Cyanide-free gold plating solution

A technology of cyanide-free gold plating and gold sulfite, which is applied in the field of cyanide-free gold plating solution, can solve the problems of unstable cyanide-free gold plating solution and long storage period of the plating solution, and achieve long storage period, good binding force and stable plating solution Effect

Inactive Publication Date: 2015-12-02
SHENZHEN RUN SUN CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the unstable problem existing in the existing cyanide-free gold plating solution, the present invention proposes a cyanide-free gold plating solution, which forms a stable composite complex ion through the c

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The formula of cyanide-free gold plating solution:

[0022] Gold sodium sulfite 10g / L, sodium sulfite 40g / L, ethylenediamine 15g / L, sodium sulfate 30g / L, aluminum titanium boron grain refiner 30ppm, tert-butyl hydroquinone 40ppm, dibutyl hydroxytoluene 50ppm, sodium oxalate 1.0g / L, 40g / L citric acid and 60g / L sodium citrate.

Embodiment 2

[0024] The formula of cyanide-free gold plating solution:

[0025] Potassium gold sulfite 8g / L, sodium thiosulfate 50g / L, organic phosphonic acid 10g / L, potassium sulfate 40g / L, aluminum titanium boron grain refiner 25ppm, tert-butyl hydroxyanisole 40ppm, dibutyl Hydroxytoluene 60ppm, glycolic acid 3g / L and 35g / L tartaric acid and 45g / L sodium tartrate.

Embodiment 3

[0027] The formula of cyanide-free gold plating solution:

[0028] Potassium gold sulfite 12g / L, potassium thiosulfate 70g / L, ethylenediamine 10g / L, organic phosphonic acid 10g / L, sodium sulfate 50g / L, aluminum titanium boron grain refiner 35ppm, tert-butyl hydroxyl Anisole 80ppm, ethylenediamine tetramethylene phosphonic acid 5g / L and 55g / L malonic acid and 65g / L sodium malonate.

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PUM

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Abstract

The invention discloses a cyanide-free gold plating solution. The cyanide-free gold plating solution comprises sulphurous acid gold salt, a main complexing agent, an auxiliary complexing agent, conducting salt, a stabilizing agent and a pH buffering agent. Under the synthetic action of the sulphurous acid gold salt, the stabilizing agent and the other components, stable composite complex ions are formed through the cyanide-free gold plating solution, the plating solution is more stable, the storage period of the plating solution is long, and the sealed storage period at the normal temperature can reach over 6 months.

Description

technical field [0001] The invention belongs to the technical field of gold plating treatment, and in particular relates to a cyanide-free gold plating solution. Background technique [0002] With the increasing requirements for the miniaturization of large-scale integrated circuits and component circuits, the requirements for chemical gold plating are also getting higher and higher. Cyanide-containing gold plating has long dominated the market due to its good stability, but cyanide is a highly toxic substance, and there are safety problems in the process of preparation, operation and storage. With the increasing environmental protection requirements, the application of cyanide-containing gold plating Will be strictly controlled and will eventually withdraw from the market, therefore, the demand for cyanide-free electroless gold plating will become increasingly important. [0003] In order to realize cyanide-free gold plating, many research institutions at home and abroad h...

Claims

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Application Information

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IPC IPC(8): C25D3/48
Inventor 帅和平
Owner SHENZHEN RUN SUN CHEM TECH
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