The invention discloses a
hot isostatic pressing preparation method of a high-density
molybdenum-
copper alloy and the
hot isostatic pressing preparation method is used for solving the problems that material heat
conductivity and device
air tightness are influenced by defects such as relatively low
relative density, non-uniform component distribution and relatively
small sample sizes existing in a process of preparing a
molybdenum-
copper alloy by using an existing method. The
hot isostatic pressing preparation method comprises the following steps: performing ball milling on weighed raw materials, firstly preparing a cold-pressed billet, and then removing a low-density
oxide phase by virtue of
hydrogen reduction. By adopting a high-vacuum hot isostatic pressing dense
sintering method, the density problem of the
molybdenum-
copper alloy can be successfully solved, the
sintering temperature can also be greatly reduced, interface structures of the materials can be effectively controlled, uniform distribution of components can be achieved, and the heat-conducting properties of the materials can be optimized. By adopting the hot isostatic pressing preparation method disclosed by the invention, the molybdenum-
copper alloy with
high density,
high copper content and
large size can be successfully prepared, requirements of
electronic packaging and
heat sink materials for the properties such as material strength and heat
conductivity can be met, relatively good market application prospects can be achieved, and the molybdenum-
copper alloy is worthy of being popularized and applied in large scale.