20 results about "Bonding alloy" patented technology

The utility model relates to the technical field of wafer glue removing, in particular to a bonding glue removing machine which comprises a shell, a first separating frame and a second separating frame which are perpendicular to each other are arranged in the shell, and the first separating frame and the second separating frame are used for separating the inner space of the shell. A transfer cavity, a first cleaning bin, a second cleaning bin and a distribution bin are formed; according to the wafer cleaning device, when liquid medicine is sprayed out to wash and remove photoresist on bonding gold on the surface of a wafer, the wafer and the wafer carrying table are driven to rotate together through rotation of the bearing component, meanwhile, the wafer is adsorbed in a vacuum adsorption mode, and the cleaning mechanism is arranged in the first cleaning bin and the second cleaning bin. The wafer is kept stable in the rotation process through the rotation of the wafer, washing and photoresist removing are more sufficient, residual glue is reduced, the pressing cover is located above the slide holder, and the slide holder is prevented from moving upwards while rotation of the slide holder and the wafer is not affected.

The utility model discloses a winding mechanism for processing a bonding alloy wire, which belongs to the technical field of alloy wire processing, and comprises a processing table, a mounting frame is arranged above the processing table, a hydraulic cylinder is arranged below the processing table, a bottom frame is arranged below the hydraulic cylinder, and the bottom frame is arranged below the mounting frame. Rolling wheels are arranged below the bottom frame, and an auxiliary rod is installed at the connecting position of the machining table and the bottom frame. A wire winding roller is installed above two sets of vertical frames, firstly, a handrail pushing device is held to move to a machining position, according to the requirements of a user, a hydraulic cylinder is matched with movable rods in four sets of auxiliary rods to adjust the height of a machining table, then a motor is used for driving a rotating shaft to rotate, and an alloy wire can be wound on the wire winding roller; and a limiting screw rod and a fixing sleeve are arranged, so that the mounting disc can be limited after the alloy wire is wound, the height of the wire winding roller can be adjusted according to different heights of users, and the device is convenient to move and high in practicability.

The invention relates to the field of semiconductor packaging materials, in particular to a high gold bonding alloy wire and a production process and application thereof, and the production process comprises the following steps: smelting and quickly solidifying raw materials with the purity being greater than or equal to 99.999% to prepare a gold alloy ingot with the gold content being greater than or equal to 99.99%; carrying out hot working and multi-pass cold drawing on the gold alloy cast ingot, and carrying out intermediate annealing during cold drawing to obtain an intermediate wire with the diameter of 50-200 microns; plastic twisting deformation is applied to the middle wire, and the twisting deformation degree ranges from 30 circles per meter to 120 circles per meter; the intermediate wire subjected to twisting deformation is subjected to rapid heat treatment, the heat treatment temperature ranges from 350 DEG C to 550 DEG C, the heat treatment time ranges from 2 s to 8 s, and then rapid cooling is conducted; and precisely drawing the wire material subjected to heat treatment to obtain a final finished product with the diameter of 15-33 microns. Through coordination of the components and the process, the problem of sliding balls or pseudo soldering defects is solved, and a high-strength and low-radian product is obtained.

A method for manufacturing an article comprising heat-treated tungsten carbide particles in a matrix of a bond alloy is provided. The method includes liquid metal infiltration. The tungsten carbide particles are preferably spherical, and the bonding alloy preferably contains copper. The tungsten carbide particles are preferably heat treated before or during the liquid metal infiltration process. Articles prepared by the method are also provided.

The utility model discloses a gold bonding wire cooling and take-up device, and relates to the field of gold bonding wire machining. The gold bonding wire winding device comprises a winding wheel and a gold bonding wire, the lower portion of the winding wheel is in transmission connection with a wire arranging frame through an intermittent mechanism, a wire arranging wheel is rotationally installed at the top end of the wire arranging frame, a supporting plate is fixedly connected to one side of the wire arranging frame, and a cooling mechanism is installed on the side, away from the winding wheel, of the top face of the supporting plate. Through cooperative work of the drying mechanism, the electric heater and the fan, hot air is directionally blown to the surface of the gold wire through a groove of the air guide pipe, the air guide pipe is of a flexible pipe fixed shape, and the path can be flexibly adjusted to meet different take-up requirements. By adjusting the passing length of the gold wire in the air guide pipe, the action time of drying hot air can be prolonged or shortened under the condition that the rotating speed of the winding wheel is not changed, so that the drying duration is accurately controlled, and the drying uniformity is improved.

