The utility model discloses
hybrid bonding equipment based on visual alignment, which belongs to the field of bonding
processing equipment and comprises a bonding
assembly, a first displacement mechanism, a second displacement mechanism, a first visual
assembly, an
optical calibration assembly, a second visual assembly and a bearing table. According to the technical scheme of the utility model, the position coordinates of the calibration point, the
chip to be bonded and the mark point on the target
chip can be accurately obtained through the corresponding arrangement of the
optical calibration assembly, so that the compensation position information between the two chips can be accurately obtained, and the visual alignment of the two chips before
hybrid bonding can be realized. The
hybrid bonding equipment provided by the utility model is compact in structure, convenient to use, and capable of accurately completing bonding of a to-be-bonded
chip and a target chip on a
wafer and accurately realizing visual alignment between the to-be-bonded chip and the target chip before hybrid bonding, so that the alignment precision during hybrid bonding of the chips is effectively ensured, errors in the
bonding process are reduced, and the production efficiency is improved. And the quality of a chip product is improved.