The invention relates to the technical field of
copper-clad plates, in particular to a resin composition, a resin-coated
copper foil produced by the same and a
copper-clad plate produced by the resin-coated
copper foil. The resin composition comprises the following components in percentage by weight: 45 to 80 percent of
epoxy resin mixture, 15 to 50 percent of stuffing, 1 to 8 percent of curing agent, 0.01 to 2 percent of curing accelerator, and a proper amount of
solvent. The resin composition is used to prepare the resin-coated
copper foil, and then the resin-coated
copper foil is used to produce the copper-clad plate so as to change the prior manufacturing method of copper-clad plates with high
comparative tracking index and solve the technical problems of dry flowers, cloth mark
exposure and inadequate thickness accuracy of the copper-clad plate and the like; the resin-coated copper foil also has the characteristics of long storage period, easy management and convenient use; and the resin-coated copper foil has a thin insulating
dielectric layer, and is convenient to produce thin copper-clad plates with high
comparative tracking index characteristic and multi-layer printed circuit boards.