Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using same and the cured product thereof polyimide precursor solution composition

Abstract

The present invention provides a non-aqueous dispersion of a fluorine-based resin, a thermosetting resin composition containing the fluorine-based resin using the same, a polyimide precursor solution composition and the like, which have a particle diameter, and excellent preservation stability, can be mixed with a resin material such as a thermosetting resin composition, and can inhibit a decrease in adhesion strength and adhesive strength while achieving a low dielectric constant and a low dielectric tangent to be suitably used for applications such as an insulating layer of a printed wiring board, an adhesive for a circuit board, a laminate for a circuit board, a coverlay film, a prepreg, and the like. The nonaqueous dispersion of a fluorine-based resin comprises a micropowder of at least a fluorine-based resin, urethane fine particles, a fluorine-based additive containing at least a fluorine group and a lipophilic group, and a non-aqueous solvent.

Description

Technical field [0001] The present invention relates to a non-aqueous dispersion of a fluorine resin having a fine particle size, low viscosity, and excellent storage stability, a thermosetting resin composition of a fluorine-containing resin using the same, a cured product thereof, and a polyimide precursor solution combination Things etc. Background technique [0002] In recent years, with the advancement of high-speed, high-functionality, etc. of electronic equipment, there is a demand for an increase in communication speed. Among them, low dielectric constant and low dielectric loss tangent of various electronic equipment materials are required, and low dielectric constant and low dielectric loss tangent of thermosetting resins that can be used in insulating materials and substrate materials are also required. Wait. [0003] As a material with low dielectric constant and low dielectric loss tangent, polytetrafluoroethylene (PTFE, relative dielectric constant 2.1), which has t...

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Problems solved by technology

[0033] However, the colored polyimide materials such as the colored polyimide films described in the above-mentioned Patent Documents 9 to 14 have the following problems: when colored with coloring materials such as organic pigments and inorganic pigments, the color of the cover film and the flexible printed circuit board is affected. Electrical properties (relative permittivity, dielectric loss tangent) and insulation are affected

[0034] In particular, when carbon black is used for black coloring, not only the insulation property is lowered, but also the relative permittivity and dielectric loss tangent are deteriorated, so there are problems such as being unsuitable for applications such as high-speed communication and high-speed processing.

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