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31results about How to "Prevent ion migration" patented technology

Process for preparing a substantially transparent conductive layer configuration

A substantially transparent conductive layer on a support, the layer comprising an intrinsically conductive polymer e.g. containing an intrinsically conductive polymer optionally containing structural units represented by formula (I): wherein n is larger than 1 and each of R<1 >and R<2 >independently represents hydrogen or an optionally substituted C1-4 alkyl group or together represent an optionally substituted C1-4 alkylene group or an optionally substituted cycloalkylene group, preferably an ethylene group, an optionally alkyl-substituted methylene group, an optionally C1-12 alkyl- or phenyl-substituted ethylene group, a 1,3-propylene group or a 1,2-cyclohexylene group; and a conductive metal non-uniformly distributed therein and forming of itself a conductive entity; a process for preparing the transparently conductive layer; and light emitting diodes, photovoltaic devices, transistors and electroluminescent devices comprising the above-described conductive layer.
Owner:AGFA GEVAERT AG

Method of making a photovoltaic device or front substrate with barrier layer for use in same and resulting product

InactiveUS20080295884A1Increase power and efficiencyPrevent ion migrationSpecial surfacesCoatingsSilanesSolvent
A method of making a photovoltaic device including an antireflective coating, including: forming a coating solution by mixing a mono-metal oxide, a bi-metal oxide, a silane, or a siloxane with a solvent, such that the coating solution may be used as a barrier between the antireflective coating and a glass substrate that inhibits sodium ion migration in the glass substrate after exposure to environmental factors including humidity and temperature. A photovoltaic device including a photovoltaic film, a glass substrate, and a barrier layer provided on the glass substrate; an anti-reflection coating provided on the glass substrate and on the barrier layer; wherein the barrier layer comprises one or more of the following: a mono-metal oxide, a bi-metal oxide, a silane, or a siloxane.
Owner:GUARDIAN GLASS LLC

Wired circuit board

A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relation having different potentials, a semiconductive layer formed on the insulating base layer to cover the conductive pattern and electrically connected to the metal supporting board on one side outside a region where the pair of wires are opposed, and an insulating cover layer formed on the semiconductive layer.
Owner:NITTO DENKO CORP

Inkjet head and method for producing the same

A flexible wiring circuit board has a second terminal section bonded and electrically connected to a first terminal section of a wiring circuit board of a discharge die. A drive signal is inputted to the first terminal section through the second terminal section, and then sent to a driver IC. The driver IC drives a piezoelectric element in accordance with the drive signal through a printed wiring pattern. Thereby, ink is discharged from an ink discharge opening. A copper ion diffusion inhibiting film is formed on a surface of a copper wiring member of the second terminal section on contact with a process liquid containing at least one of 1, 2, 3 triazole and 1, 2, 4 triazole. This inhibits diffusion of copper ions and copper ion migration resulting therefrom. Thus, malfunction due to the copper ion migration is inhibited.
Owner:FUJIFILM CORP

Touch panel and display device

A touch panel and a display device are disclosed. Either a cell or a cell, which is formed by the intersections of silver fine wires which form either first electrodes or second electrodes, forms parallelogram shapes (preferably rhomboids), having opposite angles wherein intersection angles are obtuse angles and intersection angles are acute angles. The first electrodes and / or the second electrodes have an adhesive (OCA) deployed thereupon, which has a loss coefficient (tan δ) of 0.13 or more at 140° C. and 1 Hz, and a reserve elasticity of 8.9×104 Pa or less at 25° C. and 1 Hz.
Owner:FUJIFILM CORP

Low k dielectric materials with inherent copper ion migration barrier

An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The interlayer dielectric of the present invention comprises a dielectric material that has a dielectric constant of 3.0 or less and an additive which is highly-capable of binding Cu ions, yet is soluble in the dielectric material. The presence of the additive in the low k dielectric allows for the elimination of conventional inorganic barrier materials such as SiO2 or Si3N4.
Owner:IBM CORP

Printed circuit board and manufacturing method thereof

A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.
Owner:NITTO DENKO CORP

Manufacturing method of conductive sheet and conductive sheet

A manufacturing method of a conductive sheet includes: a step A of forming a silver halide-containing photosensitive layer, which contains silver halide, gelatin, and a polymer different from the gelatin and in which a mass ratio (Y / X) of a mass Y of the polymer to a mass X of the gelatin is equal to or greater than 0.1, on a support; a step B of forming conductive portions containing metal silver by performing exposure and then development treatment on the silver halide-containing photosensitive layer; and a step C of treating the support having the conductive portions with an oxidant which has a standard electrode potential of equal to or greater than +1.5 V and decomposes the gelatin.
Owner:FUJIFILM CORP