The utility model discloses a bonding alloy wire drawing device which is applied to the technical field of alloy processing and comprises a bearing frame, a pay-off machine is fixedly installed on the left side of an inner cavity of the bearing frame, a winding machine is fixedly installed on the right side of the inner cavity of the bearing frame, and a wire drawing die is fixedly installed on the side, away from the pay-off machine and the winding machine, of the inner cavity of the bearing frame. A buffering assembly is fixedly installed at the top of the rear side of an inner cavity of the bearing frame and comprises a limiting frame, and the rear side of the limiting frame and the bearing frame are fixedly installed. When breakage of the gold wire caused by sudden power failure needs to be prevented, a user starts a hydraulic rod to drive a positioning frame and a structure fixed to the positioning frame to move downwards, and when the positioning frame moves, the gold wire fixed to the winding machine is bent before entering a wire drawing die by rotating a positioning wheel connected to the surface of a limiting rod in a sleeving mode; and through cooperative use of a limiting rod and a limiting spring, the situation of gold wire breakage caused by sudden power failure is prevented.

Systems and methods for joining metal matrix composites are provided herein. The method includes disposing a bonding alloy between a first metal matrix composite substrate and a second metal matrix composite substrate to provide an assembly, and heating the assembly to a melting temperature of the bonding alloy for a predetermined period of time. The melting temperature of the bonding alloy is lower than the melting temperature of the first metal matrix composite substrate and the second metal matrix composite substrate.

The invention relates to the technical field of semiconductor device manufacturing, in particular to a preparation method of a high-frequency response power triode. Firstly, the resistivity gt is adopted; the method comprises the following steps: growing an N-drift layer on an N + silicon substrate with the thickness of 1000 omega.cm, etching an isolation groove with the depth of 12 microns and the depth-to-width ratio of 5.9: 1 through ICP (Inductively Coupled Plasma), and filling a SiO2 / Si3N4 composite dielectric layer to expand a depletion layer to 18.5 microns, so that the capacitance of a collector junction is reduced to 68pF and the breakdown voltage reaches 205V. Secondly, forming an interdigital emitter on the front surface, thinning the back surface to 100 + / -2 microns, then performing laser drilling, filling through holes with pulse electroplating copper, and compressing loop inductance to 2.7 nH by a copper column array; and finally, a Ti / Ni / Au transition layer is sputtered, a diamond-copper composite substrate is subjected to hot pressing bonding, a TiC phase of 80 nm is formed on an interface, the heat conductivity reaches 635 W / m.K, and the heat resistance is reduced to 0.61 K / W. According to the invention, capacitance, inductance and thermal resistance are optimized, switching loss is reduced by 57.8%, power density is increased to 51.2 W / cm < 2 >, and the device is suitable for a MHz-level high-frequency power system.

The invention provides an artificial intelligence data analysis method for an intelligent gold bonding wire. The artificial intelligence data analysis method comprises the following steps: acquiring a processed spectrogram of the gold bonding wire through a detection device; obtaining crystal defect data of the gold bonding wire based on the processed spectrogram; inputting the crystal defect data into a deformation resistance model to obtain the deformation resistivity after the gold bonding wire is processed; and the deformation influence resistivity is obtained based on the deformation resistivity and the ideal resistivity, so that the problem of lack of understanding of resistivity change in the gold bonding wire machining process at present can be solved, and the influence of deformation generated in the gold bonding wire machining process on the resistivity of the gold bonding wire can be quantitatively understood.

The utility model relates to the technical field of spool clamping equipment, in particular to an aluminum spool clamping device for gold bonding wires, which comprises a base, two fixing seats are fixedly arranged at the top end of the base, a rotating rod is rotatably connected in one of the fixing seats, a first limiting shaft is fixedly arranged at one end of the rotating rod, and a second limiting shaft is fixedly arranged at the other end of the rotating rod. The side face of the first limiting shaft is provided with a spool body, one side of the spool body is provided with a second limiting shaft, one side of the second limiting shaft is fixedly provided with a rotating shaft, one side of the rotating shaft is rotationally connected with a limiting rod, the top end of the limiting rod is provided with a plurality of limiting grooves, one side of the other fixing base is fixedly provided with a fixing box, and a limiting block is arranged in the fixing box; the bobbin assembly and disassembly device has the advantages that on the premise that the bobbin assembly and disassembly efficiency is high, bobbin bodies with different widths can be stably limited conveniently, and therefore the application range of the bobbin assembly and disassembly device is widened.

