262 results about "TVEX-PHOR resin" patented technology

Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.

A biodegradable resin composition and an object molded or formed from the composition. The resin composition comprises: 100 parts by weight of a biodegradable polyester resin comprising not smaller than 50% by weight of polylactic acid having a melting point of not lower than 160° C., the biodegradable polyester resin having a melt flow rate of 0.1 to 50 g/10 min as measured under a load of 21.2 N at 190° C.; and 0.1 to 20 parts by weight of a phyllosilicate containing a primary, secondary or tertiary amine salt, a quaternary ammonium salt or a phosphonium salt ionically bonded between layers thereof.

An anhydride and resorcinol latent catalyst system for a phenolic resole resin provides a resin having long pot life and long shelf life, yet cures quickly thereafter.

A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.01% to 10% of processing aids, which resin composition has excellent thermal conductivity, heat resistance and flame retardancy as well as being environmentally friendly for free of halogen flame retardant and no toxic or corrosive gases when burning; the resin composition is used to form as a high thermal-conductive prepreg by impregnation or form as a high thermal-conductive coating by coating and then further used as a dielectric layer on a printed circuit board for demonstrating if electronic components formed thereon the printed circuit board has high thermal-conductivity and efficient heat dissipation capable of improving long service life and enhanced stability of electronic components.

Modified epoxy resins comprising the reaction product of a cycloaliphatic, polycyclic and/or aromatic biomass derived compound and an epoxy resin are disclosed. Aqueous dispersions and coatings comprising these reaction products are also disclosed.

A low-molecular-weight polyester resin which can elasticize a resin suitably and can be used for various purposes, various resins obtained by using the resin, and the purposes thereof. The polyester resin is obtained by polymerizing a monomer composition containing 10 to 90 weight % of a linear dicarboxylic acid and/or diol having at least 8 carbon atoms (I), 5 to 80 weight % of a branched dicarboxylic acid and/or diol having at least 4 carbon atoms (II-1) and/or 2 to 40 weight % of at least one polyfunctional monomer (II-2) selected from the group consisting of polyols, polycarboxylic acids and hydroxycarboxylic acids having 3 or more functional groups respectively and which has the number average molecular weight of 500 to 5000 and is amorphous.

The present invention provides a polyvinyl acetal resin composition exerting excellent mechanical strength over a wide temperature range from low temperatures to high temperatures. The present invention provides a polyvinyl acetal resin composition containing a polyvinyl acetal resin and a resin having a crosslinked structure, the polyvinyl acetal resin composition having a structure in which the resin having a crosslinked structure is dispersed as a dispersed phase in the polyvinyl acetal resin as a continuous phase, the polyvinyl acetal resin composition having a maximum value of a loss tangent derived from the polyvinyl acetal resin at 40° C. or higher and a maximum value of a loss tangent derived from the resin having a crosslinked structure at 10° C. or lower in measurement of a dynamic viscoelasticity spectrum at a frequency of 10 Hz.

Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer.

A conductive composition comprising a vapor grown carbon fiber having an aspect ratio of 40 to 1,000, preferably 65 to 1,000, and a specific surface area or fiber diameter of the fiber within a predetermined range, and a preferable peak intensity ratio (I₀=I₁₃₆₀/I₁₅₈₀) of 0.1 to 1, wherein I₁₅₈₀ represents a peak height at 1,580 cm⁻¹ and I₁₃₆₀ represents a peak height at 1,360 cm⁻¹ in a Raman scattering spectrum; and a resin composition containing the composition; and a production method thereof. The present invention provides: i) a composition which exhibits stable conductivity and less deterioration in physical properties during any molding methods in a conductive plastic in which a conductive filler is dispersed in a polymer; ii) a composite material composition for precision molding which enables production of a molded product with low warpage and is excellent in mechanical properties and performance during the injection molding; and iii) a sliding member composition which exhibits durability under high temperature and heavy load and has a low friction coefficient.

A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.