System and Method for Protecting a Liquid Crystal Display by Controlling Ion Migration

A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. The display-protection images protect the liquid crystal display from migrating ions accumulating in particular regions of the pixel array and causing permanent defects in the display area. A liquid crystal display that includes a liquid crystal alignment layer having a plurality of liquid crystal alignment directions is also disclosed. The customized liquid crystal alignment director(s) over the border area promote ion migration away from the display area.
Owner:OMNIVISION TECH INC

Suspension board with circuit

A suspension board with circuit has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and including a terminal portion for connecting to an external terminal, and an antistatic barrier layer formed on the conductive pattern. The antistatic barrier layer includes a metal thin film and a semiconductive layer having at least one end facing the terminal portion and at least the other end in contact with the metal supporting board.
Owner:NITTO DENKO CORP

Circuit board substrate and manufacture method thereof

The invention relates to a circuit board substrate. The circuit board substrate comprises a first copper foil layer, a first insulating layer, an epoxy resin composite material layer, a second insulating layer and a second copper foil layer. The epoxy resin composite material layer is made from an epoxy resin composite material. The epoxy resin composite material comprises carboxyl-terminated polymer modified epoxy resin, carbon nano tubes and inorganic dispersed materials, wherein the mass percentage of the carbon nano tubes in the epoxy resin composite material is 4.6% to 16%, and the epoxy equivalent of the carboxyl-terminated polymer modified epoxy resin is 323 to 352. The invention further provides a manufacture method of the circuit board substrate.
Owner:AVARY HLDG (SHENZHEN) CO LTD +1

Wired circuit board and producing method thereof

A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.
Owner:NITTO DENKO CORP

Photosensitive resin composition

To provide a photosensitive resin composition capable of preventing ion migration while having satisfactory developability and having no cissing. The photosensitive resin composition comprises a reactive polymer having an ethylenically unsaturated double bond group and a carboxyl group; a free radical-based stabilizer; and a photoacid generator. The acid value of the reactive polymer is 40 to 100 mgKOH / g. The chlorine content of the reactive polymer is equal to or less than 150 ppm. The free radical-based stabilizer is selected from a hindered amine or hindered amine derivative. A cured product is obtained by using the photosensitive resin composition.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

System and Method for Protecting a Liquid Crystal Display by Controlling Ion Migration

A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. The display-protection images protect the liquid crystal display from migrating ions accumulating in particular regions of the pixel array and causing permanent defects in the display area. A liquid crystal display that includes a liquid crystal alignment layer having a plurality of liquid crystal alignment directions is also disclosed. The customized liquid crystal alignment director(s) over the border area promote ion migration away from the display area.
Owner:OMNIVISION TECH INC

Conductive sheet, manufacturing method of conductive sheet, and touch panel

The conductive sheet includes a support and a conductive portion which is disposed on the support and composed of thin conductive wires containing metal silver and gelatin, in which gelatin is substantially not contained between the thin conductive wires on the support, and a volume ratio (A / B) of a volume A of the metal silver to a volume B of the gelatin in the thin conductive wires is 0.3 to 10.0. In the conductive sheet, the occurrence of ion migration between thin conductive wires is further inhibited. A manufacturing method of the conductive sheet and a touch panel including the conductive sheet are also provided.
Owner:FUJIFILM CORP

Low k dielectric materials with inherent copper ion migration barrier

An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The interlayer dielectric of the present invention comprises a dielectric material that has a dielectric constant of 3.0 or less and an additive which is highly-capable of binding Cu ions, yet is soluble in the dielectric material. The presence of the additive in the low k dielectric allows for the elimination of conventional inorganic barrier materials such as SiO2 or Si3N4.
Owner:IBM CORP

Wired circuit board and producing method thereof

A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.
Owner:NITTO DENKO CORP

Substrate of circuit board and manufacturing method thereof

The invention relates to a substrate of a circuit board. The structure comprises an insulating base material layer, an epoxy resin composite material layer, an adhesive layer and a metal layer, which are sequentially stacked. The epoxy resin composite material layer is made of epoxy resin composite material. The epoxy resin composite material comprises epoxy resin modified by a carboxyl-terminated polymer, carbon nanotubes and inorganic dispersion material, wherein the carbon nanotubes account for 4.6% by weight to 16% by weight of the epoxy resin composite material. The invention further provides a manufacturing method of the substrate of the circuit board.
Owner:AVARY HLDG (SHENZHEN) CO LTD +1

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN / PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
Owner:HITACHI CHEM CO LTD
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