To provide a system and a method for efficiently and effectively joining metal-based composite materials.SOLUTION: A method of providing an assembly (130) includes disposing a bonding alloy (110) between a first metallic composite substrate (102) and a second metallic composite substrate (104), and heating the assembly (130) to a melting temperature of the bonding alloy (110) for a predetermined period of time. The melting temperature of the bonding alloy (110) is lower than the melting temperature of the first metallic composite substrate (102) and the second metallic composite substrate (104).SELECTED DRAWING: Figure 1

This utility model discloses a high-efficiency drying device for bonding alloy wire processing, applied in the field of microelectronics technology. This utility model achieves constant tension automatic winding of the gold wire during the drying process. Its mechanical structure design effectively avoids the overlapping and uneven tension phenomena that occur during traditional winding, ensuring consistent winding density. Simultaneously, it reduces manual intervention, significantly improving production efficiency and product yield, ensuring that each gold wire achieves a uniform drying effect and a smooth winding state. An array of uniform air outlets is set at the top of the winding mechanism, realizing the synergy between dynamic drying and winding processes. Hot air evenly covers the moving gold wire, effectively solving the problem of uneven drying caused by the fixed position of traditional equipment. The synchronous drying design avoids the waste of secondary heat treatment processes.

The application discloses a three-layer bonding alloy for high-temperature alloy and application thereof, and belongs to the technical field of material surface modification and coating. The three-layer bonding alloy for high-temperature alloy adopts a design concept of similar phase composition, is based on a nickel-based high-temperature alloy, determines the element composition of a gamma prime phase and a beta phase under the premise of increasing the content of Al elements in the alloy, and finally designs the composition of the three-layer bonding alloy. The top beta phase is based on a NiAl phase and contains more Al elements, can provide sufficient Al elements for generating an Al2O3 film on the surface of the bonding layer; the bottom gamma prime phase is based on a Ni3(Al, Ti) phase, is similar to the composition of the gamma prime / gamma phase of the nickel-based high-temperature alloy, and guarantees the interface compatibility of the bottom bonding layer and the substrate; and the middle layer is composed of the beta phase and the gamma prime phase, so as to relieve the phase mismatch between the top layer and the bottom layer.

This invention discloses a stamping and bending device for bonding alloy nameplates and plastic parts, comprising a machine base, on which a lower mold body is mounted via a support plate. A cylinder is also mounted on the machine base via a gantry frame, and an upper mold body is mounted on the lower end of the cylinder's output shaft via a hanging plate. A positioning frame is provided inside the lower mold body, within which a plastic part body, a fabric cover body, and an alloy nameplate body are stacked sequentially from bottom to top. Multiple legs of the alloy nameplate body penetrate the fabric cover body and extend below insertion holes on the surface of the plastic part body. The inner bottom surface of the positioning frame has a nameplate stamping area corresponding to the alloy nameplate body, and a stamping groove is formed in the nameplate stamping area corresponding to each leg. This invention allows the legs to enter the stamping grooves when the upper mold body is pressed down, deforming under the pressure of the groove walls. A single stamping action can complete the bonding of multiple layers of material and the bending of the nameplate legs, greatly improving production efficiency.

The utility model discloses a bonding alloy wire mould which comprises an outer mould and an inner mould, a mounting groove for mounting the inner mould is formed in the outer mould, a mould hole is formed in the middle of the inner mould, a wire outlet of the outer mould is formed in the other end opposite to the mounting groove, a plurality of slots are formed in the side wall of the mounting groove, and a plurality of sliding grooves are formed in the end, close to an inlet of the mounting groove, of the inner mould. The number and the position of the sliding grooves correspond to the number and the position of the inserting grooves, the inner mold is installed in the installation groove of the outer mold, one ends of the key blocks are inserted into the inserting grooves along the sliding grooves, the other ends of the key blocks are located in the sliding grooves, and the inner mold is fixed in the installation groove of the outer mold. According to the utility model, the key block with a special structure is assembled with the slot, the inner mold and the outer mold are quickly mounted and fixed, the mounting structure is simple and reliable, and meanwhile, the key block can be pulled out through the convex block on the key block during disassembly, so that the replacement of the inner mold is convenient.

The invention discloses a flexible transparent battery preparation method based on an alloy film-MXene / Si-C composite electrode, and relates to the technical field of flexible energy storage devices, and the method comprises the following steps: 1, magnetron sputtering deposition of an alloy film: after a flexible substrate is pretreated, an Ag-X alloy is adopted as a target material, and an Ag-based alloy film is deposited on the surface of the flexible substrate; and 2, preparation of an MXene-Si-C gel active layer: adding the MXene colloid and the Si-C powder into a coupling agent and a solvent according to a mass ratio of 3: 1, mixing to obtain MXene-Si-C gel, coating the surface of the alloy film with the MXene-Si-C gel, and drying to obtain the MXene-Si-C gel active layer. By doping trace Cu, Zn or Ti (1-10 wt%), Ag oxidation is inhibited, the adhesive force of the film is improved, and the oxidation resistance of the CuAg alloy is improved by 40%; and alloy-MXene interface bonding: doping metal in the alloy and MXene surface functional groups (-O,-F) form Ti-O-Ti or Ti-F bonds, so that the interface contact resistance is reduced.

