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Multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and preparation method thereof

A technology of borosilicate glass and aluminum nitride ceramics, which is applied in the field of electronic packaging materials, can solve problems such as limited applications, and achieve the effects of low cost, simple process flow, and high thermal conductivity

Inactive Publication Date: 2014-02-05
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the above-mentioned existing literature reports, although the sintering temperature of the material meets the requirements of low-temperature sintering, and the performance is good, but these systems are sintered by hot pressing in the sintering process, which greatly limits their practical application.

Method used

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  • Multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and preparation method thereof
  • Multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and preparation method thereof
  • Multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0019] In a specific embodiment of the present invention, the mass percentage content of each oxide in the multi-component borosilicate glass is as follows:

[0020]

[0021] The preparation method of the low-temperature co-fired ceramic material in this embodiment comprises the following steps:

[0022] (1) Preparation of low-melting-point glass raw materials: weigh the corresponding amount of CaCO according to the mass percentage content of each oxide required for the above-mentioned low-melting-point glass phase 3 、BaCO 3 、H 3 BO 3 , SiO 2 , Li 2 CO 3 , ZnO, Al 2 o 3 ingredients, and mix well.

[0023] (2) Preparation of low-melting point glass: raise the high-temperature continuous glass melting furnace to 1450°C, then evenly add the above-mentioned mixed glass raw materials into the quartz crucible in the glass melting furnace, and use deionized water to accept the glass that flows out from the outlet of the quartz crucible. Glass melt to obtain glass frit. T...

Embodiment 2

[0028] In a specific embodiment of the present invention, the mass percentage content of each oxide in the multi-component borosilicate glass is as follows:

[0029]

[0030] (1) Preparation of low-melting-point glass raw materials: weigh the corresponding amount of CaCO according to the mass percentage content of each oxide required for the above-mentioned low-melting-point glass phase 3 、BaCO 3 、H 3 BO 3 , SiO 2 , Li 2 CO 3 , ZnO, Al 2 o 3 ingredients, and mix well.

[0031] (2) Preparation of low-melting point glass: raise the high-temperature continuous glass melting furnace to 1450°C, then evenly add the above-mentioned mixed glass raw materials into the quartz crucible in the glass melting furnace, and use deionized water to accept the glass that flows out from the outlet of the quartz crucible. Glass melt to obtain glass frit. The obtained glass frit was first ground with an alumina mortar to obtain a uniform coarse glass powder, and then ball milled for 18 ...

Embodiment 3

[0037] In a specific embodiment of the present invention, the mass percentage content of each oxide in the multi-component borosilicate glass is as follows:

[0038]

[0039] (1) Preparation of low-melting-point glass raw materials: weigh the corresponding amount of CaCO according to the mass percentage content of each oxide required for the above-mentioned low-melting-point glass phase 3 、BaCO 3 、H 3 BO 3 , SiO 2 , Li 2 CO 3 , ZnO, Al 2 o 3 ingredients, and mix well.

[0040] (2) Preparation of low-melting point glass: raise the high-temperature continuous glass melting furnace to 1450°C, then evenly add the above-mentioned mixed glass raw materials into the quartz crucible in the glass melting furnace, and use deionized water to accept the glass that flows out from the outlet of the quartz crucible. Glass melt to obtain glass frit. The obtained glass frit was first ground with an alumina mortar to obtain a uniform coarse glass powder, and then ball milled for 18 ...

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Abstract

The invention relates to a multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and a preparation method thereof. The material comprises a low-melting point multi-component glass phase and an aluminum nitride ceramic phase, wherein the mass fraction of the low-melting point glass phase in the composite material is 50-70 wt%. The sintering temperature of the low-temperature co-fired composite material prepared by the preparation method is low, the sintering can be realized at the temperature of 750-850 DEG C, and the sintering temperature is far lower than an upper limit (950 DEG C) of the sintering temperature of the existing LTCC (low-temperature co-fired ceramic) material; the thermal conductivity of the composite material is relatively high, and the obtained material has the advantages of high density and low porosity. In addition, the process flow for preparing the material is simple, and the cost is low.

Description

technical field [0001] The invention relates to a low sintering temperature, low dielectric constant and relatively high thermal conductivity multi-component borosilicate glass+aluminum nitride ceramic low-temperature co-fired composite material and a preparation method thereof, belonging to the field of electronic packaging materials. Background technique [0002] With the rapid development of microelectronics technology, electronic circuits are increasingly miniaturized and integrated. However, the development of electronic packaging technology has not been matched with it, which has become a bottleneck restricting the continued development of microelectronic technology. At present, low temperature cofired ceramics (Low Temperature Cofired Ceramics, LTCC) technology is widely used in the modular design of multilayer chip lines. It has good application prospects in terms of customization, design diversity and excellent high-frequency performance. [0003] At present, the ...

Claims

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Application Information

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IPC IPC(8): C04B32/00C03C3/066
Inventor 杨德安袁利娜申娜娜
Owner TIANJIN UNIV
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