The present invention provides a method for producing a resin composition, which, by means of simple steps, can uniformly disperse microfibrillated plant fiber in a highly hydrophobic resin and can impart enhanced mechanical strength to a molding material obtained by molding the resin composition. The present invention further provides a resin composition having excellent heat resistance and low linear thermal expansion. The present invention relates to a method for producing a resin composition, the method including a step of mixing a thermoplastic resin or thermosetting resin (A), and modified plant fiber (b) or modified microfibrillated plant fiber (B), in the presence of an organic liquid (C), the modified plant fiber (b) or modified microfibrillated plant fiber (B) being obtained by modification with an alkyl or alkenyl succinic anhydride in a liquid capable of swelling microfibrillated plant fiber (B′) or plant fiber (b).

A reactive liquid ceramic binder suitable for the production of ceramic products from ceramic powders is provided. The reactive liquid ceramic binder contains organo-modified siloxane compounds, wherein the liquid organo-modified siloxane compounds contain organoalkoxysiloxane units according to general formula (I)

wherein

• • R¹=alkyl radical and/or aryl radical,
  • R²═H and/or alkyl radical with 1 to 4 carbon atoms,
  • a≧0 and ≦2, and
  • b<0 and ≦3,

with the proviso that a+b≧1 and ≦4.

The present invention relates to a process for preparing a water absorbent resin, particularly to a process for preparing a water absorbent resin which can resolve the uneven size of the fine pulverized gel-type resin and long pulverizing time those are the problems of prior process for preparing the water absorbent resin, by carrying out the pulverizing process of the gel-type resin divided into the coarse pulverizing process which is carried out with the internal cross-linking polymerization, and the fine pulverizing process. According to the preparation process, it is possible to mass-produce the water absorbent resin showing excellent absorption under pressure and low extractable content.

A diamine polymer comprising a repeat unit represented by the following formula (I) in which diamine is linked to form a triaza ring;

wherein R represents a monoamine residue.

An object of the present invention is to provide a technology of dispersing cellulose readily in a hydrophobic substance such as a resin by treating cellulose being a hydrophilic substance in a system that contains water as a main medium with a polymer dispersant, which has been developed for dispersing a fine and hydrophobic substance such as a pigment, in a simple and efficient manner without conducting surface modification of nanocellulose or other treatments. The object is solved by a process for producing a readily dispersible cellulose composition, the process including dissolving a polymer dispersant having a block copolymer structure having a resin-affinitive segment A and a cellulose-adsorptive segment B in a hydrophilic organic solvent solution, adding a surface active agent to the resultant solution, thereafter adding water to the resultant mixture to prepare an aqueous dispersion treatment agent containing the polymer dispersant, and adding the obtained aqueous dispersion treatment agent to cellulose in a water-containing state or in a dry state, thereby obtaining a readily dispersible cellulose composition. The object is also solved by a process for producing an aqueous dispersion treatment agent for use in the process for producing a readily dispersible cellulose composition, the readily dispersible cellulose composition, and a cellulose-dispersed resin composition using the readily dispersible cellulose composition.

Polyethylene compositions having improved printability are provided. The compositions which are comprised of a polyethylene base resin, polyethylene glycol and polyethylene modified with carboxylic acid or carboxylic acid derivative functionality are melt blended under conditions of mixing and shear to increase their melt elasticity.

Provided are a modified polyvinyl alcohol-based resin with an acrylic group introduced thereto and including a hydroxyl group formed during the introduction of the acrylic group, an adhesive including the modified polyvinyl alcohol-based resin having excellent adhesion, humidity resistance, and water resistance, an adhesive including a polyvinyl alcohol-based resin, and a compound having an epoxy group, and an acrylic group, a polarizing plate and an image display device including the adhesive. The adhesive for a polarizing plate according to an embodiment of the present invention has excellent adhesion, humidity resistance, and water resistance as well as having excellent solubility with respect to water and an increase in adhesion while physical properties of a typical polyvinyl alcohol-based resin are maintained.