Imitation gold bonding alloy wire and preparation method thereof

An alloy wire and bonding technology, used in semiconductor/solid-state device parts, electrical solid-state devices, semiconductor devices, etc., can solve the problem of difficulty in further reducing costs, achieve excellent physical and mechanical properties, low raw material costs, Consistent color effect

Active Publication Date: 2014-06-04
浙江佳博科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned patented alloy wire still contains a certain proportion of gold, and its cost is difficult to be further reduced.

Method used

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  • Imitation gold bonding alloy wire and preparation method thereof
  • Imitation gold bonding alloy wire and preparation method thereof
  • Imitation gold bonding alloy wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Prepare bonding alloy wire as follows:

[0042] (1) Step of smelting the base material: add the base material in the following weight percentages into the crucible: 65% silver, 32% copper, 2% indium, and 1% palladium; % silver Ag: 650g, copper Cu with a purity of 99.99%: 320g, indium In with a purity of 99.5%: 20g, palladium Pd with a purity of 99.9%: 10g.

[0043] Put the above base material in a high-frequency furnace. In order to remove oxides, place activated carbon with a purity >99% in the base material to ensure that the activated carbon covers the entire surface of the base material to isolate the base material from contact with air (activated carbon at high temperature , undergoes a displacement reaction with metal oxides, generates carbon dioxide, reduces pure metals, and can remove metal oxides present in raw materials), specifically as figure 1 As shown, the base material 2 is placed in the porcelain crucible 1, and the surface of the base material is compl...

Embodiment 2

[0053] The preparation steps of this example are basically the same as those of Example 1, and the specific formulation of the base material and the adjustment of processing parameters are shown in Table 1 and Table 2.

[0054] In addition, before the bar making step, the step of "heating→refining→natural cooling" for smelting the base metal is repeated once to further improve the uniformity of the components of the base material.

Embodiment 3

[0056] The preparation steps of this example are basically the same as those of Example 1, and the specific formulation of the base material and the adjustment of processing parameters are shown in Table 1 and Table 2.

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PUM

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Abstract

The invention discloses an imitation gold bonding alloy wire and a preparation method thereof. The imitation gold bonding alloy wire comprises 65-80wt% of alloy wire silver, 17-32wt% of copper, 0.5-2wt % of indium and 0.5-1wt% of palladium. A certain proportion of copper, palladium and indium are added on the basis of the silver, so that the cost of the raw materials is extremely low. The imitation gold bonding alloy wire has excellent mechanical performance and can meet the welding technique requirements under conventional conditions, and the manufacturing cost of LED (Light Emitting Diode) and IC (Integrated Circuit) encapsulation can be greatly reduced; meanwhile, the color of the appearance of the imitation gold bonding alloy wire is consistent with the color of 22K-18K gold, and the perfect imitation gold is obtained.

Description

technical field [0001] The invention relates to the field of electronic packaging bonding materials, in particular to a gold-like bonding alloy wire. Background technique [0002] Traditional bonding gold wire is made of gold and other trace metals (calcium, palladium, copper, silver, etc.), and is used in the production of LED and IC packaging. In recent years, with the rapid development of semiconductor and other industries, the integration of integrated circuits has become higher and higher, the electrode plates have become smaller and smaller, the number of electrodes on the device has increased, the electrode spacing has become narrower, and the packaging density has also increased. Getting smaller and smaller, therefore, the need for bonding gold wires is getting bigger and bigger. Traditional bonding gold wire is made of gold, and the price of bonding gold wire is expensive. With the continuous rise of international gold price, the price of bonding gold wire is also ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/08H01L23/49
CPCH01L24/43H01L2224/45139H01L2224/43H01L2224/43848H01L2924/12041H01L2224/4321H01L2224/43986H01L2924/14H01L2224/45144H01L2224/45H01L2924/00011H01L2924/01029H01L2924/01049H01L2924/01046H01L2924/2011H01L2924/20111H01L2924/01079H01L2924/00012H01L2924/013H01L2924/00013H01L2924/00H01L2924/01005
Inventor 薛子夜赵碎孟周钢赵义东
Owner 浙江佳博科技股份有限公司
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