54results about How to "Small dielectric loss tangent" patented technology

The dielectric-forming composition according to the invention is characterized by consisting of:composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and(B) a resin component constituted of at least one of a polymerizable compound and a polymer.In addition, another dielectric-forming composition according to the invention is characterized by containing:ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 μm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); andinorganic particles with the average particle size of 0.1 to 2 μm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

The present invention provides a resin composition comprising a liquid crystal polymer and a filler comprising a composite oxide containing Ba, Sm, and Ti. The resin composition can provide a molded article which has excellent dielectric characteristics and is excellent in dimension stability.

In the present invention, a triazine ring-containing phenolic resin, which is obtained by reacting melamine, a para-alkylphenol, and formalin, is used in order to provide an epoxy resin composition which imparts a cured product with excellent flame retardancy, exhibits excellent dielectric properties such as low dielectric loss tangent and low dielectric constant, and also exhibits excellent thermal conductivity, a cured product of the epoxy resin composition, and the following which use the expoxy resin composition: a prepreg; a circuit board; a build-up film; a build-up substrate; a semiconductor sealing material; a semiconductor device; a fiber-reinforced composite material; a molded article; and the like.

The invention discloses a composite microwave dielectric material. The composite microwave dielectric material is prepared from the following components in parts by weight: 25 to 35 parts of a fluorine-containing polymer and 20 to 70 parts of microwave dielectric ceramic powder. According to the composite microwave dielectric material, fluororesin is adopted as a carrier material and blended with the microwave dielectric ceramic powder, and the dielectric loss angle tangent of a composite material and a high-frequency circuit substrate can be reduced; a radiation crosslinking technology is adopted to perform crosslinking processing on the fluorine-containing polymer to further reduce the coefficient of thermal expansion of the material; the expansion factor of a printed circuit board base material is close to the expansion factor of hole copper; the circuit fault problem in the process of use are avoided; and the irradiation crosslinking also improves the mechanical performance of the printed circuit board base material.

A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.

Provided is a glass fiber-reinforced resin molded article having a low dielectric constant and a low dielectric loss tangent, especially a low dielectric loss tangent, in the high-frequency region of 10 GHz and above. The glass fiber-reinforced resin molded article contains glass fibers in a range of 10-90 mass% and resin in a range of 90-10 mass% relative to the total weight of the glass fiber-reinforced resin molded article. The glass fibers have a composition that includes SiO2 in a range of 52.0-59.5 mass%, B2O3 in a range of 17.5-25.5 mass%, Al2O3 in a range of 9.0-14.0 mass%, SrO in a range of 0.5-6.0 mass%, MgO in a range of 1.0-5.0 mass%, CaO in a range of 1.0-5.0 mass%, and a total of F2 and Cl2 in a range of 0.1-2.5 mass% relative to the total weight of the glass fibers. The glass fibers have a number average fiber length of 1-10,000 [mu]m.

The present invention provides a substrate having excellent adhesive strength to substrate materials such as metal foil and polyimide contained in the wiring of a printed circuit board, and has dielectric properties in a high-frequency region, specifically, a frequency of 1 to 100 GHz. A thermosetting film exhibiting a low dielectric constant (ε) and a low dielectric loss tangent (tanδ) in the region, and a resin composition used for producing the thermosetting film. The resin combination includes (A) an epoxy resin, (B) a resin having a dielectric loss tangent (tanδ) of less than 0.005 in the frequency range of 1 to 100 GHz, and (C) a carbon atom number in the 1-position of a heterocyclic ring. An imidazole compound having a side chain of an alkyl group having 5 or more.