51results about How to "Small dielectric loss tangent" patented technology

The present invention relates to a polyimide resin composition including an organic thiol compound and a thermoplastic polyimide resin, a polymeric film containing the polyimide resin, a laminate including the same, and a printed circuit board. By using the polyimide resin composition, it is possible to form an electroless plating film having high adhesive strength even under high-temperature, high-humidity conditions in spite of the fact that the surface roughness of the insulating layer is extremely low. Furthermore, by using the polymeric film and a laminate including the polymeric film and a metal layer, it is possible to obtain a printed circuit board capable of forming high-density circuit and having excellent adhesiveness, and excellent adhesion reliability in a high-temperature, high-humidity environment.

A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.

The invention discloses a composite microwave dielectric material. The composite microwave dielectric material is prepared from the following components in parts by weight: 25 to 35 parts of a fluorine-containing polymer and 20 to 70 parts of microwave dielectric ceramic powder. According to the composite microwave dielectric material, fluororesin is adopted as a carrier material and blended with the microwave dielectric ceramic powder, and the dielectric loss angle tangent of a composite material and a high-frequency circuit substrate can be reduced; a radiation crosslinking technology is adopted to perform crosslinking processing on the fluorine-containing polymer to further reduce the coefficient of thermal expansion of the material; the expansion factor of a printed circuit board base material is close to the expansion factor of hole copper; the circuit fault problem in the process of use are avoided; and the irradiation crosslinking also improves the mechanical performance of the printed circuit board base material.

The present invention provides a non-aqueous dispersion of a fluorine-based resin, a thermosetting resin composition containing the fluorine-based resin using the same, a polyimide precursor solution composition and the like, which have a particle diameter, and excellent preservation stability, can be mixed with a resin material such as a thermosetting resin composition, and can inhibit a decrease in adhesion strength and adhesive strength while achieving a low dielectric constant and a low dielectric tangent to be suitably used for applications such as an insulating layer of a printed wiring board, an adhesive for a circuit board, a laminate for a circuit board, a coverlay film, a prepreg, and the like. The nonaqueous dispersion of a fluorine-based resin comprises a micropowder of at least a fluorine-based resin, urethane fine particles, a fluorine-based additive containing at least a fluorine group and a lipophilic group, and a non-aqueous solvent.

It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

Provided are: a thermosetting film which has excellent bonding strength to a metal foil contained in wiring lines of a printed wiring board and a substrate material such as a polyimide, while exhibiting dielectric characteristics in a high frequency region, specifically, a low dielectric constant (epsilon) and a low dielectric loss tangent (tan(delta)) in a frequency region of 1-100 GHz; and a resin composition which is used for the production of this thermosetting film. A resin composition which contains (A) an epoxy resin, (B) a resin that has a dielectric loss tangent (tan(delta)) of less than 0.005 in a frequency region of 1-100 GHz and (C) an imidazole compound wherein a side chain having an alkyl group with 5 or more carbon atoms is present at the 1-position of a heterocyclic ring.

The invention relates to a polytetrafluoroethylene oil-based solvent type dispersion, an epoxy resin composition containing polytetrafluoroethylene and a cured material thereof. In the invention, the polytetrafluoroethylene oil-based solvent type dispersion is used to provide a PTFE oil-based solvent type dispersion having a micro particle size, low viscosity and excellent stability in storage. The polytetrafluoroethylene oil-based solvent type dispersion is characterized by comprising polytetrafluoroethylene having the specific surface area of less than 15m<2>/g and a fluorine type additive being 0.1-50wt% relative to the quality of the polytetrafluoroethylene and at least containing a fluorine-contained group and a lipophilic group. The epoxy resin composition containing the polytetrafluoroethylene oil-based solvent type dispersion having excellent dispersity is used to provide an epoxy resin composition containing the polytetrafluoroethylene and being suitable for an electronic substrate material, an insulation material, a bonding material and the like having a low relative dielectric constant and a low dielectric loss angle tangent, and a cured material thereof.

The present invention is a low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz. An object is to provide: a silica powder with an extremely small dielectric loss tangent; a resin composition containing the same; and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin.

The invention relates to the field of insulation materials, in particular to a silane crosslinked polyethylene insulation material for electric wires and cables. A method for preparing the silane crosslinked polyethylene insulation material for electric wires and cables by a two-step way mainly comprises two steps of 1, preparation of a catalyst master batch; 2, preparation of a finished product. The insulation material is prepared from the following components of LLDPE (linear low density polyethylene)-7042, LDPE (low density polyethylene), a silane coupling agent, a crosslinking agent DCP, an antioxidant 300 and the catalyst master batch; the catalyst master batch comprises the following components of LLDPE-7042, LLDPE-8320, PP (polypropylene), an antioxidant DLTP, an antioxidant 1024, organic tin and a fluororubber master batch. The insulation material has the advantages that the insulation material is mainly used for insulation layers of cables, and is mainly used for replacing the existing PVC (polyvinyl chloride) material; the insulation property is better than the insulation property of PVC, and the poisonous and harmful gas will be released by the PVC when the electric wire is aged and catches a fire, but the silane insulation material has no poison and harm.

The invention relates to the field of insulation materials, in particular to a silane cross-linked polyethylene insulation material for 10 kV and below black wires and cables, and a preparation method thereof. The insulation material is prepared by the following components in percentage by weight: LLDPE-7042, LLDPE-8320, LDPE, EVA, PP, a silane coupling agent, a crosslinking agent DCP, an antioxidant 300, an antioxidant 1010, an antioxidant DLTP, an antioxidant 1024, organic tin, a fluorine rubber masterbatch and a black masterbatch. The material is mainly used in an insulation layer of the cable to replace the current main PVC materials, and is better than PVC in insulation property, PVC emits toxic and harmful gases when the wires fire due to aging, and the silane insulation material is non-toxic and harmless.

A resin composition including a thermoplastic resin and/or a thermosetting resin, and a glass component dispersed in the thermoplastic resin and/or the thermosetting resin, when a residue after ashing of the resin composition is subjected to an ICP analysis, a calcium content in the resin composition is 0% to 27% by mass with respect to 100% by mass of a metal content in the resin composition and a calcium content in the glass component is 0% to 27% by mass with respect to 100% by mass of the metal content in the glass component.

The invention relates to the field of insulating materials, particularly a silver gray silane crosslinked polyethylene insulating material for wires and cables. The method for preparing a silver gray silane crosslinked polyethylene insulating material for wires and cables by a one-step process mainly comprises the following two steps: 1. preparing a catalyst master batch; and 2. preparing the finished product. The insulating material is prepared from LLDPE-7042 (linear low-density polyethylene 7042), LDPE (low-density polyethylene), a silane coupling agent, a crosslinking agent DCP, an antioxidant 300 and the catalyst master batch. The catalyst master batch is composed of LLDPE-7042, LLDPE-8320, PP (polypropylene), an antioxidant 1010, an antioxidant DLTP (dilauryl thiodipropionate), an antioxidant 1024, organic tin, a fluororubber master batch, a silver gray master batch and an ultraviolet absorbent. The material is mainly used as an insulation layer of the cable to mainly substitute the existing PVC (polyvinyl chloride) material, and has better insulating properties than PVC. The PVC can emit toxic harmful gas when the wire is aged or catches fire, but the silane insulating material does not have toxicity or harm.