31results about How to "Prevent ion migration" patented technology

A suspension board with circuit has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and including a terminal portion for connecting to an external terminal, and an antistatic barrier layer formed on the conductive pattern. The antistatic barrier layer includes a metal thin film and a semiconductive layer having at least one end facing the terminal portion and at least the other end in contact with the metal supporting board.

An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The interlayer dielectric of the present invention comprises a dielectric material that has a dielectric constant of 3.0 or less and an additive which is highly-capable of binding Cu ions, yet is soluble in the dielectric material. The presence of the additive in the low k dielectric allows for the elimination of conventional inorganic barrier materials such as SiO2 or Si3N4.

A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relation having different potentials, a semiconductive layer formed on the insulating base layer to cover the conductive pattern and electrically connected to the metal supporting board on one side outside a region where the pair of wires are opposed, and an insulating cover layer formed on the semiconductive layer.

A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating layer and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board by sputtering or electrolytic plating. A metal foil is formed on the first metal thin film by electrolytic plating. A second metal thin film is formed over the metal foil and the metal supporting board by electroless plating or sputtering. An insulating base layer is formed on the second metal thin film. A conductive pattern is formed as a wired circuit pattern on the insulating base layer. An insulating cover layer is formed on the insulating base layer to cover the conductive pattern.

A touch panel and a display device are disclosed. Either a cell or a cell, which is formed by the intersections of silver fine wires which form either first electrodes or second electrodes, forms parallelogram shapes (preferably rhomboids), having opposite angles wherein intersection angles are obtuse angles and intersection angles are acute angles. The first electrodes and / or the second electrodes have an adhesive (OCA) deployed thereupon, which has a loss coefficient (tan δ) of 0.13 or more at 140° C. and 1 Hz, and a reserve elasticity of 8.9×104 Pa or less at 25° C. and 1 Hz.

The conductive sheet includes a support and a conductive portion which is disposed on the support and composed of thin conductive wires containing metal silver and gelatin, in which gelatin is substantially not contained between the thin conductive wires on the support, and a volume ratio (A / B) of a volume A of the metal silver to a volume B of the gelatin in the thin conductive wires is 0.3 to 10.0. In the conductive sheet, the occurrence of ion migration between thin conductive wires is further inhibited. A manufacturing method of the conductive sheet and a touch panel including the conductive sheet are also provided.

A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.

A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. The display-protection images protect the liquid crystal display from migrating ions accumulating in particular regions of the pixel array and causing permanent defects in the display area. A liquid crystal display that includes a liquid crystal alignment layer having a plurality of liquid crystal alignment directions is also disclosed. The customized liquid crystal alignment director(s) over the border area promote ion migration away from the display area.

Embodiments of the present invention provide a display device and a binding test method thereof, which reduce the difficulty of the pin formation process and the risk of ion migration between the pins. The display device includes a display panel, a chip-on-chip film and a printed circuit board, and the chip-on-chip film includes a flexible circuit board and a driver chip; the driver chip includes chip test pins; the flexible circuit board includes functional pins and floating pins, and the functional pins It is used to transmit the signals required for the display screen of the display panel or the signals required for the operation of the driving chip; the chip test pins are led to the flexible circuit board through the floating pins; at least one floating pin is located between two adjacent functional pins ;In the non-test phase, the floating pin is in the high impedance state or the signal output state, when the floating pin is in the signal output state, the potential of the signal output by the floating pin is greater than the first potential V1 and lower than the second potential V2, the first potential V1 and the second potential V2 are respectively potentials of two functional pins adjacent to the floating pin.

To provide a photosensitive resin composition capable of preventing ion migration while having satisfactory developability and having no cissing. The photosensitive resin composition comprises a reactive polymer having an ethylenically unsaturated double bond group and a carboxyl group; a free radical-based stabilizer; and a photoacid generator. The acid value of the reactive polymer is 40 to 100 mgKOH / g. The chlorine content of the reactive polymer is equal to or less than 150 ppm. The free radical-based stabilizer is selected from a hindered amine or hindered amine derivative. A cured product is obtained by using the photosensitive resin composition.

A wired circuit board comprises a metal supporting board, a metal foil formed on the metal supporting board, a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy, a first insulating layer formed on the metal supporting board to cover the first protecting layer, a conductive pattern formed on the insulating layer, and a second protecting layer formed on the surface of the conductive pattern, the second protecting layer is made of tin or a tin alloy.

A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth electrode is provided on the side opposing the AC electrode. More specifically, the printed circuit board is provided outside a sheath layer that is a region having a high plasma density generated in the vicinity of the AC electrode. The frequency of an AC power supply is preferably not more than 1 GHz. The pressure in the device is preferably in the range from 1.33×10−2 Pa to 1.33×102 Pa. The inter-electrode distance between the AC electrode and the earth electrode is preferably not more than 150 mm, more preferably from 40 mm to 100 mm.

A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

The invention relates to a circuit board substrate, which comprises a first metal layer, a first adhesive layer, a first epoxy resin composite material layer, an insulation base material layer, a second epoxy resin composite material layer, a second adhesive layer and a second metal layer which are sequentially stacked, wherein the epoxy resin composite material layers consist of epoxy resin composite material, the epoxy resin composite material comprises carboxyl end group polymer modified epoxy resin, a carbon nano tube and inorganic dispersed material, and the mass percentage of the carbon nano tube in the epoxy resin composite material is 4.6-16%. The invention also provides a manufacturing method of the circuit board substrate.