Circuit board substrate and manufacture method thereof

A technology of circuit boards and board substrates, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of increasing the production cost of circuit boards, poor flexibility of stainless steel sheets, and high prices of stainless steel sheets, so as to prevent ion migration. , reduce production cost, increase the effect of flexural performance

Inactive Publication Date: 2012-03-21
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the weight of the stainless steel sheet is relatively large, thereby increasing the weight of the circuit board product
And the flexibility of the stainless steel sheet is poor, and the electromagnetic shielding layer made of stainless steel sheet affects the flexural performance of the flexible circuit board
Due to the high price of stainless steel sheets, the production cost of the circuit board is increased

Method used

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  • Circuit board substrate and manufacture method thereof
  • Circuit board substrate and manufacture method thereof
  • Circuit board substrate and manufacture method thereof

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Embodiment Construction

[0030] The circuit board substrate provided by the technical solution and the manufacturing method thereof will be further described in detail below in conjunction with the embodiments.

[0031] see figure 1 The first embodiment of the technical solution provides a circuit board substrate 100, which includes a first copper foil layer 110, a first insulating layer 120, an epoxy resin composite material layer 130, a second insulating layer 140 and a second stacked in sequence. Copper foil layer 150 .

[0032] In this embodiment, both the first copper foil layer 110 and the second copper foil layer 150 are copper foils, and the first insulating layer 120 and the second insulating layer 140 are both made of polyimide. The circuit board substrate 100 is composed of a first copper clad laminate 101 including a first copper foil layer 110 and a first insulating layer 120, an epoxy resin composite material layer 130, and a second clad laminate including a second copper foil layer 150...

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Abstract

The invention relates to a circuit board substrate. The circuit board substrate comprises a first copper foil layer, a first insulating layer, an epoxy resin composite material layer, a second insulating layer and a second copper foil layer. The epoxy resin composite material layer is made from an epoxy resin composite material. The epoxy resin composite material comprises carboxyl-terminated polymer modified epoxy resin, carbon nano tubes and inorganic dispersed materials, wherein the mass percentage of the carbon nano tubes in the epoxy resin composite material is 4.6% to 16%, and the epoxy equivalent of the carboxyl-terminated polymer modified epoxy resin is 323 to 352. The invention further provides a manufacture method of the circuit board substrate.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board substrate applied to the production of circuit boards and having an electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.O oki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High densitymultilayer printed circuit board for HITAC M-880, IEEE Trans.onComponents , Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] As the number of layers of circuit board products increases, electromagnetic interference often occurs when the circuit board products are actually working, which affects the signal transmission of the circuit board. In this way, an electromagnetic shielding layer needs to be p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/02H05K3/00C08L63/00C08K13/04C08K7/00C08K3/04
Inventor 何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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