Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

a technology of metal foil and resin, which is applied in the direction of synthetic resin layered products, solid-state devices, metallic pattern materials, etc., can solve the problems of resin compositions with inferior ion migration resistance and insulating reliability, and the demand is concomitantly increasing, so as to achieve excellent insulating reliability, excellent bending resistance, and excellent bending resistance.

Inactive Publication Date: 2011-11-10
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0023]The prepreg, film with a resin, metal foil with a resin and metal-clad laminate according to the invention exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated. A printed wiring board of the invention exhibits excellent bending resistance while also prevents ion migration and has excellent insulating reliability.

Problems solved by technology

Demands are concomitantly increasing for higher densities and smaller sizes for the printed circuit boards (printed wiring boards) mounted in such devices.
However, such resin compositions clearly have inferior ion migration resistance and insulating reliability.

Method used

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  • Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
  • Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
  • Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0079]295 g of tricyclo[5.2.1.02,6]deca-8-yl acrylate (product of Hitachi Chemical Co., Ltd., FA-513AS, see formula (A) below), 288 g of ethyl acrylate (EA), 387 g of n-butyl acrylate (BA) and 30 g of glycidyl methacrylate (GMA) are mixed to obtain monomer mixture A. To the obtained mixture A, 2 g of lauroyl peroxide and 0.16 g of n-octylmercaptane were further dissolved, to obtain monomer mixture B.

[R═H; product name: FA-513AS, R═CH3; product name: FA-513MS]

[0080]Into a 5 L autoclave equipped with a stirrer and condenser there were added 0.04 g of polyvinyl alcohol as a suspending agent and 2000 g of ion-exchanged water, and then monomer mixture B was added while stirring and the mixture was stirred at 250 rpm under a nitrogen atmosphere, at 60° C. for 2 hours, and polymerization was conducted at 100° C. for 1 hour to obtain resin particles (polymerization rate: 99% by weighing). The resin particles were rinsed, dehydrated and dried and then dissolved in methyl isobutyl ketone to a...

examples 2-12 , examples 22-34

Examples 2-12, Examples 22-34 and Comparative Examples 1-3

[0082]Thermosetting resin varnishes were prepared in the same manner as Example 1, except for using monomer mixtures A having the compositional ratios listed in Tables 2-8.

example 13

[0083]A thermosetting resin varnish was prepared in the same manner as Example 1, except that acrylic resin B prepared by the method described below was used instead of acrylic resin A.

In a 1 L-volume flask there were placed 285 g of tricyclo[5.2.1.02,6]deca-8-yl acrylate (FA-513AS, product of Hitachi Chemical Co., Ltd.), 280 g of ethyl acrylate (EA), 385 g of n-butyl acrylate (BA), 50 g of glycidyl methacrylate (GMA), 400 g of methyl isobutyl ketone and 0.1 g of azobisisobutyronitrile, and the components were mixed for 60 minutes under a nitrogen atmosphere. The mixture was then heated at 80° C. for 30 minutes, and polymerization was conducted for 3 hours to synthesize acrylic resin B.

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Abstract

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN / PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

Description

TECHNICAL FIELD[0001]The present invention relates to a prepreg, to a film with a resin, to a metal foil with a resin, to a metal-clad laminate and to a printed wiring board.BACKGROUND ART[0002]Miniaturization and downsizing of electronic devices continue to advance with the increasing rapid diffusion of data terminal electronic devices. Demands are concomitantly increasing for higher densities and smaller sizes for the printed circuit boards (printed wiring boards) mounted in such devices. The increasing functions of electronic devices such as cellular phones are also requiring connection between an ever greater variety of high performance modules or high-density printed circuit boards, including cameras and the like.[0003]Such connecting materials, i.e flexible wiring board materials, must exhibit adhesion, heat resistance, flexibility, electrical insulating properties and long-term reliability. As electronic materials satisfying these demands, there have been used, specifically, ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/03B32B27/00B32B15/08C09D163/00
CPCC08F220/18H05K3/427C08F2220/1891H05K1/0326H01L23/145C08F2220/1808H01L2924/0002H01L2924/00Y10T428/31692Y10T428/31855C08F220/1818C08F220/1804C08F220/1811C08F220/1808C08F220/1812C08F220/1807C08F220/1802C08J5/24C08L33/06H01L23/14H05K1/03C08J2333/06
Inventor KAWAGUCHI, AKIKOTAKANO, NOZOMUMIZUNO, YASUYUKITAKEUCHI, KAZUMASAHAENO, SHIGERUNAGAI, YOSHINORIFUKUI, MASATO
Owner HITACHI CHEM CO LTD
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