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Fixing glue for cutting silicon crystal as well as preparation method and application thereof

A silicon crystal, curing glue technology, applied in the direction of bonding methods, adhesives, epoxy resin glue, etc., can solve problems such as poor bonding performance, and achieve the effect of reducing fluidity, stable storage performance, and stable chemical properties

Inactive Publication Date: 2018-12-21
江苏乐美新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Such as a sapphire cutting adhesive disclosed in the Chinese patent with the authorized announcement number "CN103525356B", the sapphire cutting adhesive prepared by the above-mentioned patent has the characteristics of strong bonding strength; but the prepared sapphire The fixing glue for cutting is only suitable for cutting sapphire, but for other crystal seeds, the bonding performance is poor

Method used

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  • Fixing glue for cutting silicon crystal as well as preparation method and application thereof
  • Fixing glue for cutting silicon crystal as well as preparation method and application thereof
  • Fixing glue for cutting silicon crystal as well as preparation method and application thereof

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Embodiment 11

[0048] A preparation method for curing glue for silicon crystal cutting, comprising the following steps:

[0049] Step 1: preparation of anaerobic adhesive;

[0050] Step 1.1: Take 25-35 parts of polyurethane acrylate, 20-30 parts of hydroxyethyl methacrylate, 15-20 parts of organic polyether acrylate, 5-15 parts of polyethylene glycol dimethacrylate, 20-30 parts Parts of linear cycloaliphatic epoxy resin and 1-3 parts of acrylic acid are mixed to form mixture A;

[0051] Step 1.2: Heat the mixture A prepared in step 1.1 to 40-45 °C, keep stirring for 2-2.5 hours and then cool down to room temperature;

[0052]Step 1.3: To the mixture prepared in Step 1.2, add 1-2 parts of tert-butyl peroxybenzoate, 1-2 parts of N,N-dimethylaniline, 1-2 parts of After amine, 0.01 part of polymerization inhibitor and 1-5 parts of coupling agent, stir evenly to form mixture B;

[0053] Step 1.4: After evacuating the mixture B prepared in step 1.3 to a vacuum degree of 0.95-0.98, filter to obt...

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Abstract

The invention relates to fixing glue for cutting a silicon crystal as well as a preparation method and application thereof. The fixing glue is prepared form anaerobic glue and a surface accelerator, wherein the anaerobic glue is a single-component sealing adhesive prepared by utilizing an oxygen free radical polymerization inhibition principle; the anaerobic glue has the advantages of good curingspeed, storage stability, bonding strength, chemical medium resistance, easy for degumming and the like, so that the anaerobic glue is used for cutting and fixing various gemstones and crystals in recent years; the anaerobic glue prepared in the scheme has high bonding strength, a rapid curing speed and rapid and complete degumming, and damages to cut gemstones and adhesion strength are not easy to cause; the dosage of organic silicon polyether acrylate, linear cycloaliphatic epoxy resin and tert-butyl peroxybenzoate is increased and part of organic silicon groups are introduced, so that the flowability of the anaerobic glue is reduced, rapid degumming is convenient to realize and adhesion between the anaerobic glue and the crystal is reduced; compared with free silicon including silicon dioxide and the like, the organic silicon groups do not easily form other silicon impurities on the surface of the crystal in a curing and adhesion or degumming process.

Description

technical field [0001] The invention relates to a fixing glue for cutting, in particular to a fixing glue for silicon crystal cutting and a preparation method thereof. Background technique [0002] Krieble invented anaerobic adhesives with practical value in the late 1950s, and anaerobic adhesives have developed rapidly since then. Anaerobic adhesives are widely used in aerospace, electronic appliances, automobile industry and other fields due to their characteristics of convenient use, room temperature curing, and chemical medium resistance. [0003] Silicon crystal cutting is a critical step in making silicon crystals, and the cutting process of silicon crystals is an important factor in making silicon crystals good or bad; as far as the cutting process is concerned, there are many influencing factors; in addition to process factors, the fixing glue during cutting Selection is also very important. Fixing glue with excellent performance can eliminate some hidden dangers in...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J171/00C09J171/02C09J163/00C09J11/06C09J11/08C09J5/04
CPCC09J175/14C08L2205/035C09J5/04C09J11/06C09J11/08C09J163/00C08L71/00C08L71/02C08L63/00C08K5/00C08K5/14C08K5/18C08K5/46C08L75/14
Inventor 刘欢欢韦祖睦袁光明
Owner 江苏乐美新材料科技有限公司
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