Bi-component epoxide-resin adhesive and preparation method thereof

A technology of epoxy resin and novolac epoxy resin, which is applied in the direction of epoxy resin glue, novolak epoxy resin adhesive, adhesive, etc., can solve the problem of unsatisfactory tensile shear strength, not many adhesives, and curing Complicated process and other issues to achieve the effects of improved tensile shear strength, improved flexibility, and high cross-linking density

Inactive Publication Date: 2009-04-01
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there are many researches on high temperature resistant adhesives in China, but there are not many adhesives that can achieve high connection strength and ideal heat resistance at the same time.
Beijing Institute of Aeronautical Materials Zhao Shenglong, Liu Qingfang and others introduced in the Supplement to Volume 23 of "Journal of Aeronautical Materials" in October 2003 that by mixing high-functionality epoxy resin AG-80 and bisphenol A epoxy resin, using mixed amine A type of curing agent has been made in...

Method used

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  • Bi-component epoxide-resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Calculated by the weight of novolac epoxy resin in units of 100

[0020] A component B component

[0021] Novolak epoxy resin 100 1,4-bis(2,4-diaminophenoxy)benzene 20

[0022] CTBN 12

[0023] Cycloaliphatic epoxy resin 24

[0024] When ready to use, just mix the two components evenly, and its performance test is shown in Table 1. Through thermogravimetric analysis, it is found that the cured product of this adhesive has a thermogravimetric loss of only 1.51% at 200°C.

[0025] from figure 1 It can be seen from the figure that the cured product of Example 1 has good heat resistance, the thermal weight loss at 200°C is only 1.51%, and the thermal weight loss at 300°C is only 4.49%.

Embodiment 2

[0037] Calculated by the weight of novolac epoxy resin in units of 100

[0038] A component B component

[0039] Novolak epoxy resin 100 1,4-bis(2,4-diaminophenoxy)benzene 20

[0040] CTBN 12

[0041] Cycloaliphatic epoxy resin 30

[0042] When ready to use, mix the two components evenly.

Embodiment 3

[0044] Calculated by the weight of novolac epoxy resin in units of 100

[0045] A component B component

[0046] Novolak epoxy resin 100 1,4-bis(2,4-diaminophenoxy)benzene 20

[0047] CTBN 12

[0048] Cycloaliphatic epoxy resin 35

[0049] When ready to use, mix the two components evenly.

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Abstract

The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.

Description

technical field [0001] The invention belongs to the field of preparation of organic adhesives, in particular to a two-component epoxy resin adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is a conductive material formed by uniformly dispersing conductive particles and additives in resin. With the development of the electronics industry, the use of conductive adhesive is becoming wider and wider. With the development of high technology, the heat resistance of conductive adhesives is increasingly demanding (long-term heat resistance above 200°C, instantaneous heat resistance at 250°C), especially in aviation, aerospace, military, electronics, electric power , automobiles, machinery, etc. The conductive adhesive is mainly composed of a resin matrix and conductive particles. The resin matrix endows the conductive adhesive with physical and mechanical properties, so the choice of the resin matrix is ​​very important. Novolac epoxy re...

Claims

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Application Information

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IPC IPC(8): C09J163/04C09J163/00
Inventor 虞鑫海孙欢刘万章杨世玉时佳李超宇王宇
Owner DONGHUA UNIV
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