Nonaqueous dispersion of fluorine-based resin heat cure resin composition containing fluorine-based resin using same and cured product thereof polyimide precursor solution composition

Abstract

Provided are a non-aqueous dispersion of a fluorine-based resin, a heat-curable resin composition containing a fluorine-based resin using the same, a polyimide precursor solution composition, and the like, wherein the non-aqueous dispersion of the fluorine-based resin is suitable for use in an insulating layer of a printed wiring board, an adhesive for a circuit substrate, a laminate for a circuit board, a coverlay film, and prepreg, which has a minute particle diameter, low viscosity, and excellent storage stability, can be properly mixed with a resin material such as a heat-curable resin composition or the like, and can suppress the degradation of adhesion strength and bonding strength while achieving a low dielectric constant and a low dielectric tangent. The non-aqueous dispersion of the fluorine-based resin at least contains micro-powder of a fluorine-based resin, a urethane particle, a compound represented by the following formula (I), and a non-aqueous solvent. Formula (I) [l, m, and n are positive integers.

Description

technical field [0001] The present invention relates to a non-aqueous dispersion of a fluorine-based resin having a fine particle size, low viscosity, and excellent storage stability, a thermally curable resin composition of a fluorine-containing resin using the same, a cured product thereof, and a polyimide precursor solution combination things etc. Background technique [0002] In recent years, along with the advancement of high-speed electronic equipment, high-function, etc., high-speed communication speed and the like are required. Among them, low dielectric constant and low dielectric loss tangent are required for various electronic equipment materials, and low dielectric constant and low dielectric loss tangent are also required for thermosetting resins that can be used in insulating materials and substrate materials. Wait. [0003] Polytetrafluoroethylene (PTFE, relative permittivity 2.1) has attracted attention as a material with low dielectric constant and low die...

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Problems solved by technology

[0033] However, the colored polyimide materials such as the colored polyimide films described in the above-mentioned Patent Documents 9 to 14 have the following problems: when colored with coloring materials such as organic pigments and inorganic pigments, the color of the cover film and the flexible printed circuit board is affected. Electrical properties (relative permittivity, dielectric loss tangent) and insulation are affected

[0034] In particular, when carbon black is used for black coloring, not only the insulation property is lowered, but also the relative permittivity and dielectric loss tangent are deteriorated, so there are problems such as being unsuitable for applications such as high-speed communication and high-speed processing.

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