Hot isostatic pressing preparation method of high-density molybdenum-copper alloy

Abstract

The invention discloses a hot isostatic pressing preparation method of a high-density molybdenum-copper alloy and the hot isostatic pressing preparation method is used for solving the problems that material heat conductivity and device air tightness are influenced by defects such as relatively low relative density, non-uniform component distribution and relatively small sample sizes existing in a process of preparing a molybdenum-copper alloy by using an existing method. The hot isostatic pressing preparation method comprises the following steps: performing ball milling on weighed raw materials, firstly preparing a cold-pressed billet, and then removing a low-density oxide phase by virtue of hydrogen reduction. By adopting a high-vacuum hot isostatic pressing dense sintering method, the density problem of the molybdenum-copper alloy can be successfully solved, the sintering temperature can also be greatly reduced, interface structures of the materials can be effectively controlled, uniform distribution of components can be achieved, and the heat-conducting properties of the materials can be optimized. By adopting the hot isostatic pressing preparation method disclosed by the invention, the molybdenum-copper alloy with high density, high copper content and large size can be successfully prepared, requirements of electronic packaging and heat sink materials for the properties such as material strength and heat conductivity can be met, relatively good market application prospects can be achieved, and the molybdenum-copper alloy is worthy of being popularized and applied in large scale.

Description

technical field [0001] The invention relates to the field of materials, in particular to the field of electronic packaging and heat sink materials, in particular to a method for preparing high-density molybdenum-copper alloy by hot isostatic pressing. The molybdenum-copper alloy with high density, high copper content and large size can be prepared by adopting the invention, which is especially suitable for collector parts of traveling wave tubes and has good application prospects. Background technique [0002] Traditional electronic packaging materials mainly include Invar (Chinese name: Invar alloy, that is, an iron alloy containing 35.4% nickel), Kovar (Chinese name: Kovar alloy), pure Mo, pure W, Cu, Al, etc. Among them, Invar and Kovar have poor thermal conductivity; while pure Mo and pure W are difficult to process and have high density; the thermal expansion coefficients of Cu and Al are too large, which is prone to thermal stress problems. Based on the above shortcom...

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of low relative density, uneven composition distribution, small sample size and other defects that affect the thermal conductivity of materials and air tightness of devices when molybdenum-copper alloys are prepared by existing methods, and provide A hot isostatic pressing method for preparing high-density molybdenum-copper alloy

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