Solder-free mountable high-performance vertical interconnect radio frequency connector
By using a petal-shaped elastic shell and floating inner conductor design, the solderless high-performance vertical interconnect RF connector solves the problems of signal instability and soldering complexity caused by shaking and deviation in traditional RF connectors, achieving stable transmission of high-frequency signals and low reflection, suitable for connection between PCB and LTCC boards.
Patent Information
- Application Number
- PCT/CN2025/119349
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-10
- Filing Date
- 2025-09-05
- Publication Date
- 2026-04-16
AI Technical Summary
Traditional RF connectors struggle to ensure signal transmission stability and reliability when subjected to significant vibration or axial deviation. Furthermore, they suffer from space constraints and complex soldering processes in high-density assembly. In particular, the soldering process increases production costs and may lead to unreliable connection points and performance degradation in miniaturized and micro-miniaturized system designs.
Employing a solderless, surface-mount high-performance vertical interconnect RF connector, it utilizes a floating connection design with a petal-shaped elastic shell and elastic inner conductor, combined with the high elasticity of beryllium bronze material, to achieve multi-point independent surface contact, enhancing fatigue resistance and environmental adaptability, and ensuring the stability and reliability of signal transmission.
It maintains the stability and reliability of signal transmission under conditions of significant shaking or axial deviation, improves the connector's shock resistance and contact stability, reduces production costs, achieves low reflection and high transmission efficiency, and maintains stable performance in high-frequency signal transmission, making it suitable for connections between PCBs and LTCC boards.
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Figure CN2025119349_16042026_PF_FP_ABST
Abstract
Description
A solderless, surface-mount high-performance vertical interconnect RF connector Cross-reference to related applications
[0001] This application claims priority to Chinese Patent Application No. 202411407397.6, filed on October 10, 2024, entitled “A Solderless Mount Millimeter Wave Vertical Interconnect RF Connector”, the entire contents of which are incorporated herein by reference. Technical Field
[0002] This invention relates to a radio frequency connector, and more particularly to a solderless, surface-mount, high-performance vertical interconnect radio frequency connector for use in the field of radio frequency connector technology. Background Technology
[0003] In today's communications and electronics fields, radio frequency (RF) connectivity technology plays a crucial role. As a key component for RF signal transmission, the performance of RF connectors directly affects the signal quality and stability of the entire system.
[0004] Chinese Patent Application No. CN201710240580.5 discloses an RF connector, comprising: a support portion disposed on the male connector of the RF connector, the support portion being used to connect the male connector of the RF connector to the ground wire of the power supply network transmission line; a first outer conductor disposed on the male connector of the RF connector, the first outer conductor being connected to the support portion; and a first inner conductor disposed on the male connector of the RF connector, the first inner conductor being disposed inside the first outer conductor, and the axis of the first inner conductor coinciding with the axis of the first outer conductor, the first inner conductor being connected to the support portion through a first elastic element, the first inner conductor moving axially along the outer conductor due to the deformation of the first elastic element. By providing a first elastic element between the first inner conductor and the inner core sleeve, the use of a spring ring for fixing in the prior art is avoided, which results in a large mounting shell volume of the RF connector, thus reducing the volume of the RF connector.
[0005] Traditional RF connectors often struggle to guarantee signal transmission stability and reliability when subjected to significant vibration or axial misalignment. Furthermore, high-density assembly of traditional RF connectors faces challenges such as space constraints and complex soldering processes, especially in miniaturized and micro-sized system designs. Soldering not only increases production costs but can also lead to connection point unreliability and long-term performance degradation. Therefore, we propose a solderless, surface-mount, high-performance vertical interconnect RF connector. Summary of the Invention
[0006] The technical problem that this invention aims to solve in response to the above-mentioned prior art is that traditional RF connectors often struggle to guarantee the stability and reliability of signal transmission when faced with significant vibration or axial deviation. Furthermore, traditional RF connectors often face challenges such as space constraints and complex soldering processes in high-density assembly. Especially in miniaturized and micro-miniaturized system designs, the soldering process not only increases production costs but may also lead to unreliability of connection points and performance degradation during long-term use.
[0007] To address the aforementioned issues, this invention provides a solderless, surface-mount high-performance vertical interconnect RF connector, comprising a connector housing, a pair of petal-shaped elastic shells disposed on the inner side of the connector housing, a spring fixedly connected between the petal-shaped elastic shells and the connector housing, the petal-shaped elastic shells being floatingly connected to the connector housing via the springs, a first inner conductor disposed on the inner side of the connector housing, both ends of the first inner conductor being floatingly connected to elastic second inner conductors, and an insulating support for supporting the first inner conductor disposed on the inner side of the petal-shaped elastic shells.
