Multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and preparation method thereof

A technology of borosilicate glass and aluminum nitride ceramics, which is applied in the field of electronic packaging materials, can solve problems such as limited applications, and achieve the effects of low cost, simple process flow, and high thermal conductivity
CN103553558AInactive Publication Date: 2014-02-05TIANJIN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TIANJIN UNIV
Publication Date
2014-02-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a multi-component borosilicate glass and aluminum nitride low-temperature co-fired ceramic material and a preparation method thereof. The material comprises a low-melting point multi-component glass phase and an aluminum nitride ceramic phase, wherein the mass fraction of the low-melting point glass phase in the composite material is 50-70 wt%. The sintering temperature of the low-temperature co-fired composite material prepared by the preparation method is low, the sintering can be realized at the temperature of 750-850 DEG C, and the sintering temperature is far lower than an upper limit (950 DEG C) of the sintering temperature of the existing LTCC (low-temperature co-fired ceramic) material; the thermal conductivity of the composite material is relatively high, and the obtained material has the advantages of high density and low porosity. In addition, the process flow for preparing the material is simple, and the cost is low.
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Description

technical field

[0001] The invention relates to a low sintering temperature, low dielectric constant and relatively high thermal conductivity multi-component borosilicate glass+aluminum nitride ceramic low-temperature co-fired composite material and a preparation method thereof, belonging to the field of electronic packaging materials. Background technique

[0002] With the rapid development of microelectronics technology, electronic circuits are increasingly miniaturized and integrated. However, the development of electronic packaging technology has not been matched with it, which has become a bottleneck restricting the continued development of microelectronic technology. At present, low temperature cofired ceramics (Low Temperature Cofired Ceramics, LTCC) technology is widely used in the modular design of multilayer chip lines. It has good application prospects in terms of customization, design diversity and excellent high-frequency performance.

[0003] At present, the ...

Claims

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