connector is one of an SMP radio frequency connector, an SSMP radio frequency connector, or a pin and socket type radio frequency connector.

4. A general low-profile active array antenna system according to claim 1, characterized in that The low-frequency connector is a blind mating type low-frequency connector, and the low-frequency connector is one of a J30J low-frequency connector or a J63A low-frequency connector.

5. A general-purpose low-profile active array antenna system according to claim 1, characterized in that, The shock absorber is a metal rubber shock absorber.

6. A general-purpose low-profile active array antenna system according to claim 1, characterized in that It further includes a thermal conductive gasket, and the thermal conductive gasket is connected between the antenna module and the multi-functional structural frame.

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