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High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate

A ceramic substrate and high-power technology, which is applied in the field of ceramic substrates for high-power LED heat dissipation, can solve problems that affect the light emission of LED light-emitting chips, affect the service life of LED lamps, and increase the temperature of lamp cups, and achieve excellent heat resistance and bending resistance. The effect of high strength and large thermal conductivity

Inactive Publication Date: 2016-01-27
SUZHOU ZHIRUI PHOTOELECTRIC MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] LED lights mainly include LED chips and lamp cups. Usually, LED chips are formed by connecting LED light-emitting chips to the heat dissipation substrate in the form of gold wire, eutectic or flip chip, and then the LED chips are fixed on the circuit board of the system. The heat dissipation substrate plays the triple role of heat dissipation, conduction, and insulation. The existing heat dissipation substrates are mainly metal substrates, and the most common ones are copper substrates and aluminum substrates. The common feature of these two substrates is that they have good electrical conductivity. However, this The technology of connecting metal-like substrates to LED light-emitting chips has the disadvantages of poor heat dissipation and poor insulation
The heat dissipation performance directly affects the service life of the LED lamp, because the light generated by the LED light-emitting chip does not contain ultraviolet rays and infrared rays when it is working, so its light cannot take away heat, which means that most of the electric energy is converted into heat. Distributed around the chip, and the junction temperature of the LED light-emitting chip is generally between 60-75 ° C, the heat accumulated for a long time that has not been dissipated in time makes the temperature in the lamp cup continue to rise, which in turn affects the light emission of the LED light-emitting chip , affecting the service life of LED lights

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1) Preparation of composite sintering aid

[0025] Disperse 40 kg of silicon powder, 8 kg of aluminum powder, 22 kg of kaolin powder, and 30 kg of calcium fluoride in 200 kg of absolute ethanol, soak for 20 minutes; then stir in a fume hood while blowing with hot air until there is no water The ethanol is completely dried to obtain a mixed powder, which is a composite sintering aid;

[0026] 2) Preparation of ceramic slurry

[0027] Add 70 kg of flaky micro-crystal form high-temperature calcined α-alumina powder with an average particle size of 3.5 μm, 4 kg of melamine, 6 kg of hydroxymethyl cellulose, 10 kg of deionized water and the composite sintering aid prepared in step (1) in sequence 10 kilograms carry out wet ball milling, ball milling 2 hours, make gelatable ceramic slurry, this ceramic slurry is carried out vacuum stirring defoaming;

[0028] 3) Ceramic molding

[0029] Press the ceramic slurry prepared in step (2) into the mold from the bottom of the mold,...

Embodiment 2

[0031] 1) Preparation of composite sintering aid

[0032] Disperse 60 kg of silicon powder, 10 kg of aluminum powder, 20 kg of kaolin powder, and 10 kg of calcium fluoride in 300 kg of absolute ethanol, soak for 20 minutes; then stir in a fume hood while blowing with hot air until there is no water The ethanol is completely dried to obtain a mixed powder, which is a composite sintering aid;

[0033] 2) Preparation of ceramic slurry

[0034] Add successively 75 kilograms of average particle size 1.0 μ m short columnar microscopic crystal form high-temperature calcined α-alumina powder, 8 kilograms of melamine, 3 kilograms of hydroxymethyl cellulose, 6 kilograms of deionized water and the composite sintering aid prepared in step (1) 8 kilograms carry out wet ball milling, and ball milling is 3 hours, makes gelatable ceramic slurry, and this ceramic slurry is carried out vacuum stirring defoaming;

[0035] 3) Ceramic molding

[0036] Press the ceramic slurry prepared in step (...

Embodiment 3

[0038] 1) Preparation of composite sintering aid

[0039] Disperse 50 kg of silicon powder, 5 kg of aluminum powder, 30 kg of kaolin powder, and 15 kg of calcium fluoride in 250 kg of absolute ethanol, soak for 20 minutes; then stir in a fume hood while blowing with hot air until there is no water The ethanol is completely dried to obtain a mixed powder, which is a composite sintering aid;

[0040] 2) Preparation of ceramic slurry

[0041] Add 80 kilograms of average particle size 4.0 μ m flake microscopic crystal form high-temperature calcined α-alumina powder, 3 kilograms of melamine, 4 kilograms of hydroxymethyl cellulose, 8 kilograms of deionized water and the composite sintering aid prepared in step (1) 5 kilograms carry out wet ball milling, ball milling 4 hours, make gelatable ceramic slurry, this ceramic slurry is carried out vacuum stirring defoaming;

[0042] 3) Ceramic molding

[0043] Press the ceramic slurry prepared in step (2) into the mold from the bottom of...

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Abstract

The invention belongs to the technical field of ceramic substrates, and particularly relates to a high-power LED (Light-Emitting Diode) heat dissipation ceramic substrate. The ceramic substrate comprises the following materials in percentage by mass: 70-80 percent of alumina powder, 3-8 percent of melamine, 3-6 percent of hydroxymethyl cellulose, 6-10 percent of deionized water and 5-10 percent of composite sintering aid, wherein the composite sintering aid comprises the following materials in percentage by mass: 40-60 percent of silicon powder, 5-10 percent of aluminum powder, 20-30 percent of kaolin powder and 10-30 percent of calcium fluoride. The ceramic substrate has the advantages of high heat conductivity coefficient, excellent heat resistance, high bending strength and avoidance of the phenomena of bending, wrapping and the like. Through adoption of an appropriate sintering method and selection of an appropriate sintering aid, denseness of an alumina ceramic sintered body is realized, and the heat conductivity of alumina ceramics is increased greatly.

Description

technical field [0001] The invention belongs to the technical field of ceramic substrates, and in particular relates to a ceramic substrate for heat dissipation of high-power LEDs. Background technique [0002] LED lights mainly include LED chips and lamp cups. Usually, LED chips are formed by connecting LED light-emitting chips to the heat dissipation substrate in the form of gold wire, eutectic or flip chip, and then the LED chips are fixed on the circuit board of the system. The heat dissipation substrate plays the triple role of heat dissipation, conduction and insulation. The existing heat dissipation substrates are mainly metal substrates, the most common ones are copper substrates and aluminum substrates. The common feature of these two substrates is that they have good electrical conductivity. However, this The technology of connecting metal-like substrates to LED light-emitting chips has the disadvantages of poor heat dissipation and poor insulation. The heat dissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10
Inventor 左士祥张宇王永飞吕列超于楼云杨阳
Owner SUZHOU ZHIRUI PHOTOELECTRIC MATERIAL TECH CO LTD
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