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Circuit board substrate and manufacturing method thereof

A manufacturing method and board substrate technology, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of increasing the production cost of circuit boards, poor flexibility of stainless steel sheets, and high prices of stainless steel sheets, so as to prevent ion migration. , reduce production cost, increase the effect of flexural performance

Active Publication Date: 2014-06-25
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the weight of the stainless steel sheet is relatively large, thereby increasing the weight of the circuit board product
And the flexibility of the stainless steel sheet is poor, and the electromagnetic shielding layer made of stainless steel sheet affects the flexural performance of the flexible circuit board
Due to the high price of stainless steel sheets, the production cost of the circuit board is increased

Method used

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  • Circuit board substrate and manufacturing method thereof
  • Circuit board substrate and manufacturing method thereof
  • Circuit board substrate and manufacturing method thereof

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Embodiment Construction

[0031] The circuit board substrate provided by the technical solution and the manufacturing method thereof will be further described in detail below in conjunction with the embodiments.

[0032] see figure 1 , this technical solution provides a circuit board substrate 100, which includes a first metal layer 110, a first adhesive layer 120, a first epoxy resin composite material layer 130, an insulating substrate layer 140, a second epoxy resin layer stacked in sequence. The composite material layer 150 , the second glue layer 160 and the second metal layer 170 .

[0033] The insulating base material layer 140 is used for carrying the first epoxy resin composite material layer 130 and the second epoxy resin composite material layer 150 , and plays a role of electrical insulation. In this embodiment, the insulating base material layer 140 is made of polyimide. The thickness of the insulating substrate layer 140 can be set according to actual needs, and its thickness can be 10 ...

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Abstract

The invention relates to a circuit board substrate, which comprises a first metal layer, a first adhesive layer, a first epoxy resin composite material layer, an insulation base material layer, a second epoxy resin composite material layer, a second adhesive layer and a second metal layer which are sequentially stacked, wherein the epoxy resin composite material layers consist of epoxy resin composite material, the epoxy resin composite material comprises carboxyl end group polymer modified epoxy resin, a carbon nano tube and inorganic dispersed material, and the mass percentage of the carbon nano tube in the epoxy resin composite material is 4.6-16%. The invention also provides a manufacturing method of the circuit board substrate.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board substrate applied to the production of circuit boards and having an electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] As the number of layers of circuit board products increases, electromagnetic interference often occurs when the circuit board products are actually working, which affects the signal transmission of the circuit board. In this way, an electromagnetic shielding layer needs to be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03H05K3/00H05K9/00B32B15/088B32B15/092B32B27/18C08L63/02C08K3/34C08K7/00C08K3/04
Inventor 何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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