[0008] In the aforementioned solderless, surface-mount high-performance vertical interconnect RF connector, there are three elastic features. First, the petal-shaped elastic shell relies on a spring to achieve a relatively inward floating connection with the connector shell, ensuring good overall contact of the connector even under relatively large shaking, thanks to the spring force. Second, there is a floating connection between the elastic second inner conductor and the first inner conductor, ensuring the stability of RF signal contact. Third, the petal-shaped elastic shell itself has a certain degree of elasticity due to its petal shape, ensuring good grounding of the connector even with a certain degree of axial deviation. Thus, the connector can maintain the stability and reliability of signal transmission even when facing large shaking or a certain degree of axial deviation.
[0009] As a further improvement of this application, the petal-shaped elastic shell is made of beryllium bronze, and the elasticity of the petal-shaped elastic shell is greater than that of the spring.
[0010] As a further improvement to this application, the elastic second inner conductor is made of beryllium bronze.
[0011] As a further improvement of this application, the petal-shaped elastic shell is composed of an elastic shell body and multiple petal pieces. The multiple petal pieces are evenly distributed on the elastic shell body in a circular or U-shape. The number of petal pieces is greater than 4, and the petal pieces are set in an inclined position.
[0012] As a further improvement of this application, the RF connector has four models: SSCMT, SCMT, CMT and HCMT. The diameter of the petal in the SSCMT model RF connector is 1-2mm, the diameter of the petal in the SCMT model RF connector is 2-3mm, the diameter of the petal in the CMT model RF connector is 3-4mm, and the diameter of the petal in the HCMT model RF connector is greater than 4mm.
[0013] In summary, the RF connector in this application employs a unique inner and outer conductor elastic floating design. This design not only enhances the connector's fatigue resistance but also improves its adaptability to different temperatures and environments. Furthermore, the application of the petal-shaped elastic shell further enhances the connector's shock resistance and contact stability, ensuring low reflection and high transmission efficiency in high-frequency signal transmission. The elastic petals can be used effectively more than 500 times without significant performance changes. The connector's end has a petal-shaped structure and is made of beryllium bronze, which has excellent elasticity after heat treatment, enabling flexible connections. The grounding method is surface contact, and unlike traditional surface contact methods, the petal-shaped structure can achieve multi-point independent surface contact. This ensures that when the connector's connection surface is uneven, causing poor grounding, other independent surface contact points remain unaffected. Moreover, the RF connector in this application can eliminate the need for soldering when used for connections between PCBs, LTCCs, and other boards, achieving surface-mount vertical connections. Attached Figure Description
[0014] Figure 1 is a front view of the solderless surface mount high-performance vertical interconnect RF connector in the first and second embodiments of this application.
[0015] Figure 2 is a partial structural schematic diagram of the connector housing in the first and second embodiments of this application;
[0016] Figure 3 is a side view of the petal-shaped elastic shell in the first and second embodiments of this application;
[0017] Figure 4 is a pictographic illustration of the situation where the connector is connected to the PCB board and axial asymmetry occurs in the first embodiment of this application.
[0018] Figure 5 is a pictographic illustration of the connector used for connection between PCB boards in the first embodiment of this application;
[0019] Figure 6 shows the test results of the RF connector electrical performance test in the second embodiment of this application.
[0020] Explanation of the labels in the diagram:
[0021] 1. First inner conductor; 2. Spring; 3. Petal-shaped elastic outer shell; 31. Elastic outer shell body; 32. Petal piece; 4. Elastic second inner conductor; 5. Connector shell; 6. Insulating support. Detailed Implementation
[0022] The two embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0023] First implementation method:
[0024] Figures 1-5 illustrate a solderless, surface-mount, high-performance vertical interconnect RF connector, including a connector housing 5. A pair of petal-shaped elastic shells 3 are disposed inside the connector housing 5. A spring 2 is fixedly connected between the petal-shaped elastic shells 3 and the connector housing 5. The petal-shaped elastic shells 3 are floatingly connected to the connector housing 5 via the spring 2. A first inner conductor 1 is disposed inside the connector housing 5. Both ends of the first inner conductor 1 are floatingly connected to elastic second inner conductors 4 (the ends of the first inner conductor 1 have slots that match the elastic second inner conductors 4, and one end of the elastic second inner conductor 4 is movably inserted into the slots). An insulating support 6 for supporting the first inner conductor 1 is also disposed inside the petal-shaped elastic shells 3. The petal-shaped elastic shells 3 are made of beryllium bronze, and the elasticity of the petal-shaped elastic shells 3... The elasticity of the second inner conductor 4 is greater than that of the spring 2. The elastic second inner conductor 4 is made of beryllium bronze. There are three elastic parts in the connector in this application. First, the petal-shaped elastic shell 3 is connected to the connector shell 5 by the spring 2 to float inward, so that the connector can maintain good contact even under relatively large shaking, thanks to the elastic force of the spring 2. Second, the elastic second inner conductor 4 is connected to the first inner conductor 1 to ensure the stability of the radio frequency signal contact. Third, the petal-shaped elastic shell 3 itself has a certain degree of elasticity due to its petal shape, so that the connector can maintain good grounding even when there is a certain deviation in the axial direction. Thus, the connector can maintain the stability and reliability of signal transmission even when facing large shaking or a certain deviation in the axial direction.
