Manufacturing method for high-copper-silicon magnesium powder metallurgy aluminum alloy
A powder metallurgy and aluminum alloy technology, which is applied to the preparation of high-silicon copper-magnesium powder metallurgy aluminum alloy materials, aluminum alloys and powder metallurgy fields, can solve the problems of low mechanical properties, high brittleness, poor temperature resistance, etc., and achieves the preparation method. Simple, high density, low cost effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0040] The high-silicon copper-magnesium-based aluminum alloy powder used in Example 1 includes the following components in terms of mass percentage:
[0041] Si17.5%;
[0042] Cu4.6%;
[0043] Mg0.6%;
[0044] The balance is Al and unavoidable impurities.
[0045] The particle size of the high-silicon copper-magnesium aluminum alloy powder in this embodiment is 150 microns.
[0046] The high-silicon copper-magnesium-based aluminum alloy powder was molded at room temperature (pressing pressure 200 MPa), the green compact was sintered at 480°C for 10 h, and the sintering atmosphere was high-purity nitrogen, and then the sintered billet was hot-extruded, and the hot-extrusion temperature was 390°C, the speed of hot extrusion is 1.0m / min; (the extrusion ratio is 10:1) the extruded profile is subjected to solution treatment, solid solution at 480°C for 12 hours, and water quenched at room temperature after being released from the furnace, and the quenching temperature is 20°C; ...
Embodiment 2
[0051] The high-silicon copper-magnesium-based aluminum alloy powder used in Example 2 includes the following components in terms of mass percentage:
[0052] Si23.0%;
[0053] Cu3.5%;
[0054] Mg1.0%;
[0055] The balance is Al and unavoidable impurities.
[0056] The particle size of the high-silicon copper-magnesium aluminum alloy powder in this embodiment is 80 microns.
[0057] The high-silicon copper-magnesium-based aluminum alloy powder was molded at room temperature, and the compact was vacuum sintered at 495°C for 8 hours at a vacuum degree of 0.001-0.1Pa, and then the sintered billet was hot-extruded (extrusion ratio 8:1). The extrusion temperature is 400°C, and the speed of hot extrusion is 0.8m / min; the extruded profile is subjected to solution treatment, solid solution at 490°C for 8 hours, and quenched in water at room temperature after being released from the furnace, and the quenching temperature is 30°C; the quenched aluminum alloy profile is immediately P...
Embodiment 3
[0062] Its raw material powder used is completely consistent with embodiment 1.
[0063] The high-silicon copper-magnesium-based aluminum alloy powder was molded at room temperature, and the compact was sintered at 510°C for 4 hours. The sintering atmosphere was high-purity argon, and then the sintered billet was hot-extruded. The speed is 0.3m / min (extrusion ratio 12:1); the extruded profile is subjected to solution treatment, solid solution at 510°C for 1 hour, and oil quenched at room temperature after being released from the furnace, and the quenching temperature is 80°C; the quenched aluminum alloy profile is immediately aged treatment and aging at 195°C for 4 hours to obtain a high-silicon copper-magnesium powder metallurgy aluminum alloy. , see the organization Image 6 . The room temperature tensile strength of the obtained finished product is 403 MPa, the Brinell hardness is 145, and the elongation is 9%. At 100℃, the tensile strength is 381MPa, the Brinell hardnes...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
tensile strength | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com