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Device convenient for shunting bonding alloy wire reel and using method thereof

A technology for bonding wire and wire reels, applied in packaging and other directions, can solve the problems of limited number of bonding wire reels, large workload of workers, low production efficiency, etc., so as to reduce production costs, avoid potential safety hazards, reduce The effect of workload

Active Publication Date: 2019-10-01
重庆智荟数创科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the production process of bonded gold wire, it is necessary to wind the bonded gold wire on the reel, and then manually arrange and pack the bonded gold wire reel, and manually take the bonded gold wire reel one at a time. Therefore, there are many problems such as heavy workload of workers, potential safety hazards, and low production efficiency.

Method used

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  • Device convenient for shunting bonding alloy wire reel and using method thereof
  • Device convenient for shunting bonding alloy wire reel and using method thereof
  • Device convenient for shunting bonding alloy wire reel and using method thereof

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Embodiment Construction

[0049] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0050] Such as Figure 1-Figure 12 As shown, the device for facilitating the shunting of bonded gold wire reels of the present invention includes a vibrating feeding mechanism 1, a feeding channel 2, a shunting mechanism 3, a dual-channel conveying mechanism 4, a position exchange mechanism 5, a three-dimensional three-dimensional feeding mechanism 6, and a packing Mechanism 7 and supporting mechanism 8;

[0051] The vibrating feeding mechanism 1 is a vibrating plate, and the outlet of the vibrating feeding mechanism 1 is connected with the inlet of the feeding channel 2;

[0052] The diverter mechanism 3 includes a diverter vertical plate 30, a first motor 31, a zigzag frame 32, an upper rack 33, a lower rack 34, a paddle 35, a diverter ho...

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PUM

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Abstract

The invention belongs to the technical field of bonding alloy wire production, and particularly relates to a device convenient for shunting a bonding alloy wire reel and a using method thereof. The device comprises a vibration feeding mechanism, a feeding channel, a shunting mechanism, a double-channel conveying mechanism, a position exchanging mechanism, a three-dimensional material taking mechanism, a boxing mechanism and a supporting mechanism. The method comprises the following steps of: 1, shunting the bonding alloy wire reels; 2, sleeving the bonding alloy wire reels in strings; 3, exchanging the positions of sleeve rods penetrating the bonding alloy wire reels; and 4, carrying out three-dimensional material taking and boxing. According to the device and the method, the workload of workers is greatly reduced, potential safety hazards are avoided, the production efficiency is greatly improved, and the production cost of enterprises is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of bonded gold wire production, and in particular relates to a device for facilitating the splitting of bonded gold wire drums and a method for using the same. Background technique [0002] Bonding is an important step in the production of integrated circuits, an operation that connects circuit chips to lead frames. Bonding gold wire is a fine metal wire inner lead used for electrical connection between the input / output bonding point of the chip circuit and the inner contact point of the lead frame when semiconductor devices and integrated circuits are assembled. Bonding gold wire is one of the five basic materials in the overall IC packaging material market. It is an inner lead material with excellent electrical, thermal conductivity, mechanical properties and excellent chemical stability. It is an important structural material for the manufacture of integrated circuits and discrete devices. Bonding gold w...

Claims

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Application Information

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IPC IPC(8): B65B35/34B65B35/44B65B35/36
CPCB65B35/34B65B35/36B65B35/44
Inventor 黄景新
Owner 重庆智荟数创科技有限公司
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