The invention relates to the technical field of metal laser cladding, in particular to a method and system for enhancing the wear resistance of a metal surface based on laser cladding, and the method comprises the steps that a wear-resistant alloy material and a bonding alloy material are prepared based on a laser cladding raw material set, and a laser cladding machining device is constructed; a laser cladding processing device, a wear-resistant alloy material, a bonding alloy material and a preset optimal cladding numerical value set are used for carrying out laser cladding on a to-be-cladded base body to obtain a target cladding base body, state recognition is carried out on the target cladding base body based on a coating detection module to obtain a repairable base body, the repairable base body is repaired to obtain an updated metal base body, and the updated metal base body is subjected to laser cladding. And if the current cladding thickness is smaller than the target cladding thickness, the updated metal matrix serves as a matrix to be cladded, and if the current cladding thickness is not smaller than the target cladding thickness, the updated metal matrix serves as a wear-resistant metal matrix. According to the invention, the bonding strength and wear resistance of the cladding layer can be improved, and the crack and pore defect rate is reduced.

The invention discloses an operation control method and device for intelligent gold bonding wire high-speed rewinding equipment, and the method comprises the steps: adjusting the tightness of the gold bonding wire high-speed rewinding equipment during rewinding through a control speed regulator if a test product is determined to be unqualified according to a lattice constant of the test product; if it is determined that the tested product is unqualified according to the rewinding accuracy of the tested product, a motion motor is controlled to adjust the initial rewinding position of the gold bonding wire to a set end point; if the test product is determined to be unqualified according to the vibration frequency of the test product, a tension controller of the winding machine is adjusted; and if the tested product is determined to be unqualified according to the turn number conversion rate corresponding to the tested product, the number of revolutions of a winding shaft of the winding machine is adjusted. Therefore, real-time monitoring, abnormity tracing and control adjustment of the working process of the gold bonding wire high-speed rewinding equipment are realized. An intelligent operation control scheme is provided for high-speed bonding gold wire rewinding equipment, and the production quality of bonding gold wires is ensured.

The invention relates to the technical field of semiconductor packaging, and particularly discloses a heterogeneous chip integrated high-temperature packaging structure and a packaging method thereof.The packaging structure comprises two heterogeneous chips, a ceramic tube shell, a transition piece, a high-temperature solder, a bonding alloy wire, a bonding aluminum wire and a flat sealing cover plate; the ceramic tube shell comprises a sealing ring, a key and finger region, a chip mounting region and a chip interconnection region, the first transition sheet and the second transition sheet are respectively mounted in the first key and finger region and the chip interconnection region, and the two heterogeneous chips are respectively mounted in the first chip mounting region and the second chip mounting region. One heterogeneous chip is respectively in lead bonding with the first transition sheet and the second transition sheet, the other heterogeneous chip is respectively in lead bonding with the chip interconnection area and the second key and finger area, and the ceramic tube shell is welded with the flat sealing cover plate through the sealing ring. According to the invention, the high-temperature reliability of heterogeneous chip integration is guaranteed, the heat dissipation capability of the heterogeneous chip is improved, and the application field of the product is expanded.

The application relates to the technical field of bonding gold wires, in particular to a high-strength bonding gold wire and a production process thereof, which comprises the following steps: taking raw materials according to weight percentages: copper 0.002-0.003 wt%, magnesium 0.001-0.002 wt%, calcium 0.0002-0.0008 wt%, palladium 0.0005-0.002 wt%, cerium-boron additive 0.001-0.002 wt%, and the balance being gold. The bonding gold wire of the application adopts copper, magnesium, calcium and other raw materials to be blended, and cerium-boron additive is added to cooperate and synergize, then the bonding gold wire is subjected to melting, single-crystal continuous casting, immersion treatment in a lubricating liquid, multi-pass wire drawing, reheat adjustment and improvement treatment, and finally the bonding strength, elongation rate and resistivity performance of the obtained bonding gold wire are remarkably improved; meanwhile, the product is excellent in oxidation resistance and corrosion resistance, and the comprehensive coordination of the product is excellent.