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Preparation method of ceramic circuit board

A technology of ceramic circuit boards and ceramic substrates, which is applied in the direction of printed circuit manufacturing, printed circuits, and secondary processing of printed circuits, etc., and can solve problems such as poor bonding between the conductive layer and the ceramic substrate, narrow applicable surface, and restrictions on the types of ceramic substrates. Achieve the effect of simple circuit pattern design, easy to obtain and cheap production equipment

Active Publication Date: 2012-09-26
黄石星河电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of this scheme is that it can form a copper layer with better bonding force, but the sintering process needs to be in a protective atmosphere, and the requirements for the sintering furnace are very high, so it is a less economical scheme; in addition, the formed copper layer generally reaches Hundreds of microns, it is impossible to make a relatively thin copper layer; pattern corrosion will also generate a lot of pollution emissions; the types of ceramic substrates are limited, and the applicable surface is narrow
[0008]The steps of CN102254832A are to attach a dry film layer on the ceramic substrate first, then expose and develop the dry film layer to form a preset circuit layout path, and then apply the dry film layer on the ceramic substrate The first metal layer is coated on the substrate and the dry film layer, then the first metal layer is coated with a copper layer, and the dry film layer, the first metal layer and the copper layer on the ceramic substrate are ground, cut and leveled, The dry film layer can be removed from the ceramic substrate, and after forming a copper layer of appropriate height on the ceramic substrate, the second metal layer is electroplated on the surface of the copper layer of the ceramic substrate to complete the manufacture of the ceramic substrate. Precision ceramic substrate but poor bonding
[0010] To sum up, the existing patented technology often has several disadvantages: 1. No selectivity; 2. Unnecessary sewage discharge during the production process; 3. Conductive layer The bonding force with the ceramic substrate is poor; 4. The production equipment is more expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Example 1 Preparation method of ceramic circuit for LED

[0035] 70g of inorganic powder Al 2 o 3 With the binder system (high-density polyethylene (HDPE) 9g, polypropylene (PP) 3g, stearic acid (SA) 1.2g, microcrystalline paraffin (PW) 9g, carnauba wax 6.9g, lubricant MP ( Weikesu MP 20000 (0.9g) from Chemical Co., Ltd. was uniformly mixed in a high-speed mixer, and then granulated by a twin-screw extrusion granulator to obtain rice-shaped feed. The feeding material is injected into a ceramic green body for LED through an injection molding machine. After the ceramic green body is cooled, it is extracted in a trichlorethylene solvent for 4 hours at an extraction temperature of 65° C., and then placed in a sintering furnace at 1600° C. for sintering for 2 hours to obtain a ceramic profile for LED.

[0036] The ceramic profile is engraved with a pattern by laser engraving. The pattern is designed and provided by the LED assembly manufacturer, and is generally designed...

Embodiment 2

[0039] Example 2 Preparation method of semiconductor device ceramic circuit board

[0040] 80g of SiC, 20g of binder and lubricant, including 6g of high-density polyethylene (HDPE), 2g of polypropylene (PP), 0.8g of stearic acid (SA), 6g of microcrystalline paraffin (PW), and carnauba wax 4.6g, lubricant MP (Weikesu MP 20000 from Zhiwei Chemical Co., Ltd.) 0.6g. The inorganic powder and the binder system are uniformly mixed in a high-speed mixer, and then granulated by a twin-screw extrusion granulator to obtain rice-shaped feed. The feed material is injection-molded by an injection molding machine to obtain a semiconductor device ceramic green body. After the ceramic green body is cooled, it is extracted in a trichlorethylene solvent for 4 hours at a temperature of 70° C., and then placed in a 2000° C. pressure sintering furnace for sintering for 3 hours to obtain a semiconductor device ceramic substrate.

[0041] The rest of the steps are the same as in Example 1, and fi...

Embodiment 3

[0042] Example 3 Preparation method of special-shaped ceramic circuit for high power

[0043] 66g of Al 2 o 3 The powder is mixed with 4g of glass powder and then mixed with a binder system (high density polyethylene (HDPE) 8g, polypropylene (PP) 3g, stearic acid (SA) 1.4g, microcrystalline paraffin (PW) 10g, carnauba wax 6.2g, lubricant MP (Weikesu MP 20000 from Zhiwei Chemical Co., Ltd.) 1.4g) were mixed uniformly in a high-speed mixer, and then granulated by a twin-screw extrusion granulator to obtain rice-shaped feed material. The feed material is extruded through an extrusion molding machine to extrude a high-power ceramic green body. After the ceramic green body is cooled, it is extracted in a trichlorethylene solvent for 4 hours at a temperature of 65°C, and then placed in a sintering furnace at 1600°C for 2 hours to obtain high-power ceramic pipes.

[0044] The outer surface of the ceramic pipe is engraved with a pattern by laser engraving. The pattern is desig...

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PUM

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Abstract

The invention relates to a ceramic surface modifying technology, particularly relates to a method for metalizing the surface of a ceramic profiled bar, and specifically provides a preparation method of a ceramic circuit board... The preparation method of the ceramic circuit board comprises the preparation steps of: (1) preparing a ceramic substrate; (2) engraving a required circuit pattern with laser on the surface of the ceramic substrate; (3) in chemical plating, and chemically plating copper on the ceramic substrate obtained in the step (2) to realize bottoming; and (4) chemically plating nickel or chemically plating gold or silver on the surface of a plated layer, so as to prevent copper from being oxidized. According to the preparation method of the ceramic circuit board provided by the invention, a laser engraving technology is combined with chemical copper plating, so that the ceramic board is selectively coated with copper, and the good selectivity is achieved. By using the laser engraving technology, the binding force of a conductive layer with a ceramic base body is good; production equipment is cheap and easy to obtain. Furthermore, the three-dimensional ceramic circuit board can be easily produced; the circuit pattern design is very simple; and the circuit precision is high. Moreover, compared with the other technologies, the preparation method provided by the invention has the advantage that the 'three wastes' emission in a production process is reduced.

Description

technical field [0001] The invention relates to ceramic surface modification technology, in particular to a method for metallizing the surface of ceramic profiled materials, in particular to a method for preparing a ceramic circuit board. Background technique [0002] Ceramic surface metallization is an emerging technology, and the ceramic circuit boards produced can be used in high-power IGBT module products, high-power LED lighting products, high-power high-frequency microwave and other products. This circuit board has high thermal conductivity and large current load capacity; excellent high temperature and high pressure resistance; can adapt to the harsh working environment of high temperature, high pressure, high wear and strong corrosion, and meet the application requirements of the product in various occasions. There are many methods of metallizing the ceramic surface, and some patents are listed for illustration. [0003] CN101460014 relates to a direct copper platin...

Claims

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Application Information

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IPC IPC(8): H05K3/18H05K3/38C23C18/38C23C18/36C23C18/44
Inventor 胡延超陈彬王田军徐斌
Owner 黄石星河电路有限公司
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