This invention discloses a
stamping and bending device for
bonding alloy nameplates and plastic parts, comprising a
machine base, on which a lower mold body is mounted via a support plate. A cylinder is also mounted on the
machine base via a gantry frame, and an upper mold body is mounted on the lower end of the cylinder's output shaft via a hanging plate. A positioning frame is provided inside the lower mold body, within which a plastic part body, a fabric cover body, and an
alloy nameplate body are stacked sequentially from bottom to top. Multiple legs of the
alloy nameplate body penetrate the fabric cover body and extend below
insertion holes on the surface of the plastic part body. The inner bottom surface of the positioning frame has a
nameplate stamping area corresponding to the
alloy nameplate body, and a
stamping groove is formed in the nameplate stamping area corresponding to each leg. This invention allows the legs to enter the stamping grooves when the upper mold body is pressed down, deforming under the pressure of the groove walls. A single stamping action can complete the bonding of multiple
layers of material and the bending of the nameplate legs, greatly improving production efficiency.