The invention relates to an automatic operating system of welding equipment of lead wires in a semiconductor device, which pertains to the improvement of microelectronic encapsulation equipment from manual to automatic operation. The invention removes a clamp base, a microscope and increases an X-Y two-dimensional electric control platform, a lens, a CCD, a main case, a warning light and a display on the basis of an original manual machine table, the automatic displacement of a clamp or a welding head is realized by the X-Y two-dimensional electric control platform and a step motion control card in the main case, the CCD, the lens and an image collection card in the main case are arranged above the welding head to realize the automatic identification of the chip, and the automatic control of the welding is realized by a main control computer in the main case, so as to become the equipment for automatic welding. The invention can improve the product quality and the production efficiency, ensure the consistency and stability of the welding wires, save the human resources and reduce the labor intensity. The invention can greatly improve the application range and using value of a welding wire machine. The invention is high-tech microelectronic production equipment which integrates precision machinery, automatic control, image identification, computer application, ultrasonic welding and other various fields.