Copper-plated, pure-nickel and gold-plated bonding wire and fabrication method thereof

A technology of bonding wire and pure nickel, applied in the field of bonding wire, can solve the problems of high use cost of bonding wire, prone to ion migration, degradation of insulation performance of insulators, etc., so as to improve product quality and service life, prevent ion migration, etc. phenomenon, the effect of maintaining electrical conductivity

Inactive Publication Date: 2019-03-01
深圳金斯达应用材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among the existing bonding wires, the performance is better than the bonding gold wire. The main component of the bonding gold wire is gold, and the price of gold is high, which makes the use cost of the bonding gold wire relatively high. In order to reduce the cost, other metals can be use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A copper-plated pure nickel and then gold-plated bonding wire has a four-layer structure, the innermost layer is a copper core, the surface of the copper core is plated with pure nickel, the surface of the pure nickel is plated with gold, and the surface of the gold is plated with an anti-ion migration agent;

[0030] The copper core includes the following raw materials in parts by weight: 100 parts of copper, 2 parts of tin, 2 parts of aluminum, 1 part of magnesium, and 1 part of indium;

[0031] The anti-ion migration agent includes the following raw materials in parts by weight: 20 parts of phenolic resin, 4 parts of glass fiber, 2 parts of fatty alcohol polyoxyethylene ether, 3 parts of methyl benzotriazole, octylphenol polyoxyethylene ether 2 parts, 1 part adhesive, 1 part curing agent.

[0032] Wherein, the purity of the gold is not less than 99.995%.

[0033] Wherein, the preparation method of described anti-ion migration agent comprises the following steps:

...

Embodiment 2

[0044] A copper-plated pure nickel and then gold-plated bonding wire has a four-layer structure, the innermost layer is a copper core, the surface of the copper core is plated with pure nickel, the surface of the pure nickel is plated with gold, and the surface of the gold is plated with an anti-ion migration agent;

[0045] The copper core includes the following raw materials in parts by weight: 102 parts of copper, 2.5 parts of tin, 2.5 parts of aluminum, 1.2 parts of magnesium, and 1.2 parts of indium;

[0046] The anti-ion migration agent includes the following raw materials in parts by weight: 22 parts of phenolic resin, 5 parts of glass fiber, 2.5 parts of fatty alcohol polyoxyethylene ether, 3.5 parts of methyl benzotriazole, octylphenol polyoxyethylene ether 2.5 parts, 1.2 parts of adhesive, 1.2 parts of curing agent.

[0047] Wherein, the purity of the gold is not less than 99.995%.

[0048] Wherein, the preparation method of described anti-ion migration agent compri...

Embodiment 3

[0059] A copper-plated pure nickel and then gold-plated bonding wire has a four-layer structure, the innermost layer is a copper core, the surface of the copper core is plated with pure nickel, the surface of the pure nickel is plated with gold, and the surface of the gold is plated with an anti-ion migration agent;

[0060] The copper core includes the following raw materials in parts by weight: 106 parts of copper, 2.8 parts of tin, 3.1 parts of aluminum, 1.6 parts of magnesium, and 1.3 parts of indium;

[0061] The anti-ion migration agent includes the following raw materials in parts by weight: 25 parts of phenolic resin, 6 parts of glass fiber, 3 parts of fatty alcohol polyoxyethylene ether, 4 parts of methyl benzotriazole, octylphenol polyoxyethylene ether 3 parts, 1.5 parts of adhesive, 1.5 parts of curing agent.

[0062] Wherein, the purity of the gold is not less than 99.995%.

[0063] Wherein, the preparation method of described anti-ion migration agent comprises th...

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PUM

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Abstract

The invention discloses a copper-plated, pure-nickel and gold-plated bonding wire. The copper-plated, pure-nickel and gold-plated bonding wire comprises the following raw materials based on parts by weight, a four-layer structure is arranged, a copper core is arranged at the innermost layer, pure nickel is plated on a surface of the copper core, gold is plated on a surface of the pure nickel, an ionic migration-prevention agent is plated on a surface of the gold, and the copper core comprises the following raw materials based on parts by weight: 100-110 parts of copper, 2-4 parts of tin, 2-4 parts of aluminum, 1-2 parts of magnesium and 1-2 parts of indium. The invention also discloses a fabrication method of the copper-plated, pure-nickel and gold-plated bonding wire. In the fabricated bonding wire, copper is used as a main raw material to substitute gold, the conductivity can be maintained, and meanwhile, the production cost of a product is greatly reduced; by plating the pure nickel, the gold and the ionic migration-prevention composition on the surface of the bonding alloy wire, an ionic migration phenomenon of the alloy wire is effectively prevented, the product quality is improved, and the service lifetime of a product is prolonged.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a copper-plated pure nickel-plated gold-plated bonding wire and a preparation method thereof. Background technique [0002] Although the chip obtained after the semiconductor integrated circuit is manufactured has a specific function, it must be connected with external electronic components to realize this function. The semiconductor integrated circuit chip needs to go through a bonding process with the package body, and finally get the chip package, so that it can be connected to external electronic components through the package pins. In the bonding process of the chip and the package, the pads on the chip and the pins of the package are electrically connected through the bonding wire, so the bonding wire is an indispensable material for realizing the function of the chip. [0003] Among the existing bonding wires, the performance is better than the bonding gold wire. Th...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/49C22C9/01C22C9/02C09D161/06C09D7/61C09D7/63C09D7/65
CPCC08L2205/025C08L2205/03C09D7/61C09D7/63C09D7/65C09D7/70C09D161/06C22C9/01C22C9/02H01L21/4889H01L23/49C08L71/02C08K13/04C08K7/14C08K5/3475
Inventor 张军伟张贺源冯忠卿
Owner 深圳金斯达应用材料有限公司
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