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43results about How to "Stable preparation" patented technology

Nonaqueous pressure-sensitive adhesive for medicinal tape preparation for percutaneous absorption, medicinal tape preparation for percutaneous absorption, and process for producing the same

InactiveUS20090274748A1Excellent adhesive and cohesive strengthNot irritatedSurgical adhesivesPlastersMeth-Metal chelate
A nonaqueous pressure-sensitive adhesive for a medicinal tape preparation for percutaneous absorption comprising (a) a support, (b) a pressure-sensitive adhesive layer containing a drug and a nonaqueous pressure-sensitive adhesive and (c) a release film laminated in that order, and a medicinal tape preparation for percutaneous absorption comprising the adhesive. The nonaqueous pressure-sensitive adhesive may comprise a copolymer obtained by copolymerization of a (meth)acrylic monomer having an acetoacetyl group in the molecule and one or more monomers from among other (meth)acrylic monomers without acetoacetyl groups and copolymerizable vinyl monomers, in a nonaqueous solvent. Suitable (meth)acrylic monomers having an acetoacetyl group in the molecule are acetoacetoxyalkyl methacrylates, and especially 2-acetoacetoxyethyl methacrylate. The copolymer nonaqueous pressure-sensitive adhesive of the invention, comprising a (meth)acrylic monomer having an acetoacetyl group as a constituent monomer, is capable of containing large amounts of lipophilic oily substances in the pressure-sensitive adhesive layer, and during heat drying, the acetoacetyl groups undergo self-crosslinking to form a network structure as the solvent evaporates off, so that large amounts of oily substances such as the plasticizer can be included in the network structure. The pressure-sensitive adhesive of the invention uses no polyamine derivatives, isocyanate compounds, polyvalent metal chelate compounds, etc., as crosslinking agents, and therefore toxicity is not a concern and skin is not irritated. A medicinal tape preparation for percutaneous absorption of the invention has superior adhesive strength and cohesive strength, and is highly safe with low skin irritation. It also has excellent drug release and percutaneous absorption properties.
Owner:NIPRO PATCH

Preparation equipment and preparation method of solid electrolyte membrane

The invention discloses preparation equipment and a preparation method of a solid electrolyte membrane. The preparation equipment of the solid electrolyte membrane comprises a plurality of rotary spray heads and a baking device, the rotary spray heads pressurize solid electrolyte and then spray the solid electrolyte on a base material, the baking device dries the base material sprayed with the solid electrolyte, and thus the solid electrolyte membrane is formed. The rotary spray heads adopt a rotary spraying process to pressurize solid electrolyte and then spray the solid electrolyte on the base material, and the solid electrolyte can be effectively, uniformly and controllably coated on the base material, so that the solid electrolyte membrane based on the base material is efficiently andstably prepared, and the process problem of large-scale preparation of the solid electrolyte membrane can be effectively solved based on the scheme; the base material plays a role in supporting a framework in the solid electrolyte membrane, so that the mechanical strength of the prepared solid electrolyte membrane is remarkably improved, the performance is excellent, and subsequent battery cell assembly is facilitated; and the membrane thickness of the solid electrolyte membrane is precisely controllable.
Owner:GAC AION NEW ENERGY AUTOMOBILE CO LTD

Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board

The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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