The invention relates to a modified
epoxy resin of
monocrystalline silicon rod
cutting glue. The modified
epoxy resin of the
monocrystalline silicon rod
cutting glue comprises the following raw materials comprising a component A and a component B, wherein the component A comprises 35 to 78 percent of
epoxy resin, 20 to 60 percent of
toughening agent, 0.5 to 2 percent of defoaming agent and 0.5 to 3 percent of
coupling agent; and the component B comprises 48 to 69 percent of polymerized mercaptan, 30 to 50 percent of alicyclic modified amine and 1 to 5 percent of accelerator. The modified epoxy resin has a high degumming property and can reduce sheet-falling rate. According to epoxy
silane,
toughness and
temperature resistance of an alicyclic amine material are achieved and low
surface tension of the whole
system is achieved, so that the whole
levelling property of the
system is improved in the whole gluing process. A
hydrolysis reaction can be performing on a
silane bond and the hydroxy on the surface of glass and the surface of a
silicon wafer, so that the adhesion to the surface of the glass and the surface of the
silicon wafer is improved. In addition, the
system is toughened, the water-absorbing rate of the system after the alicyclic amine is modified is increased and the heat-resistant temperature TG is reduced, so that a sheet-falling phenomenon does not exist in the
cutting and spraying processes, and the resin can be degummed quickly in the process of heating to 40 to 50 DEG C in the state of high water absorbability and
softening after heating. The modified epoxy resin is applied to
monocrystalline silicon rod cutting and has an extremely important effect on the monocrystalline
silicon wafer industry.