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Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using same and the cured product thereof polyimide precursor solution composition

A fluorine-based resin and dispersion technology, used in epoxy resin coatings, coatings, etc., can solve the influence of cover film, flexible printed circuit board electrical characteristics insulation, relative dielectric constant, dielectric loss angle deterioration, unsuitable for High-speed communication, high-speed processing, etc., to achieve the effects of excellent storage stability, low dielectric constant, and high insulation

Active Publication Date: 2017-12-05
MITSUBISHI PENCIL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0033] However, the colored polyimide materials such as the colored polyimide films described in the above-mentioned Patent Documents 9 to 14 have the following problems: when colored with coloring materials such as organic pigments and inorganic pigments, the color of the cover film and the flexible printed circuit board is affected. Electrical properties (relative permittivity, dielectric loss tangent) and insulation are affected
[0034] In particular, when carbon black is used for black coloring, not only the insulation property is lowered, but also the relative permittivity and dielectric loss tangent are deteriorated, so there are problems such as being unsuitable for applications such as high-speed communication and high-speed processing.

Method used

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  • Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using same and the cured product thereof polyimide precursor solution composition
  • Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using same and the cured product thereof polyimide precursor solution composition
  • Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using same and the cured product thereof polyimide precursor solution composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、2 and comparative example 1～3

[0412] [Examples 1, 2 and Comparative Examples 1 to 3: Preparation of thermosetting resin composition of fluorine-containing resin]

[0413] Using the obtained dispersions 1 to 4, a thermosetting resin composition of a fluorine-containing resin was prepared with the compounding recipe shown in Table 3 below. In addition, as a composition containing only the resin to which the PTFE dispersion was not added, Comparative Example 3 was produced.

[0414] After mixing at the compounding ratios shown in Examples 1 and 2 and Comparative Examples 1 to 3, using a disperser, the PTFE dispersion and the resin were stirred to be uniformly mixed to obtain a thermosetting resin composition containing a fluorine resin .

[0415] Here, any compounding of Examples 1, 2, and Comparative Examples 1 and 2 showed a very uniform state, and no PTFE aggregates or the like were observed.

[0416] [table 3]

[0417] (Parts by mass)

[0418]

Embodiment 3、4 and comparative example 4～6

[0419] [Examples 3 and 4 and Comparative Examples 4 to 6: Preparation of cured thermosetting resin of fluorine-containing resin]

[0420] Using a coater, the thermosetting resin composition of the fluorine-containing resin obtained in Examples 1, 2, and Comparative Examples 1 to 3 was applied to the polyamide so that the thickness after drying became about 25 μm and became a uniform thickness. The entire surface of one side of the imine film (thickness: 25 μm) was dried at about 120° C. for about 10 minutes, and then heated at 180° C. for 60 minutes to be cured, thereby preparing a sample for relative permittivity evaluation.

[0421] [Evaluation of relative permittivity]

[0422] The relative dielectric constant was measured at 1 GHz using an impedance analyzer (Impedence Analyzer) in accordance with the test standard of JIS C6481-1996.

[0423] 〔Evaluation of adhesion strength〕

[0424] On the roughened surface of a copper foil (thickness 18 μm) that was roughened on one side, a siev...

Embodiment 5、6 and comparative example 7～9

[0443] [Examples 5 and 6 and Comparative Examples 7-9: Preparation of thermosetting resin composition of fluorine-containing resin]

[0444] Using the obtained dispersions 5 to 8, a fluorine-containing resin thermosetting resin composition was prepared with the compounding recipe shown in Table 7 below. In addition, as a composition containing only the resin to which the PTFE dispersion was not added, Comparative Example 9 was produced.

[0445] After mixing at the compounding ratios shown in Examples 5 and 6 and Comparative Examples 7-9, using a disperser, stir the PTFE dispersion and the resin to make them uniformly mixed to obtain a thermosetting resin composition containing a fluorine resin .

[0446] Here, the compounding of Examples 5 and 6 and Comparative Examples 7 and 8 all showed a very uniform state, and no PTFE aggregates or the like were observed.

[0447] [Table 7]

[0448] (Parts by mass)

[0449]

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Abstract

The present invention provides a non-aqueous dispersion of a fluorine-based resin, a thermosetting resin composition containing the fluorine-based resin using the same, a polyimide precursor solution composition and the like, which have a particle diameter, and excellent preservation stability, can be mixed with a resin material such as a thermosetting resin composition, and can inhibit a decrease in adhesion strength and adhesive strength while achieving a low dielectric constant and a low dielectric tangent to be suitably used for applications such as an insulating layer of a printed wiring board, an adhesive for a circuit board, a laminate for a circuit board, a coverlay film, a prepreg, and the like. The nonaqueous dispersion of a fluorine-based resin comprises a micropowder of at least a fluorine-based resin, urethane fine particles, a fluorine-based additive containing at least a fluorine group and a lipophilic group, and a non-aqueous solvent.

Description

Technical field [0001] The present invention relates to a non-aqueous dispersion of a fluorine resin having a fine particle size, low viscosity, and excellent storage stability, a thermosetting resin composition of a fluorine-containing resin using the same, a cured product thereof, and a polyimide precursor solution combination Things etc. Background technique [0002] In recent years, with the advancement of high-speed, high-functionality, etc. of electronic equipment, there is a demand for an increase in communication speed. Among them, low dielectric constant and low dielectric loss tangent of various electronic equipment materials are required, and low dielectric constant and low dielectric loss tangent of thermosetting resins that can be used in insulating materials and substrate materials are also required. Wait. [0003] As a material with low dielectric constant and low dielectric loss tangent, polytetrafluoroethylene (PTFE, relative dielectric constant 2.1), which has t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D127/18C09D5/25C09D7/12C08J7/04C08L79/08
CPCC09D163/00C09D5/00C08L2205/035C09D179/08C09D7/65C08L27/18C08L29/14C08L53/02C08J3/09C08L27/12C08L75/04C08L63/00C08L67/00C08L79/08C08L2203/206C08L2201/56
Inventor 佐藤厚志阿部宽史阪上正史铃木孝典
Owner MITSUBISHI PENCIL CO LTD
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