An automatic operation system of inner leading bonding device of semiconductor device
A technology of welding equipment and operating system, which is applied in the improvement field of microelectronic packaging equipment from manual to automatic, which can solve the problems of high human resources and labor intensity, unstable work efficiency, inconsistent product performance, etc., and reduce labor intensity , Improve the scope of application and use value, and ensure the effect of consistency and stability
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[0017] The present invention will be described in detail below with reference to the accompanying drawings. Take the manual ultrasonic aluminum wire welding machine as an example. The welding spot alignment of the original manual ultrasonic aluminum wire welding machine is observed by human eyes using a microscope, and the operator is constantly staring at the welding. Area, the damage to human eyes is great, due to people's misoperation when they are tired or not concentrated, resulting in a high product rejection rate and a decline in product quality. The improved model removes the microscope 6 on the original welding machine, and replaces it with the lens 9, CCD10, and the image acquisition card in the main box 7 to realize the image acquisition of the chip, and automatically identify the position of the chip through software processing. Free manpower and improve product quality.
[0018] The fixture displacement on the original manual ultrasonic aluminum wire welding machine i...
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