[0025] Please refer to Figure 2. Based on the connector's structural characteristics, when the connector is in use, point A is the primary load-bearing element. At this time, spring 2 contracts, and part of the petal-shaped elastic shell 3 retracts into the connector shell 5. Part of the elastic force comes from spring 2, while the petal-shaped elastic shell 3 bears the remaining support force. The petal-shaped elastic shell 3 has a slotted structure and is made of beryllium bronze, a commonly used material for elastic connectors such as SMP. After reasonable dimensional design and relevant heat treatment, suitable elasticity can be obtained. Because the elastic coefficient of the petal-shaped elastic shell 3 is greater than that of spring 2, the deformation of the petal-shaped elastic shell 3 will be smaller than that of spring 2 during use. This allows the contact area between the connector and the device to be similar in both the natural and compressed states, providing excellent controllability.
[0026] Please refer to Figure 3. The petal-shaped elastic shell 3 is composed of an elastic shell body 31 and multiple petal pieces 32. The number of petal pieces 32 is greater than 4, and the petal pieces 32 are set in an inclined shape. The petal-shaped elastic shell 3 has a variety of styles. The distribution pattern of the petal pieces 32 in different styles of petal-shaped elastic shell 3 is different. The distribution pattern of the petal pieces 32 includes, but is not limited to, a circular uniform distribution and a U-shaped uniform distribution. In Figure 3, a is a petal-shaped elastic shell 3 with petal pieces 32 distributed in a circular uniform distribution, and b is a petal-shaped elastic shell 3 with petal pieces 32 distributed in a U-shaped uniform distribution. Those skilled in the art can select a suitable style of petal-shaped elastic shell 3 according to their needs.
[0027] The RF connectors in this application come in four models: SSCMT, SCMT, CMT, and HCMT. The diameter of the petal 32 in the SSCMT model RF connector is 1-2mm, the diameter of the petal 32 in the SCMT model RF connector is 2-3mm, the diameter of the petal 32 in the CMT model RF connector is 3-4mm, and the diameter of the petal 32 in the HCMT model RF connector is greater than 4mm.
[0028] Please refer to Figure 4. When the connector is connected to the PCB, if the PCB and the connector are axially asymmetrical due to installation tolerance or board flatness issues, the petal-shaped elastic shell 3 can still maintain good contact by its own elasticity.
[0029] Spring 2 is made of stainless steel, possessing excellent corrosion resistance, wear resistance, and high-temperature resistance, as well as a long fatigue life, making it less prone to plastic deformation or fatigue failure under repeated stress. The elastic second inner conductor 4 also has an internal elastic mechanism, which can adapt to the deformation of the outer shell. The elastic second inner conductor 4 possesses appropriate elasticity in its natural state, ensuring sufficient and good contact between the inner conductor and the connection point when the connector is in use. Both the petal-shaped elastic outer shell 3 and the elastic second inner conductor 4 are made of beryllium bronze. Beryllium bronze has extremely high elastic modulus and strength, maintaining its shape and function under significant mechanical stress, and also possesses high fatigue resistance, effectively supporting repeated mating and unmating scenarios. Therefore, it is widely used in other elastic connectors such as SSMP and SMP connectors. To verify the strength of the petal-shaped elastic outer shell 3, relevant experiments were conducted during the development phase, testing it under different pressures, durations, and pressing frequencies. After being continuously compressed at 20N for 20 days, its elasticity showed no significant change.
[0030] Please refer to Figure 5. When the connector is used for connection between PCB boards, it can eliminate the need for soldering and achieve surface mount connection. Depending on the user's actual application, the other end of the connector can be adapted to any interface connector such as SMP, SSMP, 1.85, 2.4, 2.92, etc.
