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Cutting method for non-substrate double faced adhesive tape

A technology with double-sided adhesive and no base material, which is applied in chemical instruments and methods, lamination auxiliary operations, metal processing, etc. It can solve problems such as poor reverse release, poor deformation, and impact on product production capacity, so as to prevent reverse release Defective, product quality assurance, and product quality improvement effects

Active Publication Date: 2020-05-08
DONGGUAN LINGYI PRECISION MFG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the irregularity of the fluidity of the glue, the die-cut product often causes reverse release and poor deformation due to the glue flowing to the non-release area of ​​the knife print, which seriously affects the performance of the double-sided adhesive and affects the production capacity of the product.
In addition, during the die-cutting process, the knife die is punched towards the surface of the release film, which will cause obvious damage to the knife mark on the surface of the release film.
Double-sided adhesive waste is extruded with a stick, and the glue will flow irregularly to the knife mark, resulting in poor peeling of the double-sided adhesive, resulting in product deformation, overlapping glue, lack of glue, and poor release, causing functional abnormalities in the assembly of the finished product

Method used

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  • Cutting method for non-substrate double faced adhesive tape
  • Cutting method for non-substrate double faced adhesive tape
  • Cutting method for non-substrate double faced adhesive tape

Examples

Experimental program
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Embodiment 1

[0024] Figure 1 ~ Figure 4 Schematically shows a cutting method of double-sided adhesive tape without base material according to the present invention. The method includes the following steps:

[0025] S1. Round knife process

[0026] Provide a silicone protective film with a thickness of 0.05mm as the backing film 1, and divide the backing film 1 into a central product area extending along the length direction and product areas on both sides. Use a round knife to cut the backing film 1 in the center along the product area in the middle, leaving a straight gap 11 on the backing film 1 . The blade of the round knife is a single blade, and the tangent should be small. While cutting with a round knife, a half-cross positioning mark 12 is made on the non-product area of ​​the backing film 1, and the resulting backing film 1 after cutting is as follows: figure 1 shown.

[0027] S2. Round knife sleeve cutting

[0028] Taking the half-cross positioning mark 12 in step S1 as a ...

Embodiment 2

[0038] This embodiment provides a method for cutting double-sided adhesive tape 2 without a base material according to the present invention. The difference between this method and Example 1 is that the thickness of the silica gel protective film selected in step S1 is 0.075 mm. The thickness of the foam used in step S2 and step S3 is 1.2 mm.

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Abstract

The invention discloses a cutting method for non-substrate double faced adhesive tape. The cutting method comprises the following steps that S1, a backing film is compounded on a carrier tape, the carrier tape and the backing film are cut off centrally along a product zone by using a circular cutter, and a straight gap is formed; S2, the non-substrate double faced adhesive tape is compounded on the product zone of the carrier tap, sleeve cutting is conducted through the circular cutter along the gap obtained in the step S1, and a non-substrate double faced adhesive tape material in the determined shape is obtained; and S3, a transferring film is compounded on the non-substrate double faced adhesive tape material, the non-substrate double faced adhesive tape material is subjected to sleevecutting through the circular cutter, layout of the non-substrate double faced adhesive tape material is dressed, then, the backing film is removed along the gap in two steps, and the non-substrate double faced adhesive tape material is pasted on a product zone of the transferring film. According to the cutting method for the non-substrate double faced adhesive tape, the obtained non-substrate double faced adhesive tape material is not prone to deformation and disengagement and can achieve quantitative production.

Description

technical field [0001] The invention relates to the technical field of double-sided tape cutting, in particular to a method for cutting double-sided tape without a base material. Background technique [0002] Substrate-free double-sided adhesive is directly coated and pressed by acrylic acid adhesive. It has excellent adhesive effect and excellent waterproof performance, can prevent falling off, and has good initial tack and stickiness; it can be applied to a wider temperature range and Harsh environment; long-term temperature resistance is 80-95°C, and short-term temperature resistance can reach 180-205°C. [0003] However, due to the irregularity of the fluidity of the glue, the die-cut product often causes reverse release and poor deformation due to the glue flowing to the non-release area of ​​the knife print, which seriously affects the performance of the double-sided adhesive and affects the production capacity of the product. In addition, during the die-cutting proce...

Claims

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Application Information

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IPC IPC(8): B26D1/00B26D7/27B32B38/00
CPCB26D1/00B26D7/27B32B38/0004
Inventor 朱志敏
Owner DONGGUAN LINGYI PRECISION MFG TECH CO LTD
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