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One-component anaerobic silicon chip bottom glue and preparation method thereof

An anaerobic silicon, one-component technology, applied in chemical instruments and methods, adhesives, transportation and packaging, etc., can solve the problem that can not meet the customer's 30min degumming time, is difficult to adapt to the industry trend of efficient diamond wire cutting, and is difficult to adapt to cutting Process high-speed flow and other problems, to achieve the effect of fast and efficient bonding, high shear strength, and reducing manpower and material resources

Active Publication Date: 2021-10-15
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional bonding auxiliary material uses two-component epoxy glue. Before use, the two groups of A and B need to be weighed and mixed together and stirred evenly before the glue can be applied and bonded. The bonding preparation time is long, and the initial curing time is 8 -10 minutes, it is difficult to improve production efficiency, it is difficult to adapt to the high-speed flow of the current cutting process, and it is difficult to adapt to the industry trend of high-efficiency diamond wire cutting
One-component glue and two-component glue have higher bonding efficiency, but the current one-component glue on the market cannot meet the customer's 30min degumming time at 90°C

Method used

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  • One-component anaerobic silicon chip bottom glue and preparation method thereof

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Comparison scheme
Effect test

Embodiment 1

[0038] A kind of one-component anaerobic silicon slice floor glue, wherein, comprise the raw material of following weight portion: take gram as unit, wherein:

[0039] Hydroxypropyl methacrylate 50, difunctional urethane acrylate 30, polymerization inhibitor p-hydroxyanisole 0.05, accelerator saccharin 1, complexing agent edetate disodium 0.02 and initiator cumene hydroperoxide 1. Methylpropylene glycol 1, polyethylene glycol (200) dimethacrylate 1 and microsphere blowing agent 1.

[0040] The preparation method of the one-component anaerobic silicon slice bottom plate adhesive is as follows: wipe the stirring tank clean to ensure that there are no impurities that affect the reaction; start the stirring tank, and turn on the temperature control device to control the temperature at 30°C, and add methacrylic acid to the reaction tank Hydroxypropyl ester, difunctional urethane acrylic resin, methyl propylene glycol, polyethylene glycol (200) dimethacrylate were stirred for 60 min...

Embodiment 2

[0042] A kind of one-component anaerobic silicon slice floor glue, wherein, comprise the raw material of following weight portion: take gram as unit, wherein:

[0043] Hydroxypropyl methacrylate 55, difunctional urethane acrylate 40, polymerization inhibitor p-hydroxyanisole 0.08, accelerator saccharin 1.5, complexing agent edetate disodium 0.06, initiator cumene hydroperoxide 3. Methylpropylene glycol 2, polyethylene glycol (200) dimethacrylate 2 and microsphere foaming agent 3.

[0044] The preparation method of the one-component anaerobic silicon slice bottom plate adhesive is as follows: wipe the stirring tank clean to ensure that there are no impurities that affect the reaction; start the stirring tank, and turn on the temperature control device to control the temperature at 30°C, and add methacrylic acid to the reaction tank Hydroxypropyl ester, difunctional urethane acrylic resin, methyl propylene glycol, polyethylene glycol (200) dimethacrylate were stirred for 60 minu...

Embodiment 3

[0046] A kind of one-component anaerobic silicon slice floor glue, wherein, comprise the raw material of following weight portion: take gram as unit, wherein:

[0047] Hydroxypropyl methacrylate 60, difunctional urethane acrylate 50, polymerization inhibitor p-hydroxyanisole 0.1, accelerator saccharin 2, complexing agent edetate disodium 0.1 and initiator cumene hydroperoxide 5. Methylpropylene glycol 3, polyethylene glycol (200) dimethacrylate 3 and microsphere blowing agent 5.

[0048]The preparation method of the one-component anaerobic silicon slice bottom plate adhesive is as follows: wipe the stirring tank clean to ensure that there are no impurities that affect the reaction; start the stirring tank, and turn on the temperature control device to control the temperature at 30°C, and add methacrylic acid to the reaction tank Hydroxypropyl ester, difunctional urethane acrylic resin, methyl propylene glycol, polyethylene glycol (200) dimethacrylate were stirred for 60 minute...

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Abstract

The invention discloses a single-component anaerobic silicon slice bottom plate adhesive, which comprises the following raw materials in parts by weight: 50-60 parts of hydroxypropyl methacrylate, 30-50 parts of polyurethane acrylate, 0.05-0.1 parts of polymerization inhibitor, and accelerator 1-2, complexing agent 0.02-0.1 and initiator 1-5; also include: methyl propylene glycol 1-3, polyethylene glycol dimethacrylate 1-3 and foaming agent 1-5. The one-component anaerobic silicon slice floor adhesive of the present invention, compared with the conventional two-component adhesive, does not require glue mixing time, and the initial curing time is about 40s. Degumming is convenient and fast, reduces manpower and material resources, greatly speeds up the production rhythm, and meets the needs of rapid and efficient industry development.

Description

technical field [0001] The invention relates to the technical field of diamond wire cutting silicon chip adhesive in the photovoltaic industry, more specifically, the invention relates to a single-component anaerobic silicon slice bottom plate adhesive and a preparation method thereof. Background technique [0002] Solar silicon wafer cutting is an important link in the manufacture of photovoltaic solar cells. How to improve the cutting efficiency of the cutting process and reduce unnecessary time waste is the focus of the company's attention, and the length of time for bonding auxiliary materials directly affects the work efficiency of the entire cutting process. [0003] The traditional bonding auxiliary material uses two-component epoxy glue. Before use, the two groups of A and B need to be weighed and mixed together and stirred evenly before the glue can be applied and bonded. The bonding preparation time is long, and the initial curing time is 8 -10 minutes, it is diffi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J11/06B01F7/18C08J9/32
CPCC09J175/14C09J11/06C08J9/32C08J2375/14C08J2203/22B01F27/90C08K5/053C08K5/103
Inventor 潘方立伍世钰高满苏光临陈韬
Owner 广西珀源新材料有限公司
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