[0031] The RF connector in this application employs a unique inner and outer conductor elastic floating design. This design not only enhances the connector's fatigue resistance but also improves its adaptability to different temperatures and environments. Furthermore, the application of a petal-shaped elastic shell further enhances the connector's shock resistance and contact stability, ensuring low reflection and high transmission efficiency in high-frequency signal transmission. The elastic petals can be used effectively for more than 500 times without significant performance changes. The connector's end has a petal-shaped structure and is made of beryllium bronze, which has excellent elasticity after heat treatment, enabling flexible connections. The grounding method is surface contact, and unlike traditional surface contact methods, the petal-shaped structure can achieve multi-point independent surface contact. This ensures that when the connector's connection surface is uneven, causing poor grounding, other independent surface contact points remain unaffected. Moreover, the RF connector in this application can eliminate the need for soldering when used for connections between PCBs, LTCCs, and other boards, achieving surface-mount vertical connections.
[0032] Second implementation method:
[0033] Figures 1-3 and 6 illustrate a solderless, surface-mount high-performance vertical interconnect RF connector, whose electrical performance is tested as follows (the connector under test is in the form of SCMT on one end and SMP on the other):
[0034] S1. Connect port 1 of the vector network analyzer to test connector 2.4 / SMP-JJ and port 2 to test connector 2.4 / SMP-JK. Insert the two test connectors and normalize the insertion loss.
[0035] S2. Replace the 2.4 / SMP-JJ test connector with a 2.4 / SMP-JK test connector, and connect the connector under test to the test connector at port 1 of the vector network analyzer;
[0036] S3. Screw the test fixture into the connector under test;
[0037] S4. Place the through-pass into the test fixture;
[0038] S5. Connect the other connector under test to the test connector at port 2 of the vector network analyzer;
[0039] S6. Insert the connector under test at port 2 of the vector network analyzer into the test fixture and connect it to the through-hole. Read the maximum values of S11 (VSWR), S22 (VSWR), and S12 (insertion loss) in the DC-40GHz frequency range during compression.
[0040] S7. Output the test results.
[0041] The test results show that the RF connector in this application can reach a maximum frequency of 40GHz, with a standing wave ratio of less than 1.3 and an insertion loss of less than 0.6dB, demonstrating excellent performance.
[0042] In light of current practical needs, the above-described embodiments adopted in this application are not limited to this scope of protection. Various changes made within the knowledge of those skilled in the art without departing from the concept of this application still fall within the protection scope of this invention.
Claims
1. A solderless, surface-mount, high-performance vertical interconnect RF connector, characterized in that, The connector housing (5) includes a pair of petal-shaped elastic shells (3) on its inner side. A spring (2) is fixedly connected between the petal-shaped elastic shells (3) and the connector housing (5). The petal-shaped elastic shells (3) are floatingly connected to the connector housing (5) through the spring (2). A first inner conductor (1) is provided on the inner side of the connector housing (5). Both ends of the first inner conductor (1) are floatingly connected to elastic second inner conductors (4). An insulating support (6) for supporting the first inner conductor (1) is also provided on the inner side of the petal-shaped elastic shells (3).
2. The solderless surface-mount high-performance vertical interconnect RF connector according to claim 1, characterized in that, The petal-shaped elastic shell (3) is made of beryllium bronze, and the elasticity of the petal-shaped elastic shell (3) is greater than that of the spring (2).
3. The solderless surface-mount high-performance vertical interconnect RF connector according to claim 1, characterized in that, The elastic second inner conductor (4) is made of beryllium bronze.
4. The solderless surface-mount high-performance vertical interconnect RF connector according to claim 1, characterized in that, The petal-shaped elastic shell (3) is composed of an elastic shell body (31) and multiple petal pieces (32). The multiple petal pieces (32) are evenly distributed on the elastic shell body in a circular or U-shape. The number of petal pieces (32) is greater than 4, and the petal pieces (32) are set in an inclined shape.
5. A solderless, surface-mount, high-performance vertical interconnect RF connector according to claim 4, characterized in that, There are four models: SSCMT, SCMT, CMT and HCMT. The diameter of the petal (32) in the SSCMT model RF connector is 1-2mm, the diameter of the petal (32) in the SCMT model RF connector is 2-3mm, the diameter of the petal (32) in the CMT model RF connector is 3-4mm, and the diameter of the petal (32) in the HCMT model RF connector is greater than 4mm.
Citation Information
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