Copper-plated, pure-nickel and gold-plated bonding wire and fabrication method thereof

Abstract

The invention discloses a copper-plated, pure-nickel and gold-plated bonding wire. The copper-plated, pure-nickel and gold-plated bonding wire comprises the following raw materials based on parts by weight, a four-layer structure is arranged, a copper core is arranged at the innermost layer, pure nickel is plated on a surface of the copper core, gold is plated on a surface of the pure nickel, an ionic migration-prevention agent is plated on a surface of the gold, and the copper core comprises the following raw materials based on parts by weight: 100-110 parts of copper, 2-4 parts of tin, 2-4 parts of aluminum, 1-2 parts of magnesium and 1-2 parts of indium. The invention also discloses a fabrication method of the copper-plated, pure-nickel and gold-plated bonding wire. In the fabricated bonding wire, copper is used as a main raw material to substitute gold, the conductivity can be maintained, and meanwhile, the production cost of a product is greatly reduced; by plating the pure nickel, the gold and the ionic migration-prevention composition on the surface of the bonding alloy wire, an ionic migration phenomenon of the alloy wire is effectively prevented, the product quality is improved, and the service lifetime of a product is prolonged.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a copper-plated pure nickel-plated gold-plated bonding wire and a preparation method thereof. Background technique [0002] Although the chip obtained after the semiconductor integrated circuit is manufactured has a specific function, it must be connected with external electronic components to realize this function. The semiconductor integrated circuit chip needs to go through a bonding process with the package body, and finally get the chip package, so that it can be connected to external electronic components through the package pins. In the bonding process of the chip and the package, the pads on the chip and the pins of the package are electrically connected through the bonding wire, so the bonding wire is an indispensable material for realizing the function of the chip. [0003] Among the existing bonding wires, the performance is better than the bonding gold wire. Th...

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Problems solved by technology

[0003] Among the existing bonding wires, the performance is better than the bonding gold wire. The main component of the bonding gold wire is gold, and the price of gold is high, which makes the use cost of the bonding gold wire relatively high. In order to reduce the cost, other metals can be used to replace gold. Making bonding alloy wires, but most metals have weaker conductivity than gold, and are not stable enough, and ion migration is prone to occur, which may cause the insulation performance of the insulator to decrease or even become a conductor, resulting in short-circuit failure