4results about How to "Good insulation" patented technology

The application discloses a movable component and a relay. The movable component comprises a push rod, an insulating base, a plurality of contact supports, a plurality of active contact pieces and an insulating piece. The plurality of active contact pieces are respectively arranged in the plurality of contact supports. The push rod, the plurality of contact supports and the insulating piece are connected through the insulating base. The plurality of contact supports are arranged at intervals, and each contact support is in contact with the insulating piece.

The utility model discloses an insulating shoe using composite insulating layer relates to insulating shoe technical field using composite insulating layer, including sole and vamp, specifically be the top fixed connection of sole has the upper, and the sole is composed of rigid layer, first insulating layer, second insulating layer and third insulating layer, and the order of the sole from below to top is rigid layer, first insulating layer, second insulating layer and third insulating layer in proper order, and the upper is composed of first insulating layer, second insulating layer, third insulating layer and fourth insulating layer, and the order of the upper from outside to inside is first insulating layer, second insulating layer, third insulating layer and fourth insulating layer in proper order, and the vamp is composed of first insulating layer, second insulating layer, third insulating layer and fifth insulating layer, and the order of the vamp from above to below is first insulating layer, second insulating layer, third insulating layer and fifth insulating layer in proper order, and the material of rigid layer is natural rubber and the thickness is greater than two centimeters, and the utility model discloses can provide better insulating protection for the worker foot.

The utility model discloses a kind of glue-doped pieces of ultralow glue overflow amount, covering film, tape glue copper foil substrate and cover plate, including ultralow glue overflow amount glue adhesive layer, polyimide film or coating type polyimide layer, the thickness of the ultralow glue overflow amount glue adhesive layer is 0.5-5 μm.The utility model has excellent flatness, operability, insulating property and thermal stability, and because ultralow glue overflow amount glue adhesive layer is very thin, glue overflow amount is very low, can be used for the compounding of material, thickness reduction, forming, and can be adapted to the process conditions of circuit board technology.

The utility model discloses a conductive heat dissipation buffer gasket for a computer mainboard. The conductive heat dissipation buffer gasket comprises a silica gel protective film and a gasket main body assembly, the silica gel protective film is attached to the middle of the gasket body assembly. The gasket main body assembly comprises a silica gel block, a double-sided adhesive layer, a single-sided copper foil adhesive tape assembly and a single-sided mylar adhesive tape assembly; the silica gel block is attached to the silica gel protective film, the size of the silica gel block is smaller than that of the single-face copper foil adhesive tape assembly, and the silica gel block is located in the middle of the single-face copper foil adhesive tape assembly; the single-sided mylar adhesive tape assembly is arranged between the single-sided copper foil adhesive tape assemblies; a foam block is attached to the position, not provided with the silica gel block, of the single-face copper foil adhesive tape assembly. The buffer protection device has excellent conductive, heat dissipation, buffer and shielding functions, and can realize different buffer protection effects.