Silicon wafer degumming agent, manufacturing method and use method thereof

A degumming agent and silica gel technology, applied in chemical instruments and methods, detergent compositions, soap detergent compositions, etc., can solve the problems of poor degumming effect, high degumming cost, strong corrosiveness, etc. No irritating odor, low cost effect

Inactive Publication Date: 2015-08-26
武汉宜田科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the purpose of the present invention is to provide a degumming speed, no irritating smell, low cost, weak corrosion and can effectively reduce the chip chipping rate, and provide excellent pre-cleaning effect for the next cleaning process. Silicon wafer degumming agent to solve the defects of poor degumming effect, high degumming cost and strong corrosion of existing degumming agents

Method used

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  • Silicon wafer degumming agent, manufacturing method and use method thereof
  • Silicon wafer degumming agent, manufacturing method and use method thereof

Examples

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Embodiment 1

[0028] What this embodiment adopts is a kind of silicon wafer degumming agent, according to percentage by weight, it comprises 2-hydroxysuccinic acid 30%; Isomerized alcohol polyoxyethylene ether 2%; Dipropylene glycol 15%; Water 52%; Imidazole 0.5% of morphine; 0.5% of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0029] The present invention also provides a method for preparing a silicon wafer degumming agent, which is to put the materials in the above ratio into a reaction kettle, fully stir and mix them at room temperature for 3 hours, and obtain the silicon wafer degumming agent A1 of the present invention until uniformly mixed.

Embodiment 2

[0031] What the present embodiment adopts is a kind of silicon wafer degumming agent, according to percentage by weight, it comprises 2,3-dihydroxysuccinic acid 25%; Sodium lauryl sulfate 3%; 2,2-dimethylol butanol 20%; water 51%; imidazoline 0.5%; polyoxypropylene glyceryl ether 0.5%.

[0032] The present invention also provides a method for preparing the silicon wafer degumming agent, which is to put the materials in the above ratio into a reaction kettle, and carry out sufficient stirring and mixing at room temperature for 3 hours until the silicon wafer degumming agent A2 of the present invention is obtained through uniform mixing.

Embodiment 3

[0034] What the present embodiment adopts is a kind of silicon wafer degumming agent, according to percentage by weight, it comprises glycolic acid 55%; Octylphenol polyoxyethylene ether 3%; Diacetone alcohol 25%; Water 16%; Methanol 0.5% ; Polyoxyethylene polyoxypropylene pentaerythritol ether 0.5%.

[0035] The present invention also provides a method for preparing the silicon wafer degumming agent, which is to put the materials in the above ratio into a reaction kettle, and carry out sufficient stirring and mixing at room temperature for 3 hours until the silicon wafer degumming agent A3 of the present invention is obtained through uniform mixing.

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Abstract

The invention relates to a silicon wafer degumming agent, which comprises, by weight, 20-60% of an organic acid, 0.5-5% of a surfactant, 5-40% of an organic solvent, 15-75% of water, 0-2% of a corrosion inhibitor, and 0-2% of an antifoaming agent. The present invention provides the silicon wafer degumming agent with characteristics of rapid degumming, no irritating odor, low cost, weak corrosion, effective reduction of wafer and edge breaking rate, and provision of excellent pre-washing effect for the next washing step so as to solve defects of poor degumming effect, high degumming cost, and strong corrosion of the existing degumming agent.

Description

technical field [0001] The invention belongs to the field of solar silicon wafer production, and in particular relates to a silicon wafer debonding agent, its manufacturing method and its application method. Background technique [0002] During the production of solar silicon wafers, silicon ingots need to be cut into sheets. Before wire cutting, the silicon ingot is first bonded to a glass plate or a resin plate by glue. After the cutting is completed, put the cutting jig, cutting substrate and the cut silicon wafer into the degumming machine together, and perform spray washing and degumming to completely separate the silicon wafer from the glue layer. At present, the common degumming process steps in the industry are: 1. Spraying. The silicon wafer is sprayed with a certain pressure of water, the purpose of which is to wash a large area of ​​dirt such as mortar covering the surface of the silicon wafer; 2. Ultrasound. In the tank of this process, the silicon wafer is cl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D10/02
Inventor 洪育林张旭张震张冠刘辉
Owner 武汉宜田科技发展有限公司
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