Bonding alloy wire and preparation and application thereof

Abstract

The invention relates to a bonding alloy wire and preparation and application thereof, and belongs to the technical field of bonding wire processing. Components of the bonding alloy wire include, by mass, 92%-99% of silver, 0.5%-4% of palladium, 0.1%-2% of copper, 0.1%-2% of gold, gallium with the concentration being 20-200 PPM, cerium with the concentration being 20-200 PPM, platinum with the concentration being 20-200 PPM and lanthanum with the concentration being 20-200 PPM. The bonding alloy wire with the section diameter smaller than or equal to 50 micrometers is prepared after casting and wire drawing. According to the bonding alloy wire, the preparation and the application, a high-purity silver material is used as the base, the alloy elements are added, the bonding wire with a smallelongation fluctuation range is prepared, the abnormal short line frequency is decreased, and the bonding productivity and the device operation ratio are increased. The bonding alloy wire, the preparation and the application are suitable for miniaturization packaging of integrated circuits and large scale integrated circuits and are also suitable for packaging of discrete devices and LEDs. The bonding alloy wire is simple in preparation method and good in practicability.

Description

technical field [0001] The invention relates to a bonding alloy wire and its preparation and application, belonging to the technical field of bonding wire processing. Background technique [0002] Bonding wire for semiconductor packaging is one of the basic materials in the packaging industry. It determines the development level of integrated circuits. The alloy wire required for bonding gold wire needs to have good mechanical strength, good ball forming characteristics, good bonding, easy operation and characteristics of welding. [0003] The traditionally used bonding wire is a microalloyed high-purity gold wire, which is usually made of alkaline earth metals, rare metals, rare earth metals, and transition metals with a total mass fraction of 0.0001%-0.01% and high-purity Au. However, in recent years, the market value of gold It has been soaring all the way, and the price of gold raw materials has increased by 140% in less than ten years, which has increased the heavy raw...

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Problems solved by technology

[0003] The traditionally used bonding wire is a microalloyed high-purity gold wire, which is usually made of alkaline earth metals, rare metals, rare earth metals, and transition metals with a total mass fraction of 0.0001%-0.01% and high-purity Au. However, in recent years, the market value of gold Soaring all the way, the price of gold raw materials has increased by 140% in less than ten years, which has increased the cost of raw materials for manufacturers who use bonded gold wire, and also greatly increased the production and flow costs of bonded gold wire manufacturers

[0004] In terms of research and development, with the entry of advanced semiconductor packaging technology into mainland China, higher requirements have been put forward for mainland bonding gold wire manufacturers. With the continuous reduction of device size, the conventional bonding gold wire has reached its capacity limit, which requires an alloy wire with a thinner diameter and higher strength to adapt to ultra-fine pitch packaging devices, which leads to the bonding wire in During the bonding process or application process, the performance of the wire arc is unstable and prone to abnormal breakage, resulting in low bonding productivity and low equipment utilization rate

[0005] Alloy-type gold wire bonded gold wire, gold and silver can be infinitely dissolved in liquid and solid state, which significantly improves the strength of the bonded gold wire, and has excellent resistance to vibration and breaking. When the bonded gold wire is formed into a ring, the ball neck will not break , the chip will not break due to the soft ball. The existing Chinese patent document CN103194637A discloses a bonding alloy silver wire, silver <90wt%, gold 3.0wt%-10.0wt%, palladium 3.0wt%-8.0wt% The obtained alloy has strong electrical conductivity, certain oxidation resistance, good plasticity, high breaking load and good elongation. However, in the actual bonding process and use process, it is still inevitable to produce more High disconnection frequency

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