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Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof

A technology of epoxy resin and single crystal silicon rods, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of not meeting the production process of single crystal silicon wafer cutting, poor anti-crystallization performance, and many edge chipping, etc. problems, to achieve the effect of improving the overall leveling performance, good degumming performance, and reducing the chip drop rate

Inactive Publication Date: 2011-07-13
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there are still many problems in the dicing glue for monocrystalline silicon rod slicing, such as chip dropping, many edge chipping, poor anti-crystallization performance, etc., which cannot meet the needs of the monocrystalline silicon wafer dicing production process.

Method used

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  • Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof
  • Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof
  • Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Preparation of modified amine: put alicyclic amine and epoxy silane into a spiral stirrer, stir rapidly for 20-30 minutes at a speed of 300-500 rpm, then put the mixture into a reaction kettle to heat, and the temperature is controlled at 100℃~150℃, stir rapidly for 2~3 hours;

[0029] The proportion of component A is as follows: 50% bisphenol A epoxy resin with an epoxy value of 0.51mol / 100g, 49% KR-628, 0.5% simethicone, and 0.5% borate coupling agent.

[0030] The proportion of component B is as follows: 68% Capcure 3800, 31% modified cycloaliphatic amine, 1% 2,4,6-tris(dimethylaminomethyl)phenol.

[0031] Accurately weigh various raw materials according to the above formula ratio, put them into the reaction kettle, control the temperature of the reaction kettle at about 60°C, stir in vacuum for 3 hours, put them into packaging bottles after cooling, and seal them for storage.

Embodiment 2

[0033] Preparation of modified amine: put alicyclic amine and epoxy silane into a spiral stirrer, stir rapidly for 20-30 minutes at a speed of 300-500 rpm, then put the mixture into a reaction kettle to heat, and the temperature is controlled at 100℃~150℃, stir rapidly for 2~3 hours;

[0034] The proportion of component A is as follows: 55% bisphenol A epoxy resin with an epoxy value of 0.54mol / 100g, 44% 1,4 butanediol diglycidyl ether, 0.5% polyoxyethylene glyceryl ether, 0.5% KH560.

[0035] The proportion of component B is as follows: 55% Capcure 3800, 44% modified cycloaliphatic amine, 1% resorcinol.

[0036] Accurately weigh various raw materials according to the above formula ratio, put them into the reaction kettle, heat up to 40°C~60°C, stir in vacuum for 3~4 hours and then cool; then put it into a packaging bottle and seal it for storage.

Embodiment 3

[0038] Preparation of modified amine: put alicyclic amine and epoxy silane into a spiral stirrer, stir rapidly for 20-30 minutes at a speed of 300-500 rpm, then put the mixture into a reaction kettle to heat, and the temperature is controlled at 100℃~150℃, stir rapidly for 2~3 hours;

[0039] The proportion of component A is as follows: 60% bisphenol A epoxy resin with an epoxy value of 0.56mol / 100g, 33% KR-102, 0.5% simethicone, and 2% KH560.

[0040] Preparation of component B, 60% Capcure 3800, 39% modified cycloaliphatic amine, 1% resorcinol. Put it into a reaction kettle, heat it to 40°C~60°C, stir it under vacuum for 3~4 hours, then cool it down; then put it into a packaging bottle and keep it sealed.

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Abstract

The invention relates to a modified epoxy resin of monocrystalline silicon rod cutting glue. The modified epoxy resin of the monocrystalline silicon rod cutting glue comprises the following raw materials comprising a component A and a component B, wherein the component A comprises 35 to 78 percent of epoxy resin, 20 to 60 percent of toughening agent, 0.5 to 2 percent of defoaming agent and 0.5 to 3 percent of coupling agent; and the component B comprises 48 to 69 percent of polymerized mercaptan, 30 to 50 percent of alicyclic modified amine and 1 to 5 percent of accelerator. The modified epoxy resin has a high degumming property and can reduce sheet-falling rate. According to epoxy silane, toughness and temperature resistance of an alicyclic amine material are achieved and low surface tension of the whole system is achieved, so that the whole levelling property of the system is improved in the whole gluing process. A hydrolysis reaction can be performing on a silane bond and the hydroxy on the surface of glass and the surface of a silicon wafer, so that the adhesion to the surface of the glass and the surface of the silicon wafer is improved. In addition, the system is toughened, the water-absorbing rate of the system after the alicyclic amine is modified is increased and the heat-resistant temperature TG is reduced, so that a sheet-falling phenomenon does not exist in the cutting and spraying processes, and the resin can be degummed quickly in the process of heating to 40 to 50 DEG C in the state of high water absorbability and softening after heating. The modified epoxy resin is applied to monocrystalline silicon rod cutting and has an extremely important effect on the monocrystalline silicon wafer industry.

Description

[0001] technical field [0002] The invention relates to an epoxy resin composition, in particular to single crystal silicon rod cutting. Background technique [0003] In the past five years, the annual growth rate of China's photovoltaic cell production has been 1~3 times, and the proportion of photovoltaic cell production in the global production has also increased from 1.07% in 2002 to nearly 15% in 2008. The efficiency of commercial crystalline silicon solar cells has also increased from 13% to 14% three years ago to 16% to 17%. Overall, the international market share and technological competitiveness of China's solar cells have increased significantly. In terms of industrial layout, China's solar cell industry has formed a certain concentration trend. In the Yangtze River Delta, the Bohai Rim, the Pearl River Delta, and the central and western regions, solar industry clusters with their own characteristics have been formed. [0004] Solar photovoltaic power generatio...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J181/02C09J11/06C09J11/08
Inventor 刘龙江蔡公华姚其胜侯一斌
Owner 康达新材料(集团)股份有限公司
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