A low-smelting-point CuP-base intermediate alloy contains Cu, P, Si, Ni, Sb, Bi, Mn and Ag, and is prepared through proportioning pure Cu, red P, crystal Si, electrolytic Ni, pure Sb, pure Bi, and electrolytic Mn and Ag, pulverizing crystal Si, mixing with red P, wrapping by Cu foil, smelting electrolytic pure Cu, sequentially adding others, stirring, and casting ingot or atomizing to become particles. Its advantages are no pollution, low density and smelting point, and stable modifying effect.